公开(公告)号：US09560779B2

公开(公告)日：2017-01-31

申请号：US14504948

申请日：2014-10-02

Applicant: Honeywell International Inc.

Inventor： Peter Novysedlak ,  Ondrej Hajek ,  Martin Konecny ,  Milan Vasicek

IPC: H05K5/02 ,  H05K1/02 ,  H05K5/00 ,  B81B7/00 ,  G01P1/02 ,  G01D11/24 ,  G01D3/028

CPC classification number: H05K5/0239 ,  B81B7/0032 ,  G01D3/028 ,  G01D11/245 ,  G01P1/023 ,  H05K1/0212 ,  H05K5/0013 ,  H05K5/0213 ,  H05K2201/06

Abstract: An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board.

Abstract translation: 提供了用于热稳定电路板上的温度敏感元件的外壳。 外壳包括构造成安装在电路板的第一侧的至少一个温度敏感元件的一部分上的第一盖部分。 第一盖部分包括第一盖和从第一盖的周边延伸的至少一个侧壁。 外壳还包括第二盖部分，其构造成安装在与第一盖部分相对的电路板的第二侧的一部分上。 第二盖部分包括第二盖，以及从第二盖的周边延伸的至少一个侧壁。 第一和第二盖部被构造成可释放地与电路板连接。

公开(公告)号：US09474188B2

公开(公告)日：2016-10-18

申请号：US14265595

申请日：2014-04-30

Applicant: Lumentum Operations LLC

Inventor： David Moore ,  Dean Flockton

IPC: H05K7/02 ,  H05K7/20 ,  H05K9/00 ,  H05K3/30 ,  G02B6/42

CPC classification number: G02B6/4269 ,  B32B7/12 ,  B32B27/06 ,  B32B27/281 ,  G02B6/428 ,  H05K1/18 ,  H05K3/301 ,  H05K7/20 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/20418 ,  H05K9/0058 ,  H05K2201/06 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10962

Abstract: Present thermal solutions to conduct heat from pluggable optical modules into heat sinks use a metal heat sink attached with a spring clip. The interface between the pluggable module and the heat sink is simple metal-on-metal contact, which is inherently a poor thermal interface and limits heat dissipation from the optical module. Heat dissipation from pluggable optical modules is enhanced by the application of thermally conductive fibers, such as an advanced carbon nanotube velvet. The solution improves heat dissipation while preserving the removable nature of the optical modules.

Abstract translation: 目前，将可插拔光模块传导热量的热解决方案使用附有弹簧夹的金属散热器。 可插拔模块和散热器之间的接口是简单的金属对金属接触，这本质上是一个差的热接口，并限制了光学模块的散热。 通过使用诸如先进的碳纳米管天鹅绒的导热纤维来增强可插拔光学模块的散热。 该解决方案可以改善散热，同时保持光学模块的可拆卸性。

公开(公告)号：US20160286653A1

公开(公告)日：2016-09-29

申请号：US14778162

申请日：2014-03-27

Applicant: TOPPAN FORMS CO., LTD.

Inventor： Akihito MORI

IPC: H05K1/18 ,  C09J169/00 ,  C09D11/52 ,  H05K3/32 ,  H05K1/09

CPC classification number: H05K1/181 ,  B32B15/00 ,  B32B2457/08 ,  C09D11/52 ,  C09J169/00 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/09 ,  H05K1/092 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1208 ,  H05K3/321 ,  H05K2201/06 ,  H05K2201/10636 ,  H05K2203/1157 ,  H05K2203/121 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided are a laminate including a silver layer on a substrate, in which the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Condition (i) the change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85° C. and a relative humidity of 85% after 240 hours have elapsed and Condition (ii) the change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85° C. and a relative humidity of 85% after 480 hours have elapsed, and a circuit board in which an electronic component is mounted on the surface of the laminate through a conductive joint portion.

Abstract translation: 提供一种在基材上具有银层的层叠体，其中，银层包含粗糙度曲线的曲线满足以下条件（i）中的至少一个的表面，即，峰度的变化率为50％以下，高于或等于50％ 240小时后温度为85℃，相对湿度为85％的条件已经过去，条件（ii）在85℃的温度条件下，峰度的变化率大于等于200％ 经过480小时后的相对湿度为85％，并且通过导电接合部分将电子部件安装在层叠体的表面上的电路板。

公开(公告)号：US20150319841A1

公开(公告)日：2015-11-05

申请号：US14698276

申请日：2015-04-28

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kazutaka Kobayashi

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/056 ,  H05K1/0206 ,  H05K1/0256 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/181 ,  H05K7/205 ,  H05K2201/0195 ,  H05K2201/06 ,  H05K2201/09227 ,  H05K2201/10106 ,  H05K2201/10969

Abstract: A wiring board includes a heat dissipation plate, a heat-conductive adhesive layer, an insulating layer, a thermal via, a heat dissipation metal terminal, and electrodes. The heat-conductive adhesive layer is disposed on the heat dissipation plate. The insulating layer is disposed on the heat-conductive adhesive layer. The insulating layer is formed with an opening portion. The thermal via is disposed in the opening portion of the insulating layer. The heat dissipation metal terminal is disposed on the thermal via and electrically connected to the heat dissipation plate. The electrodes are disposed on the insulating layer. The electrodes are to be connected to an electronic component.

Abstract translation: 布线板包括散热板，导热粘合剂层，绝缘层，热通孔，散热金属端子和电极。 导热粘合剂层设置在散热板上。 绝缘层设置在导热粘合剂层上。 绝缘层形成有开口部。 热通孔设置在绝缘层的开口部分。 散热金属端子设置在热通孔上并与散热板电连接。 电极设置在绝缘层上。 电极将连接到电子部件。

公开(公告)号：US20150064493A1

公开(公告)日：2015-03-05

申请号：US14369909

申请日：2012-01-13

Applicant: Koichiro Tanaka ,  Kazuki Kammuri

Inventor： Koichiro Tanaka ,  Kazuki Kammuri

IPC: H05K1/03 ,  B32B15/20 ,  B32B7/02 ,  H05K1/05 ,  H05K1/09

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1

Abstract translation: 包括铜箔和层压在其上的树脂层的铜箔复合体，满足等式1：（f3×t3）/（f2×t2）=> 1其中t2（mm）是铜箔的厚度，f2（MPa ）是拉伸应变为4％时的铜箔的应力，t3（mm）是树脂层的厚度，f3（MPa）是树脂层在拉伸应变下的应力为4％，等式2： 1 <= 33f1 /（F×T）其中，f1（N / mm）是铜箔和树脂层之间的180°剥离强度，F（MPa）是拉伸应变下的铜箔复合材料的强度为30％， T（mm）是铜箔复合体的厚度，其中以5〜100μg/ dm 2的涂布量形成Cr氧化物层。 形成在不层叠树脂层的铜箔的表面上。

公开(公告)号：US20130240941A1

公开(公告)日：2013-09-19

申请号：US13892814

申请日：2013-05-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Seok PARK

IPC: H01L33/64

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention discloses a light emitting package, including: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a width of a cross-sectional shape of the screen member is larger than a height of the cross sectional shape of the screen member, wherein the lens is disposed on the screen member, and wherein the lens is connected to an uppermost surface of the screen member.

Abstract translation: 本发明公开了一种发光封装，包括：基座; 基底上的发光器件; 电连接到所述发光装置的电路层; 屏幕构件，具有开口并且设置在与所述发光装置相邻的所述基座上; 以及覆盖所述发光器件的透镜，其中所述屏幕部件的横截面形状的宽度大于所述屏幕部件的横截面形状的高度，其中所述透镜设置在所述屏幕部件上，并且其中 透镜连接到屏幕部件的最上表面。

公开(公告)号：US20120146082A1

公开(公告)日：2012-06-14

申请号：US13399709

申请日：2012-02-17

Applicant: Jun Seok PARK

Inventor： Jun Seok PARK

IPC: H01L33/58

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention discloses a light emitting package, comprising: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a gold layer on the electrical circuit layer; a wire electrically connected between the light emitting device and the gold layer; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a bottom surface of the screen member is positioned higher than the light emitting device, and wherein an entire uppermost surface of the screen member is in contact with the lens.

Abstract translation: 本发明公开了一种发光封装，包括：基座; 基底上的发光器件; 电连接到所述发光装置的电路层; 电路层上的金层; 电连接在发光器件和金层之间的线; 屏幕构件，具有开口并且设置在与所述发光装置相邻的所述基座上; 以及覆盖所述发光装置的透镜，其中，所述屏幕部件的底面位于比所述发光装置高的位置，并且所述屏部件的整个最上表面与所述透镜接触。

公开(公告)号：US20110266583A1

公开(公告)日：2011-11-03

申请号：US13182393

申请日：2011-07-13

Applicant: Park Jun Seok

Inventor： Park Jun Seok

IPC: H01L33/58

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor light emitting package is discussed, which includes a base having a top surface with a flat portion; a semiconductor light emitting device on the base; an electrical circuit layer electrically connected to the semiconductor light emitting device; a screen member having an opening and disposed on the base around the semiconductor light emitting device, the screen member shaped into a substantially circle; and an optical member formed of a light transmissive material such that light emitted from the semiconductor light emitting device passes therethrough, wherein a bottom surface of the screen member is positioned higher than the semiconductor light emitting device, an edge portion of the optical member is in contact with the screen member, a top surface of the optical member is substantially parallel to the flat portion of the base.

Abstract translation: 讨论了半导体发光封装，其包括具有平坦部分的顶表面的基座; 基底上的半导体发光器件; 电连接到半导体发光器件的电路层; 屏幕构件，其具有开口并且设置在所述基底周围所述半导体发光器件，所述屏蔽构件成形为大致圆形; 以及由透光性材料形成的光学部件，使得从半导体发光元件射出的光通过其中，其中，所述荧光屏部件的底面位于比所述半导体发光器件高的位置，所述光学部件的边缘部分为 与屏幕构件接触，光学构件的顶表面基本上平行于基底的平坦部分。

公开(公告)号：US07977684B2

公开(公告)日：2011-07-12

申请号：US12860792

申请日：2010-08-20

Applicant: Jun Seok Park

Inventor： Jun Seok Park

IPC: H01L29/267

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base; an insulating layer sandwiched between the meta base and the electrical circuit layer; an electrode layer provided at an upper side of the electrical circuit layer; and a wire for electrically connecting the electrode layer and the light emitting device. Further, there is provided a light emitting device package which is improved in light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.

Abstract translation: 本发明公开了一种发光器件封装，包括：金属基底; 电路层，设置在所述金属基座的上侧，用于提供导电路径; 安装在具有比所述金属基底上的第一区域更小的厚度的第二区域中的发光器件; 绝缘层，夹在元基体和电路层之间; 设置在所述电路层的上侧的电极层; 以及用于电连接电极层和发光器件的导线。 此外，提供了一种发光器件封装，其由于将发光器件放置在金属基底的小厚度部分上而提高了发光效率。

公开(公告)号：US20240138054A1

公开(公告)日：2024-04-25

申请号：US18048155

申请日：2022-10-19

Applicant: Dell Products L.P.

Inventor： JOHN R. STUEWE ,  MICHAEL ALBERT PERKS

IPC: H05K1/02 ,  G06F11/30

CPC classification number: H05K1/0212 ,  G06F11/3058 ,  H05K2201/06

Abstract: Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, a data processing system may include hardware components that provide the computer implemented services. Any of the hardware components may have thermal limitations. To mitigate the impact of the thermal limitations, the data processing system may include host circuit card integrated heating assemblies. The heating assemblies may be used to warm hardware components of devices connected to the host circuit card. When connected to the host circuit card, a thermal conduction path between a device and a heating assembly may be established.