公开(公告)号：CN1525805A

公开(公告)日：2004-09-01

申请号：CN200410001850.X

申请日：2004-01-14

Applicant: 夏普株式会社

Inventor： 藤井晓义 ,  田平理雄 ,  长江伸和

IPC: H05K1/09 ,  H05K3/38 ,  H01B1/22 ,  C09D5/24

CPC classification number: H05K3/247 ,  B32B5/16 ,  H05K3/102 ,  H05K2201/0257 ,  H05K2203/0522 ,  H05K2203/1131 ,  Y10T428/12021 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12111 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/256

Abstract: 一种通过热处理将金属微粒之间熔合以在基板上形成布线用的布线材料，具有粘合剂层与布线层。粘合剂层含有金属微粒，并具有与上述基板粘合用的粘合剂功能，布线层由金属微粒构成，层叠在上述粘合剂层上，该粘合剂层的金属微粒与该布线层的金属微粒处于接触状态。由此，不但可以实现布线的低电阻化和提高布线与基板的粘合性，而且可以提供对原料的选择自由度高的布线材料。

公开(公告)号：EP2496661B1

公开(公告)日：2018-07-11

申请号：EP10790862.6

申请日：2010-11-02

Applicant: Yissum Research Development Company of the Hebrew University of Jerusalem, Ltd.

Inventor： MAGDASSI, Shlomo ,  GROUCHKO, Michael ,  LAYANI, Michael

IPC: H01B1/02 ,  C23C4/18 ,  C23C26/00 ,  H01B1/10 ,  H01L31/18 ,  H05K1/03 ,  H05K1/02 ,  H05K1/09 ,  H05K3/12

CPC classification number: H05B33/28 ,  B05D3/107 ,  B05D5/061 ,  B05D5/12 ,  C23C4/18 ,  C23C16/513 ,  C23C26/00 ,  H01B1/02 ,  H01B1/026 ,  H01B1/10 ,  H01L31/022466 ,  H01L31/1884 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2933/0016 ,  H05K1/0225 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0302 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/0969 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0545 ,  H05K2203/1173 ,  H05K2203/125 ,  Y02E10/50 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/249978 ,  Y10T428/249979 ,  H01L2924/00

Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

公开(公告)号：EP3203816A4

公开(公告)日：2018-05-30

申请号：EP15846149

申请日：2015-08-31

Applicant: KOMURA TECH CO LTD

Inventor： KANEHARA MASAYUKI ,  URANO MASAAKI

IPC: H05K3/12 ,  B41F3/20 ,  B41F17/14 ,  B41M1/04 ,  B41M1/30 ,  C09D11/52 ,  H05K1/09

CPC classification number: H05K3/12 ,  B41F3/20 ,  B41F17/14 ,  B41M1/04 ,  B41M1/30 ,  C09D11/52 ,  H05K1/097 ,  H05K3/1275 ,  H05K3/1283 ,  H05K2201/0257 ,  H05K2203/1131

Abstract: An electronic circuit board manufacturing method according to the present disclosure is a method of manufacturing an electronic circuit board including a substrate and an electronic circuit having a predetermined pattern, the electronic circuit being fixed on the substrate and being made from a nanoink composition containing metal particles. The method includes the steps of: causing a printing plate to hold a nanoink composition containing metal particles, the printing plate including an ink holding part formed on a surface thereof and having a predetermined pattern; bringing a surface of the substrate into intimate contact with the printing plate to transfer the nanoink composition held on the ink holding part onto the substrate (workpiece W); and drying the transferred nanoink composition in an environment of 40°C or below in the atmosphere to fix the nanoink composition after the transfer step, thereby forming an electronic circuit having a predetermined pattern. This method is capable of forming a layer made from a uniform nanoink composition rapidly and efficiently at ordinary temperatures and under atmospheric pressure.

公开(公告)号：EP3289838A1

公开(公告)日：2018-03-07

申请号：EP16770547.4

申请日：2016-04-27

Applicant: Centre National de la Recherche Scientifique ,  Universite d'Aix Marseille

Inventor： ALLONCLE, Anne Patricia Blanche ,  DELAPORTE, Philippe Christian Maurice

IPC: H05K3/02 ,  B41J2/475 ,  H05K3/04

CPC classification number: H05K3/1275 ,  H05K3/025 ,  H05K3/046 ,  H05K3/10 ,  H05K2201/0104 ,  H05K2201/0257 ,  H05K2203/0528 ,  H05K2203/0736 ,  H05K2203/108 ,  H05K2203/128

Abstract: The invention relates to a laser printing method comprising the following steps: (a) providing a receiving substrate (4); (b) providing a target substrate (5) including a transparent substrate (50), one face of which has a coating (51) formed by a solid metal film; (c) locally irradiating the film (51) through the transparent substrate (50) using a first laser (8) in order to reach the melting point of the metal in a target zone of the film that is in liquid form; (d) irradiating the liquid film through the transparent substrate using a second laser on the target zone defined in step (c), in order to form a liquid jet in the target zone and to eject same from the substrate in the form of molten metal; (e) depositing a drop of molten metal on a defined receiving zone of the receiving substrate, said drop solidifying as it cools.

公开(公告)号：EP3258751A1

公开(公告)日：2017-12-20

申请号：EP17176251.1

申请日：2017-06-15

Applicant: Nano Shield Technology Co., Ltd.

Inventor： Cheng Lee, James

IPC: H05K3/28

CPC classification number: H05K3/284 ,  H05K1/185 ,  H05K3/285 ,  H05K3/303 ,  H05K2201/0104 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0179 ,  H05K2201/0257 ,  H05K2203/1333

Abstract: A method for waterproofing a device and the resulting device are provided. The device includes a printed circuit board assembly (PCBA), which includes a printed circuit board, and at least one electronic component disposed on the printed circuit board. A waterproof coating such as a polymer coating is disposed on or in contact with at least one portion of the at least one electronic component. A nanofilm is disposed on the PCBA. The nanofilm includes an inner coating and an outer coating. The inner coating is disposed on the printed circuit board or in contact with the waterproof coating. The inner coating comprises metal oxide nanoparticles having a particle diameter in a range of about 5 nm to about 100 nm. The outer coating in contact with the inner coating, and comprises silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

Abstract translation: 提供了一种用于使装置防水的方法和所得到的装置。 该装置包括印刷电路板组件（PCBA），其包括印刷电路板以及布置在印刷电路板上的至少一个电子部件。 诸如聚合物涂层的防水涂层设置在至少一个电子部件的至少一部分上或与其接触。 纳米膜布置在PCBA上。 纳米膜包括内涂层和外涂层。 内涂层设置在印刷电路板上或与防水涂层接触。 内涂层包含具有约5nm至约100nm范围内的粒径的金属氧化物纳米粒子。 外涂层与内涂层接触，并且包含具有0.1nm至10nm范围内的粒径的二氧化硅纳米粒子。

公开(公告)号：EP3203816A1

公开(公告)日：2017-08-09

申请号：EP15846149.1

申请日：2015-08-31

Applicant: Komura-tech Co., Ltd.

Inventor： KANEHARA, Masayuki ,  URANO, Masaaki

IPC: H05K3/12 ,  B41M1/04 ,  B41M1/30 ,  B41F3/20 ,  B41F17/14

CPC classification number: H05K3/12 ,  B41F3/20 ,  B41F17/14 ,  B41M1/04 ,  B41M1/30 ,  C09D11/52 ,  H05K1/097 ,  H05K3/1275 ,  H05K3/1283 ,  H05K2201/0257 ,  H05K2203/1131

Abstract: An electronic circuit board manufacturing method according to the present disclosure is a method of manufacturing an electronic circuit board including a substrate and an electronic circuit having a predetermined pattern, the electronic circuit being fixed on the substrate and being made from a nanoink composition containing metal particles. The method includes the steps of: causing a printing plate to hold a nanoink composition containing metal particles, the printing plate including an ink holding part formed on a surface thereof and having a predetermined pattern; bringing a surface of the substrate into intimate contact with the printing plate to transfer the nanoink composition held on the ink holding part onto the substrate (workpiece W); and drying the transferred nanoink composition in an environment of 40°C or below in the atmosphere to fix the nanoink composition after the transfer step, thereby forming an electronic circuit having a predetermined pattern. This method is capable of forming a layer made from a uniform nanoink composition rapidly and efficiently at ordinary temperatures and under atmospheric pressure.

Abstract translation: 根据本公开的电子电路板制造方法是一种制造电子电路板的方法，该电子电路板包括基板和具有预定图案的电子电路，该电子电路固定在基板上并由包含金属颗粒的纳米燃料组合物制成 。 所述方法包括以下步骤：使印刷板保持包含金属颗粒的纳米油墨组合物，所述印刷板包括在其表面上形成并具有预定图案的油墨保持部分; 使基板的表面与印刷板紧密接触以将保持在墨水保持部件上的纳米燃料组合物转印到基板（工件W）上; 以及在大气中在40℃或更低的环境下干燥转印的纳米油墨组合物以在转印步骤后固定纳米油墨组合物，由此形成具有预定图案的电子电路。 该方法能够在常温和常压下快速有效地形成由均匀的纳米油墨组合物制成的层。

公开(公告)号：EP3158015A1

公开(公告)日：2017-04-26

申请号：EP15810065.1

申请日：2015-06-19

Applicant: National Research Council of Canada ,  Groupe Graham International Inc.

Inventor： KELL, Arnold ,  LAFRENIERE, Sylvie ,  PAQUET, Chantal ,  MALENFANT, Patrick ,  MOZENSON, Olga

IPC: C09D11/52 ,  H01Q9/04 ,  H05K1/09 ,  H05K3/12

CPC classification number: C09D11/52 ,  C09D11/033 ,  C09D11/08 ,  C09D11/14 ,  C09D11/38 ,  H01Q1/2225 ,  H01Q1/24 ,  H01Q1/364 ,  H01Q1/38 ,  H05K1/095 ,  H05K3/105 ,  H05K3/1216 ,  H05K2201/0257 ,  H05K2203/1131 ,  H05K2203/1136

Abstract: A flake-less molecular ink suitable for printing (e.g. screen printing) conductive traces on a substrate has 30-60 wt % of a C8-C12 silver carboxylate or 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate, 0.1-10 wt % of a polymeric binder (e.g. ethyl cellulose) and balance of at least one organic solvent. Conductive traces formed with the molecular ink are thinner, have lower resistivity, have greater adhesion to a substrate than metal flake inks, have better print resolution and are up to 8 times less rough than metal flake inks. In addition, the shear force required to remove light emitting diodes bonded to the traces using Loctite 3880 is at least 1.3 times stronger than for commercially available flake-based inks.

Abstract translation: 适合于印刷（例如丝网印刷）导电迹线的无薄片分子墨水具有30-60重量％的C 8 -C 12羧酸银或5-75重量％的双（2-乙基-1-己胺）铜 （II）甲酸盐，二（辛胺）甲酸铜（II）或三（辛胺）铜（II）甲酸盐，0.1-10重量％的聚合物粘合剂（例如乙基纤维素）和余量的至少一种有机溶剂。 与分子墨水形成的导电迹线较薄，具有较低的电阻率，比金属片状墨水具有更大的对基片的粘附性，具有更好的印刷分辨率，比金属片状墨水粗糙度高8倍。 此外，使用Loctite 3880除去结合到迹线上的发光二极管所需的剪切力至少比市售的片状油墨强1.3倍。

公开(公告)号：EP3135405A1

公开(公告)日：2017-03-01

申请号：EP15782582.9

申请日：2015-03-24

Applicant: Daicel Corporation

Inventor： KODUMA, Hiroyoshi

IPC: B22F1/02 ,  B22F1/00 ,  B82Y30/00 ,  B82Y40/00 ,  C09D7/12 ,  C09D201/00 ,  H01B1/00 ,  H01B1/22 ,  H01B5/14 ,  H05K3/12 ,  B22F9/30

CPC classification number: B22F1/02 ,  B22F1/0014 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B22F9/30 ,  B22F2301/255 ,  B22F2302/45 ,  B82Y30/00 ,  B82Y40/00 ,  C09C1/62 ,  C09D5/24 ,  C09D7/40 ,  C09D11/037 ,  C09D11/101 ,  C09D11/52 ,  C09D129/14 ,  C09D201/00 ,  H01B1/22 ,  H01B5/14 ,  H05K1/09 ,  H05K1/097 ,  H05K3/12 ,  H05K2201/0257

Abstract: The present invention provides a silver particle coating composition that develops excellent conductivity by low-temperature and short-time calcining, and preferably achieves excellent adhesion between a silver coating film and a substrate. A silver particle coating composition comprising: silver nano-particles (N) whose surfaces are coated with a protective agent containing an aliphatic hydrocarbon amine; silver microparticles (M); and a dispersion solvent. The silver particle coating composition, further comprising a binder resin. The silver particle coating composition, further comprising a curable monomer and a polymerization initiator. The dispersion solvent comprises at least a glycol ester-based solvent. A silver coating composition that is suitable for intaglio offset printing.

Abstract translation: 本发明提供一种通过低温短时间煅烧产生优异的导电性的银颗粒涂料组合物，并且优选在银涂膜和基材之间实现优异的粘附性。 一种银颗粒涂料组合物，其包含：银纳米颗粒（N），其表面涂覆有含有脂族烃胺的保护剂; 银微粒（M）; 和分散溶剂。 该银颗粒涂料组合物还包含粘合剂树脂。 银颗粒涂料组合物，还包含可固化单体和聚合引发剂。 分散溶剂至少包含二醇酯类溶剂。 适用于凹版胶版印刷的银涂料组合物。

公开(公告)号：EP2667990B1

公开(公告)日：2016-12-14

申请号：EP12739136.5

申请日：2012-01-25

Applicant: Lockheed Martin Corporation

Inventor： ZINN, Alfred, A.

IPC: B82Y30/00 ,  H05K1/09 ,  B22F1/00 ,  B22F9/24 ,  H05K3/12

CPC classification number: B22F1/0018 ,  B22F1/0062 ,  B22F9/24 ,  B22F2999/00 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2203/0514 ,  H05K2203/107 ,  B22F2301/10 ,  B22F2304/054

公开(公告)号：EP2281020B1

公开(公告)日：2016-09-28

申请号：EP09747709.5

申请日：2009-05-15

Applicant: Applied Nanotech Holdings, Inc. ,  Ishihara Chemical Co., Ltd

Inventor： LI, Yunjun ,  ROUNDHILL, David Max ,  YANG, Mohshi ,  PAVLOVSKY, Igor ,  FINK, Richard Lee ,  YANIV, Zvi

IPC: C09D1/00 ,  H05K3/12

CPC classification number: H05K3/1283 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/1131

Abstract: A solution of metal ink is mixed and then printed or dispensed onto the substrate using the dispenser. The film then is dried to eliminate water or solvents. In some cases, a thermal curing step can be introduced subsequent to dispensing the film and prior to the photo-curing step. The substrate and deposited film can be cured using an oven or by placing the substrate on the surface of a heater, such as a hot plate. Following the drying and/or thermal curing step, a laser beam or focused light from the light source is directed onto the surface of the film in a process known as direct writing. The light serves to photo-cure the film such that it has low resistivity.