公开(公告)号：US20080179383A1

公开(公告)日：2008-07-31

申请号：US11699046

申请日：2007-01-29

Applicant: Hitoshi Sakurai ,  Yoichi Kukimoto

Inventor： Hitoshi Sakurai ,  Yoichi Kukimoto

IPC: B23K31/02 ,  B23K35/363

CPC classification number: H05K3/3484 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  H05K2201/0266 ,  Y10T428/1486

Abstract: A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 μm are present 16% or more, and a sum of the particles having a particle size of below 10 μm and particles having a particle size of 10 μm or more and below 20 μm is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

Abstract translation: 一种焊料组合物，其用于通过在基板上的电极周围形成堤坝来形成焊料凸块的焊料预涂布方法，在由坝围绕的开口部内填充电极上的焊膏组合物，并加热填充的焊膏组合物，使得 焊料粘附到电极的表面。 该焊膏组合物含有焊料粉末，该焊料粉末的粒径分布为粒径小于10μm的粒子的含量为16％以上，粒径为10μm以下的粒子的总和为 10μm以上且小于20μm的粒径为90％以上。 由此，能够抑制突起缺陷的发生，通过使用该堤坝的焊料预涂法，能够以高产率形成均匀高度的焊料凸块。

公开(公告)号：US07339281B2

公开(公告)日：2008-03-04

申请号：US11139210

申请日：2005-05-26

Applicant: Ryosuke Usui ,  Hiroyuki Watanabe ,  Takeshi Nakamura

Inventor： Ryosuke Usui ,  Hiroyuki Watanabe ,  Takeshi Nakamura

IPC: H01L23/29

CPC classification number: H05K3/4655 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/5384 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2221/68377 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0035 ,  H05K3/284 ,  H05K3/421 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09509 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2203/0369 ,  H05K2203/0554 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A circuit device which enables easy formation of a connection part that connects wiring layers to each other, and a manufacturing method thereof are provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first resin film is formed so as to cover a first wiring layer. Thereafter, a first through-hole is formed, which penetrates the first resin film and exposes the first wiring layer from a bottom thereof. Next, a second resin film is formed so as to fill up the first through-hole. Moreover, a second through-hole is formed in the second resin film buried in the first through-hole, and a connection part is formed.

Abstract translation: 提供一种能够容易地形成将布线层彼此连接的连接部的电路装置及其制造方法。 在本发明的混合集成电路器件的制造方法中，形成第一树脂膜以覆盖第一布线层。 此后，形成穿过第一树脂膜并从其底部露出第一布线层的第一通孔。 接下来，形成第二树脂膜以填充第一通孔。 此外，在埋设在第一通孔中的第二树脂膜中形成第二通孔，形成连接部。

公开(公告)号：US20070232727A1

公开(公告)日：2007-10-04

申请号：US11732253

申请日：2007-04-03

Applicant: Pui-Yan Lin ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

Inventor： Pui-Yan Lin ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

IPC: C08L63/00 ,  B32B27/38

CPC classification number: H05K3/4661 ,  B82Y30/00 ,  C08G59/621 ,  C08J5/005 ,  C08J2363/00 ,  C08L63/00 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/26 ,  Y10T428/31511 ,  C08L2666/54

Abstract: Epoxy compositions exhibiting low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. Also provided are processes for making the epoxy compositions. The low dielectric constant compositions are well-suited for use in multi-layer printed circuit boards. The desired properties are achieved by employment of a bimodal distribution of nano-scale fillers in the epoxy compositions.

Abstract translation: 提供在未固化状态下显示低粘度和固化状态下的低热膨胀系数的环氧组合物。 还提供了制备环氧组合物的方法。 低介电常数组合物非常适用于多层印刷电路板。 期望的性能通过在环氧组合物中使用纳米级填料的双峰分布来实现。

公开(公告)号：US07233069B2

公开(公告)日：2007-06-19

申请号：US10947177

申请日：2004-09-23

Applicant: Norihito Tsukahara ,  Kazuhiro Nishikawa ,  Daisuke Sakurai

Inventor： Norihito Tsukahara ,  Kazuhiro Nishikawa ,  Daisuke Sakurai

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H05K3/247 ,  H01L2924/0002 ,  H05K1/095 ,  H05K2201/0266 ,  H05K2201/035 ,  H01L2924/00

Abstract: An interconnection substrate includes: an interconnection layer region where at least a first conductor layer and a second conductor layer are vertically stacked in that order on a substrate, with the first conductor layer and second conductor layer containing conductive particles and a binder, wherein the first conductor layer and second conductor layer stacked in the interconnection layer region have conductive particles different in average particle size from each other. As a result, only an intended region can have low resistance.

Abstract translation: 互连基板包括：互连层区域，其中至少第一导体层和第二导体层在基板上依次垂直堆叠，第一导体层和第二导体层包含导电颗粒和粘合剂，其中第一 堆叠在互连层区域中的导体层和第二导体层具有彼此平均粒径不同的导电粒子。 结果，只有预期的区域可以具有低电阻。

公开(公告)号：US20060255476A1

公开(公告)日：2006-11-16

申请号：US11129984

申请日：2005-05-16

Applicant: Frederick Kuhlman ,  Richard Parker ,  Shing Yeh ,  Bradley Carter ,  Steven Middleton ,  Rodney Sprinkles

Inventor： Frederick Kuhlman ,  Richard Parker ,  Shing Yeh ,  Bradley Carter ,  Steven Middleton ,  Rodney Sprinkles

IPC: H01L23/48

CPC classification number: H05K3/3484 ,  H01L24/32 ,  H01L2224/29 ,  H01L2224/81138 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/0215 ,  H05K2201/0266 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: An electronic assembly includes a bare IC die or a leadless electronic component having at least one electrically conductive contact formed on a surface of the component and a leadframe or a substrate having at least one electrically conductive trace. The conductive contact of the component is electrically and mechanically coupled to the conductive trace with a solder joint. The solder joint includes a plurality of solid electrically conductive metal particles having a substantially spherical shape and a diameter ranging from about one mil to about ten mils.

Abstract translation: 电子组件包括裸IC芯片或无引线电子元件，其具有形成在元件的表面上的至少一个导电触点和具有至少一个导电迹线的引线框架或基板。 组件的导电接触件通过焊接接头与导电迹线电连接和机械耦合。 焊接点包括多个固体导电金属颗粒，其具有基本上球形的形状，直径范围为约1密耳至约10密耳。

公开(公告)号：US20060091188A1

公开(公告)日：2006-05-04

申请号：US10976980

申请日：2004-10-29

Applicant: Cheng Tay ,  Pek Tan ,  Swee Cheng ,  Eng Yap

Inventor： Cheng Tay ,  Pek Tan ,  Swee Cheng ,  Eng Yap

IPC: B23K31/02

CPC classification number: B23K1/0016 ,  B23K2101/42 ,  H01L21/4853 ,  H01L21/486 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2201/035 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2203/043 ,  H05K2203/1476

Abstract: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.

Abstract translation: 在一个实施例中，提供了一种方法。 该方法包括用形成第一尺寸的焊球的焊膏填充在焊盘中形成的微孔; 以及用包括第二尺寸的焊球的焊膏涂覆所述接合焊盘，其中所述第二尺寸大于所述第一尺寸。

公开(公告)号：US20030164204A1

公开(公告)日：2003-09-04

申请号：US10248802

申请日：2003-02-20

Inventor： Ho-Ming Tong ,  Chun-Chi Lee ,  Jen-Kuang Fang ,  Ching-Fu Horng ,  Shih-Kuang Chen ,  Shyh-Ing Wu ,  Chun-Hung Lin ,  Yung-Chi Lee ,  Yu-Chen Chou ,  Tsung-Hua Wu ,  Su Tao

IPC: B23K035/34

CPC classification number: H01L24/10 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2203/043 ,  H01L2924/00

Abstract: A solder paste for fabricating bumps includes a flux and metallic alloy powder. The metallic alloy powder includes a plurality of low eutectic metallic alloy granules, and the size of these metallic alloy granules is 20-60 nullm and the average size of the metallic granules is 35 nullm to 45 nullm.

Abstract translation: 用于制造凸块的焊膏包括焊剂和金属合金粉末。 金属合金粉末包含多个低共晶金属合金颗粒，这些金属合金颗粒的尺寸为20-60μm，金属颗粒的平均尺寸为35μm〜45μm。

公开(公告)号：US06518163B2

公开(公告)日：2003-02-11

申请号：US09746336

申请日：2000-12-26

Applicant: Seiki Sakuyama ,  Yasuo Yamagishi ,  Masataka Mizukoshi

Inventor： Seiki Sakuyama ,  Yasuo Yamagishi ,  Masataka Mizukoshi

IPC: H01L2144

CPC classification number: H05K3/3484 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1532 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0266 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0574 ,  H05K2203/0577 ,  H05K2203/0769

Abstract: The present invention relates to a bump formation method, comprising the steps of providing a mask, in which a plurality of openings have been formed corresponding to a plurality of electrode pads, to a substrate provided with this plurality of electrode pads, filling the openings with a solder paste, and heat treating the solder paste. The solder paste contains a solder powder. This solder powder is one that contains no more than 10 wt % particles whose diameter is greater than the thickness of the mask and no more than 1.5 times this thickness. Preferably, this solder powder is one that contains no more than 10 wt % particles whose diameter is greater than 40% of the diameter of the openings, or one that contains no more than 30 wt % particles whose diameter is 40 to 100% the thickness of the mask.

Abstract translation: 凸点形成方法技术领域本发明涉及一种凸块形成方法，包括以下步骤：将具有多个电极焊盘的多个开口形成的掩模提供给设置有该多个电极焊盘的基板， 焊膏，并对焊膏进行热处理。 焊膏含有焊料粉末。 该焊料粉末是含有不超过10重量％的直径大于掩模厚度且不大于该厚度的1.5倍的颗粒。 优选地，该焊料粉末是含有不超过10重量％的直径大于开口直径的40％的颗粒，或者包含不超过30重量％的直径为40至100重量％的颗粒的焊料粉末 的面具。

公开(公告)号：US5411602A

公开(公告)日：1995-05-02

申请号：US197750

申请日：1994-02-17

Applicant: Donald J. Hayes

Inventor： Donald J. Hayes

IPC: B22F1/00 ,  B22F9/08 ,  B23K35/02 ,  H05K3/34 ,  B23K35/34

CPC classification number: H05K3/3484 ,  B22F1/0048 ,  B22F9/08 ,  B23K35/025 ,  B22F2999/00 ,  H05K2201/0266

Abstract: Spherical solder drops having precise and accurate shape are formed by an ejection device and solidified to form solder balls for making solder pastes. The diameters of the solidified solder balls are determined by an excitation signal applied to the ejection device and changes in the diameter of the orifice in the ejection device. A solder paste is produced by mixing solidified solder balls of a single diameter or a combination of several different diameters with a carrier.

Abstract translation: 通过喷射装置形成具有精确和精确形状的球形焊料滴，并固化以形成用于制造焊膏的焊球。 凝固的焊球的直径由施加到喷射装置的激发信号和喷射装置中的孔的直径的变化来确定。 通过将单个直径的固化焊球或几个不同直径的组合与载体混合来制造焊膏。

公开(公告)号：US5409741A

公开(公告)日：1995-04-25

申请号：US836650

申请日：1992-02-14

Applicant: Lucien D. Laude

Inventor： Lucien D. Laude

IPC: C23C24/00 ,  C23C18/30 ,  C23C26/00 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  B05D3/06

CPC classification number: H05K3/102 ,  C23C18/30 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/0266 ,  H05K2201/0347 ,  H05K2203/107 ,  H05K3/181

Abstract: The method for metallizing the surface of dielectric materials according to the invention comprises a first step wherein a metal powder, the size of the grains of which is comprised between 10 and 5000 nm, is deposited and then incorporated into the surface of the dielectric material. In a second step of the method, the dielectric material which is so impregnated with metal, is immersed into an autocatalytic bath to coat the impregnated zones of the material with a layer of the metal contained in the bath in a thickness which is proportional to the immersion time. This method enables to metallize materials such as oxides, polymers and composites containing these oxides and/or these polymers. The characteristics of the metal deposits are controlled, on the one hand, by the type of metal, and the size and the geometry of the metal powder grains and, on the other hand, by the type and the structure of the dielectric materials coated with these deposits.

Abstract translation: 根据本发明的用于金属化电介质材料的表面的方法包括第一步骤，其中沉积10至5000nm晶粒尺寸的金属粉末，然后并入电介质材料的表面。 在该方法的第二步中，将浸渍有金属的介电材料浸入自催化浴中，以包含在浴中的金属层涂覆该材料的浸渍区，其厚度与 沉浸时间 该方法能够使包含这些氧化物和/或这些聚合物的材料如氧化物，聚合物和复合材料金属化。 金属沉积物的特性一方面由金属的类型以及金属粉末颗粒的尺寸和几何形状进行控制，另一方面通过涂覆有金属粉末的介电材料的类型和结构来控制 这些存款。