公开(公告)号：US20140004324A1

公开(公告)日：2014-01-02

申请号：US13679777

申请日：2012-11-16

Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN)

Inventor： CHEN-YU HSIEH ,  CHANG-YUAN LI

IPC: C08L71/12 ,  B32B3/10 ,  C08L79/00 ,  B32B15/08 ,  C08L25/08 ,  C08L57/00

CPC classification number: C08L71/123 ,  B32B3/10 ,  B32B15/08 ,  B82Y30/00 ,  C08L25/08 ,  C08L57/00 ,  C08L71/126 ,  C08L79/00 ,  C08L79/02 ,  C08L79/04 ,  H05K1/024 ,  H05K1/0346 ,  H05K1/0353 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/31692 ,  C08L23/00

Abstract: A resin composition includes (A) 100 parts by weight of poly(phenylene oxide) resin with styrene end group; (B) 5 to 75 parts by weight of olefin copolymer; and (C) 1 to 150 parts by weight of cyanate resin with poly(phenylene oxide) functional group. The resin composition is characterized by specific composition and proportion conducive to achieving a low dielectric constant, a low dielectric loss, and a high thermal tolerance and preparing a prepreg or a resin film, thereby being applicable to copper-clad laminates and printed circuit boards.

Abstract translation: 树脂组合物包含（A）100重量份的具有苯乙烯端基的聚苯醚树脂; （B）5〜75重量份的烯烃共聚物; 和（C）1〜150重量份具有聚（苯醚）官能团的氰酸酯树脂。 树脂组合物的特征在于具有有助于实现低介电常数，低介电损耗和高耐热性的特定组成和比例，并且制备预浸料或树脂膜，从而可应用于覆铜层压板和印刷电路板。

公开(公告)号：US08568891B2

公开(公告)日：2013-10-29

申请号：US13463541

申请日：2012-05-03

Applicant: Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

Inventor： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

IPC: B32B15/08

CPC classification number: H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract translation: 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有1,2-乙烯基和（C）交联剂，处于相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US08551628B2

公开(公告)日：2013-10-08

申请号：US12267198

申请日：2008-11-07

Applicant: Min She Su

Inventor： Min She Su

IPC: B32B5/02 ,  B32B27/04 ,  B32B27/12

CPC classification number: H05K1/0373 ,  H05K1/032 ,  H05K1/0366 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10T428/24355 ,  Y10T442/2418 ,  Y10T442/2475 ,  Y10T442/2992 ,  Y10T442/3594

Abstract: A composite material, a high-frequency circuit substrate made from the composite material, and a method of making the high-frequency circuit substrate. The composite material includes: a thermosetting composition including a butadiene styrene copolymer resin with a molecular weight less than 11,000 containing more than 60 percent of vinyl, a polybutadiene resin with polarity groups containing more than 60 percent vinyl, and a maleic anhydride grafted polybutadiene styrene copolymer with a molecular weight of more than 50,000; a fiberglass cloth; a powder filler; and a cure initiator. The composite material permits easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for the processing operation. The composite material is suitable for making the circuit substrate.

Abstract translation: 复合材料，由复合材料制成的高频电路基板以及制造高频电路基板的方法。 复合材料包括：热固性组合物，其包含分子量小于11,000的丁二烯苯乙烯共聚物树脂，其含有60％以上的乙烯基，极性基团含有大于60％的乙烯基的聚丁二烯树脂和马来酸酐接枝的聚丁二烯苯乙烯共聚物 分子量超过50,000; 玻璃纤维布; 粉末填料; 和固化引发剂。 复合材料允许容易地制造预浸料和铜箔的高粘结。 由复合材料制成的高频电路基板具有低介电常数，低介电损耗角正切和优异的耐热性，并且便于加工操作。 复合材料适用于制造电路基板。

公开(公告)号：US08519273B2

公开(公告)日：2013-08-27

申请号：US12937018

申请日：2009-02-13

Applicant: Sankar Paul ,  Dirk M. Baars

Inventor： Sankar Paul ,  Dirk M. Baars

IPC: H05K1/00

CPC classification number: H05K1/0373 ,  B32B7/12 ,  B32B15/06 ,  B32B15/08 ,  B32B15/085 ,  B32B15/20 ,  B32B27/285 ,  B32B27/32 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2262/0276 ,  B32B2264/0278 ,  B32B2307/204 ,  B32B2307/302 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/714 ,  B32B2307/7265 ,  B32B2307/734 ,  B32B2457/00 ,  C08K3/22 ,  C08L15/00 ,  C08L19/006 ,  C08L71/12 ,  C08L2666/14 ,  C09D5/24 ,  C09D7/61 ,  C09J107/00 ,  C12Q1/6886 ,  C12Q2600/154 ,  C12Q2600/156 ,  H05K1/032 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24802 ,  Y10T428/2804 ,  Y10T428/31826 ,  Y10T428/31833 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T428/31924 ,  Y10T428/31931 ,  Y10T428/31938 ,  C08L2666/08

Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Abstract translation: 一种电路子组件，包括：导电层，由热固性组合物形成的电介质层，其中所述热固性组合物基于所述热固性组合物的总重量包含聚丁二烯或聚异戊二烯树脂，约30至约70重量％ 具有小于约1000ppm的离子污染物的氢氧化镁和约5至约15重量％的含氮化合物，其中所述含氮化合物包含至少约15重量％的氮; 以及设置在所述导电层和所述电介质层之间并且与所述电介质层紧密接触的粘合剂层，其中所述粘合剂包括聚（亚芳基醚），其中所述电路子组件具有至少V-1的UL-94等级。

公开(公告)号：US20130040153A1

公开(公告)日：2013-02-14

申请号：US13588881

申请日：2012-08-17

Applicant: Daisuke FUJIMOTO ,  Yasuyuki Mizuno ,  Kazutoshi Danjoubara ,  Hikari Murai

Inventor： Daisuke FUJIMOTO ,  Yasuyuki Mizuno ,  Kazutoshi Danjoubara ,  Hikari Murai

IPC: C09D109/00 ,  B32B15/08 ,  H05K3/00

CPC classification number: H05K1/0353 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/10 ,  B32B2274/00 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/726 ,  B32B2457/08 ,  C08J3/246 ,  C08J5/24 ,  C08J2387/00 ,  C08K3/013 ,  C08L9/00 ,  C08L15/00 ,  C08L21/00 ,  C08L47/00 ,  C08L71/00 ,  C08L71/12 ,  H05K1/024 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10T428/31696 ,  C08L2666/14

Abstract: A thermosetting resin varnish that includes a thermosetting resin composition of an uncured semi-IPN composite having compatibilized with one another (A) a polyphenylene ether, (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified, and (C) a crosslinking agent; (D) an inorganic filler; and (E) a saturated thermoplastic elastomer. Also, a resin varnish for a printed circuit board, a prepreg, and a metal-clad laminate, using the thermosetting resin varnish.

Abstract translation: 一种热固性树脂清漆，其包含彼此相容的未固化的半IPN复合材料的热固性树脂组合物（A）聚苯醚，（B）在其分子中含有40％以上的1,2- - 丁二烯单元在其侧链中具有1,2-乙烯基，并且不经化学改性，和（C）交联剂; （D）无机填料; 和（E）饱和热塑性弹性体。 另外，使用该热固性树脂清漆的印刷电路板用树脂清漆，预浸料坯和覆金属层压板。

公开(公告)号：US20130034725A1

公开(公告)日：2013-02-07

申请号：US13649333

申请日：2012-10-11

Applicant: World Properties, Inc.

Inventor： Sankar K. Paul

IPC: B32B7/12 ,  B32B15/06 ,  B32B33/00 ,  B32B15/085

CPC classification number: C09J107/00 ,  B32B7/12 ,  B32B15/14 ,  C08L15/00 ,  C08L19/006 ,  C08L71/12 ,  C08L71/126 ,  C08L2666/08 ,  C08L2666/14 ,  C09J171/12 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0355 ,  Y10T428/273 ,  Y10T428/2804 ,  Y10T428/2878 ,  Y10T428/2883 ,  Y10T428/31511 ,  Y10T428/31696 ,  Y10T428/31855

Abstract: A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.

Abstract translation: 一种电路材料，包括导电金属层或介电电路衬底层和设置在导电金属层或介电衬底层上的粘合剂层，其中粘合剂包括聚（亚芳基醚）和聚丁二烯或聚异戊二烯聚合物。

公开(公告)号：US20130000843A1

公开(公告)日：2013-01-03

申请号：US13615167

申请日：2012-09-13

Applicant: Yasuyuki MIZUNO ,  Daisuke FUJIMOTO ,  Kazutoshi DANJOBARA ,  Hikari MURAI

Inventor： Yasuyuki MIZUNO ,  Daisuke FUJIMOTO ,  Kazutoshi DANJOBARA ,  Hikari MURAI

IPC: C08L47/00 ,  H05K3/46 ,  C08K3/36 ,  H05K3/00 ,  C08K5/03 ,  C08K5/3417

CPC classification number: H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract translation: 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US08277948B2

公开(公告)日：2012-10-02

申请号：US12279571

申请日：2007-02-14

Applicant: Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

Inventor： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

IPC: B32B15/08

CPC classification number: H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract translation: 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US08187696B2

公开(公告)日：2012-05-29

申请号：US12504996

申请日：2009-07-17

Applicant: Sankar K. Paul ,  Christopher J. Caisse ,  Dirk M. Baars ,  Allen F. Horn, III

Inventor： Sankar K. Paul ,  Christopher J. Caisse ,  Dirk M. Baars ,  Allen F. Horn, III

IPC: B32B15/00

CPC classification number: H05K1/0373 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10T156/10 ,  Y10T428/24612 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/257

Abstract: A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.

Abstract translation: 一种电路基板层叠体，包括导电金属层; 介电复合材料的介电常数小于约3.5，损耗因数小于约0.006，其中介电复合材料包括聚合物树脂; 和约10至约70体积％的三氧化二铁含量小于或等于3重量％的空心微球。

公开(公告)号：US08129823B2

公开(公告)日：2012-03-06

申请号：US11986998

申请日：2007-11-27

Applicant: Ravindra V. Tanikella

Inventor： Ravindra V. Tanikella

IPC: H01L23/58 ,  H01L23/52

CPC classification number: H01L23/49894 ,  C08F283/04 ,  C08G73/121 ,  C08K3/36 ,  C08K9/10 ,  C08K2201/011 ,  C08L79/08 ,  C08L2666/66 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3185 ,  H01L23/49822 ,  H01L23/49866 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/15787 ,  H01L2924/15791 ,  H01L2924/18161 ,  H01L2924/351 ,  H05K1/112 ,  H05K3/28 ,  H05K3/421 ,  H05K3/422 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2203/1163 ,  H05K2203/121 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts). In one embodiment, the solder resist opening walls have a wettable layer generated through laser assisted seeding so that there is no gap between the solder resist opening walls and no underfill in the solder resist opening.

Abstract translation: 用于微电子封装的高度可靠的互连。 在一个实施例中，积聚互连中的电介质层具有玻璃化转变温度的等级; 并且稍后施加的电介质层在低于较早施加的电介质层的玻璃化转变温度的温度下被层压。 在一个实施方案中，通过热固化工艺增加了积聚互连中早期施加的介电膜的玻璃化转变温度，以超过用于层压后来施加的电介质膜的温度。 在一个实施方案中，在层压聚酰亚胺材料的膜（例如通过催化剂的密封剂的光化学或热降解）之后，形成具有嵌入催化剂以促进交联的聚酰亚胺材料。 在一个实施例中，阻焊剂开口壁具有通过激光辅助接种产生的可湿性层，使得阻焊剂开口壁之间没有间隙，并且在阻焊剂开口中没有底部填充物。