公开(公告)号：EP2440024A1

公开(公告)日：2012-04-11

申请号：EP10783253.7

申请日：2010-05-18

Applicant: Sumitomo Electric Industries, Ltd. ,  Sumitomo Electric Printed Circuits, Inc.

Inventor： Yamamoto, Masamichi ,  Nakatsugi, Kyouichirou ,  Yamaguchi, Takashi ,  Kawakami, Shigeki ,  Kimura, Michihiro

IPC: H05K3/36 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K3/361 ,  C23F11/149 ,  H01L2924/0002 ,  H05K3/282 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3431 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/094 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/308 ,  Y10T156/10 ,  H01L2924/00

Abstract: [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost.
[Solution] A connection method according to the present invention includes a step (a1) of preparing base materials 10 and 21 each including an electrode for connection using an adhesive, a step (b1) of covering electrodes 12 and 22 for connection using an adhesive with organic films 15 configured to prevent oxidation, the electrodes 12 and 22 being located on the base materials, a step (c1) of removing or thinning the organic films, and after the step (c1), a step (d1) of bonding the electrodes for connection using an adhesive to each other with an adhesive 30 mainly containing a thermosetting resin to establish electrical connection.

公开(公告)号：EP2159805B1

公开(公告)日：2011-08-31

申请号：EP09173628.0

申请日：2006-08-31

Applicant: BASF SE

Inventor： Schneider, Norbert ,  Lippert, Gerald ,  Lochtman, Rene ,  Maas, Heiko ,  Pfister, Jürgen ,  Sobotka, Bettina ,  Wagner, Norbert

IPC: H01B1/22 ,  C08K3/08 ,  C08K7/06

CPC classification number: H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0347 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258

公开(公告)号：EP2219424A1

公开(公告)日：2010-08-18

申请号：EP10158080.1

申请日：2008-08-19

Applicant: Shocking Technologies Inc

Inventor： Kosowsky, Lex ,  Fleming, Robert ,  Wu, Junjun

IPC: H05K1/02 ,  H01C7/10

CPC classification number: H01C7/1013 ,  B82Y10/00 ,  H01C7/105 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0218 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2201/0738 ,  H05K2203/105

Abstract: Embodiments described herein provide for a composition of voltage switchable dielectric (VSD) material that includes a concentration of modified high-aspect ratio (HAR) particles. In an embodiment, at least a portion of the concentration includes HAR particles are surface-modified to provide core-shell HAR particles. As an alternative or addition, a portion of the concentration includes HAR particles that are surface-modified to have activated surfaces.

Abstract translation: 本文描述的实施例提供了包括经改进的高纵横比（HAR）颗粒浓度的可变压电介质（VSD）材料的组成。 在一个实施方案中，浓度的至少一部分包括HAR颗粒被表面改性以提供核 - 壳HAR颗粒。 作为替代或添加，浓度的一部分包括被表面改性以具有活化表面的HAR颗粒。

公开(公告)号：EP2191043A1

公开(公告)日：2010-06-02

申请号：EP08798196.5

申请日：2008-08-19

Applicant: Shocking Technologies Inc

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert ,  WU, Junjun

IPC: C25B9/00 ,  G06F19/00

CPC classification number: H01C7/1013 ,  B82Y10/00 ,  H01C7/105 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0218 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2201/0738 ,  H05K2203/105

Abstract: Embodiments described herein provide for a composition of voltage switchable dielectric (VSD) material that includes a concentration of modified high-aspect ratio (HAR) particles. In an embodiment, at least a portion of the concentration includes HAR particles are surface-modified to provide core-shell HAR particles. As an alternative or addition, a portion of the concentration includes HAR particles that are surface-modified to have activated surfaces.

公开(公告)号：EP1611642A1

公开(公告)日：2006-01-04

申请号：EP04716886.9

申请日：2004-03-03

Applicant: 3M Innovative Properties Company

Inventor： DIVIGALPITIYA, Ranjith ,  KANNO, David A., ,  JANNIC, Patrice ,  ARNOLD, Christophe ,  SABATIER, Richard ,  CONNELL, Glen

IPC: H01R4/04 ,  C09J9/02 ,  H05K3/32

CPC classification number: H01L24/29 ,  C08L67/00 ,  C08L77/00 ,  C09J9/02 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0281 ,  H01L2924/00

Abstract: An electronic assembly comprising a first electronic element, a second electronic element, and a durably flexible bond therebetween. The bond comprises an anisotropic conductive adhesive that includes elongated electrically conductive particles. The bond provides at least one electrical pathway between the first electronic element and the second electronic element through an elongated contact region. This bond is functionally maintained for at least about 200 flexes.

公开(公告)号：EP1475170A2

公开(公告)日：2004-11-10

申请号：EP04252631.9

申请日：2004-05-06

Applicant: SUMITOMO ELECTRIC INDUSTRIES, Ltd

Inventor： Shimoda, Kohei, c/o Osaka Works of Sumitomo ,  Majima, Masatoshi, c/o Osaka Works of Sumitomo ,  Koyama, Keiji, c/o Osaka Works of Sumitomo ,  Okada, Issei, c/o Osaka Works of Sumitomo ,  Kuwabara, Tetsuya, c/o Osaka Works of Sumitomo

IPC: B22F1/00 ,  B22F9/24

CPC classification number: H05K3/321 ,  B22F1/0007 ,  B22F1/0022 ,  B22F1/0096 ,  B22F9/24 ,  B22F2998/00 ,  B82Y30/00 ,  C08K3/08 ,  C09D5/24 ,  H01B1/02 ,  H01B1/22 ,  H05K2201/0248 ,  C08L21/00

Abstract: A metal powder composed of nickel or an alloy thereof and used for a producing a conductivity-afforded material is provided, in which particles are integrated in particle aggregates having a chain structure. The average diameter of the particle aggregates is in the range of 30 to 200 nm, and the average length thereof is in the range of 0.5 to 50 µm. The increased conductivity bestowing effect can be obtained by the addition of a small amount of the metal powder.

Abstract translation: 提供由镍或其合金构成并用于制备导电性材料的金属粉末，其中颗粒整合在具有链结构的颗粒聚集体中。 粒子聚集体的平均直径为30〜200nm的范围，平均长度为0.5〜50μm的范围。 通过添加少量的金属粉末可以获得增加的导电性赋予效果。

公开(公告)号：EP1060141A1

公开(公告)日：2000-12-20

申请号：EP99908438.7

申请日：1999-02-25

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce ,  ROBERTSON, Walter, J.

IPC: C03C25/02 ,  C08J5/08 ,  H05K1/03

CPC classification number: H05K1/0366 ,  C03C25/26 ,  C03C25/42 ,  C03C25/47 ,  C08J5/08 ,  H05K3/0047 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2203/127

Abstract: The present invention provides glass fiber strands impregnated with non-abrasive solid particles which provide interstitial spaces of at least 3 micrometers between adjacent fibers within a strand which are useful for reinforcing composites.

公开(公告)号：EP0633295A4

公开(公告)日：1997-03-26

申请号：EP94905218

申请日：1994-01-27

Applicant: OTSUKA KAGAKU KK

Inventor： TASAKA TAKIO - AZA HACHIKITAKA ,  MONDE HIROYUKI MEZONDOFURORA

IPC: C08K7/08 ,  C08K7/10 ,  H05K1/03 ,  C08L101/00 ,  C08K7/04

CPC classification number: C08K7/08 ,  C08K7/10 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0251

Abstract: The invention aims at providing a resin composition for electronic parts which is in great demand as a circuit board material for electric and electronic equipments, and which has a low dielectric constant, low dielectric dissipation factor and a thermal resistance. This resin consists of a thermoplastic resin or a thermosetting resin, and wollastonite or zonotolite, fibrous material containing CaO.SiO2 as a main component, mixed as reinforcing fiber with the resin at a mixing ratio of 5-60 % based on the total weight of the resin and fiber.

公开(公告)号：EP0305846A2

公开(公告)日：1989-03-08

申请号：EP88113614.7

申请日：1988-08-22

Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED

Inventor： Inoue, Masakazu ,  Asai, Kuniaki ,  Hieda, Kazuo ,  Kobayashi, Tadayasu

IPC: C08L67/00 ,  C08K7/04 ,  C08K3/26 ,  H05K1/00

CPC classification number: H05K1/0373 ,  C08K3/26 ,  C08K7/04 ,  H05K1/0326 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0251 ,  C08L67/00

Abstract: A resin composition for printed circuit board comprising:

(A) 30 - 90% by weight of a liquid crystal polyester,
(B) 3 - 50% by weight of an inorganic fibrous or acicular material having an average diameter of 15 µm or below and an average length of 200 µm or below, and
(C) 3 - 30% by weight of an alkaline earth metal carbonate.

Abstract translation: 一种印刷电路板用树脂组合物，其特征在于，包含：（A）30〜90重量％的液晶聚酯，（B）3〜50重量％的平均粒径为15μm以下的无机纤维或针状材料 平均长度为200μm以下，（C）3〜30重量％的碱土金属碳酸盐。

公开(公告)号：EP2525398B1

公开(公告)日：2018-09-05

申请号：EP11732925.0

申请日：2011-01-13

Applicant: Kyocera Corporation

Inventor： ISHIMINE,Yuusaku ,  MORIYAMA,Masayuki ,  KOMATSUBARA,Kenji

IPC: H01L23/15 ,  H01L23/13 ,  H01L23/373 ,  H05K1/02 ,  H05K1/03 ,  C04B35/587 ,  H01L35/32 ,  C04B37/02 ,  H05K3/38

CPC classification number: H01L23/13 ,  C04B35/587 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3878 ,  C04B2235/3882 ,  C04B2235/5276 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/604 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/6587 ,  C04B2235/721 ,  C04B2235/723 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/945 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/74 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2201/0269 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/25 ,  Y10T428/259 ,  H01L2924/00

Abstract: Provided is a silicon nitride substrate capable of enhancing the bond strength when a member made of a metal is bonded to the substrate, and a circuit substrate and an electronic device capable of improving reliability by using the silicon nitride substrate. The silicon nitride substrate 1 comprises a substrate 1a comprising a silicon nitride sintered body, and a plurality of granular bodies 1b containing silicon and integrated to a principal surface of the substrate 1a, wherein a plurality of needle crystals 1c or column crystals 1d comprising mainly silicon nitride are extended from a portion of the granular bodies 1b. A brazing material is applied to a principal surface of the substrate 1a, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies 1b integrated to the principal surface of the substrate 1a, and a plurality of the needle crystals 1c or the column crystals 1d extended from a portion of the granular bodies 1b, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate 1.