公开(公告)号：EP1810327A2

公开(公告)日：2007-07-25

申请号：EP05803424.0

申请日：2005-11-08

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： TOKUNAGA, Shigetomi

IPC: H01L23/34

CPC classification number: H05K1/141 ,  H01L23/34 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/284 ,  H05K3/366 ,  H05K2201/1034 ,  H05K2201/1056 ,  H05K2201/10689 ,  H01L2924/00

Abstract: Electronic circuit device (100) includes sub-board (108) disposed upright on main board (126). Sub-board (108) is electrically coupled to main board (126) via board terminal (130) disposed at sub-board edge. Semiconductor element (104) is mounted on sub-board (108) facing sub-board (108) in parallel. Temperature sensor (116) is also mounted on sub-board (108). Heat sink (118) is formed so as to surround sub-board (108) and semiconductor element (104). Resin material (122) is injected inside heat sink (118) so as to cover sub-board (108), temperature sensor (116), and semiconductor element (104).

公开(公告)号：EP1659838A3

公开(公告)日：2007-03-07

申请号：EP05023557.1

申请日：2005-10-27

Applicant: Brother Kogyo Kabushiki Kaisha

Inventor： Sugahara, Hiroto Brother Kogyo K.K.

IPC: H05K1/02 ,  H01L23/373 ,  H01L23/473

CPC classification number: H01L23/4006 ,  B41J2/14233 ,  B41J2002/14491 ,  B41J2202/08 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/473 ,  H01L2023/4075 ,  H01L2023/4081 ,  H01L2224/16 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/053 ,  H05K2201/064 ,  H05K2201/10409 ,  H05K2201/1056

Abstract: An electronic part-mounted substrate (1) includes a plate made of metal, an insulating material layer (4) which is formed of a ceramic material on a surface of the plate and which has a surface provided with a heat generating IC (5,6) thereon, and a thermal conductive member which is provided on a surface of IC. The heat, which is generated by IC (5,6) , is transmitted via the thermal conductive member (80) to the insulating material layer (4) and the plate, and the heat is dissipated to the outside. The heat generated by the electronic part can be dissipated more efficiently. The substrate is applicable to a liquid-jetting head.

Abstract translation: 的电子部件安装基板（1）包括由金属制成的，绝缘其中形成陶瓷材料的板，并且其表面上具有设置有发热IC（5的表面材料层（4）所有的板， 6）在其上，和一个导热部件全部被设置在IC的一个表面上。 热，所有这些是由IC（5.6）产生的，通过热传导性构件（80）的绝缘材料层（4）和板反mitted，并且热量被释放到外部。 由电子部件产生的热量可以被更有效地散热。 基板是适用于液体喷射头。

公开(公告)号：EP1677583A1

公开(公告)日：2006-07-05

申请号：EP05028567.5

申请日：2005-12-28

Applicant: HITACHI, LTD.

Inventor： Kadoya, Kiyoomi ,  Sasaki, Masahiro ,  Mayuzumi, Takuya

IPC: H05K1/18 ,  H05K3/28 ,  H01L21/56 ,  H01L23/28 ,  B60R16/02

CPC classification number: B60R16/0239 ,  B29C45/14377 ,  B29C45/14655 ,  H01L21/565 ,  H01L25/165 ,  H01L2924/0002 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/284 ,  H05K5/0034 ,  H05K2201/09745 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/1056 ,  H05K2203/1316 ,  H05K2203/1572 ,  H01L2924/00

Abstract: In resin-molded engine control unit, a coil (7), an electrolytic capacitor (8), a microprocessor (9), electronic parts and a connector terminal (1, 2) are mounted on a board (5). Inside a cover (6) fixed on the board (5), a resin-free region (12) is formed. The coil (7), the electrolytic capacitor (8) and the microprocessor (9), which should not be sealed with resin (3), are mounted in the resin-free region (12), while the board (5) and the electronic parts which are not capped by the cover (6) are sealed with a resin (3).

Abstract translation: 在树脂模制发动机控制单元中，线圈（7），电解电容器（8），微处理器（9），电子部件和连接器端子（1,2）安装在板（5）上。 在固定在板（5）上的盖（6）内部形成无树脂区域（12）。 不要用树脂（3）密封的线圈（7），电解电容器（8）和微处理器（9）安装在无树脂区域（12）中，而板（5）和 没有被盖（6）盖住的电子部件用树脂（3）密封。

公开(公告)号：EP1667226A2

公开(公告)日：2006-06-07

申请号：EP05077632.7

申请日：2005-11-18

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, M. Ray ,  Zimmerman, David W. ,  Chengalva, Suresh K.

IPC: H01L23/36 ,  H05K7/20

CPC classification number: H05K1/021 ,  H01L23/13 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/5389 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/0061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09745 ,  H05K2201/1056 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit board assembly (40,50) having a laminate construction of multiple layers (12), such as a LTCC ceramic substrate (10), with conductor lines (30) between adjacent pairs of layers (12). A heat sink (22) is bonded to a first surface (26) of the substrate (10), and a cavity (24) is defined by and between the heat sink (22) and the substrate (10) such that a base wall (28) of the cavity (24) is defined by one of the layers (12) with conductor lines (30) thereof being present on the base wall (28). A surface-mount circuit device (14) is received within the cavity (24), mounted to the base wall (28), and electrically connected to the conductor lines (30) on the base wall (28). The device (14) is received within the cavity (24) such that a surface of the device (14) contacts a surface region of the heat sink (22). The surface of the device (14) is bonded to the surface region of the heat sink (22) to provide a substantially direct thermal path from the device (14) to the heat sink (22).

Abstract translation: 电路板组件（40,50）具有多层（12）的叠层结构，例如LTCC陶瓷衬底（10），在相邻的层对（12）之间具有导线（30）。 散热器（22）被结合到基板（10）的第一表面（26）上，并且在散热器（22）和基板（10）之间由散热器（22）和基板（10）之间限定空腔（24），使得底壁 腔（24）中的一个（28）由其中一个层（12）限定，其中导体线（30）存在于基壁（28）上。 表面安装电路装置（14）被容纳在空腔（24）内，安装到基壁（28），并且电连接到基壁（28）上的导线（30）。 装置（14）被容纳在空腔（24）内，使得装置（14）的表面接触散热器（22）的表面区域。 装置（14）的表面结合到散热器（22）的表面区域，以提供从装置（14）到散热器（22）的基本上直接的热路径。

公开(公告)号：EP1565045A1

公开(公告)日：2005-08-17

申请号：EP04425094.2

申请日：2004-02-12

Applicant: Askoll Holding S.r.l.

Inventor： Marioni, Elio

IPC: H05K3/34 ,  H05K1/14 ,  H01L23/495 ,  H01L23/40

CPC classification number: H05K1/0209 ,  H05K1/145 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10757 ,  Y10T29/4913

Abstract: The present invention relates to a substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing (2), substantially parallelepiped, and electric connecting pins (3) connected inside the body with said circuit and projecting from said body (2) for an electric connection on the electronic printed circuit board (4). The body (2) has a heat dissipating header (5) having at least one surface emerging from the body (2) and laying on a plane (P) whereas the pins (3) project from the body (2) for a first section initially extended parallelly to the plane (P). Advantageously a pair (7, 8) of pins (3) has a substantially U-shaped bending, after the first section parallel to the plane (P) for allowing a more stable bearing of the component (1) during the step of welding to a heat dissipating intermediate die (9).

Abstract translation: 本发明涉及一种基本上包装状的离散电子部件，其包括大体上平行六面体的电力电子电路，主体或壳体（2）和连接在主体内的所述电路的电连接销（3），并且从 所述主体（2）用于电子印刷电路板（4）上的电连接。 主体（2）具有散热集管（5），其具有至少一个从主体（2）出来并放置在平面（P）上的表面，而销（3）从主体（2）伸出，用于第一部分 最初平行于平面（P）延伸。 有利的是，一对（7,8）的销（3）具有基本上U形的弯曲，在第一部分平行于平面（P）之后，用于在焊接步骤期间允许部件（1）的更稳定的轴承 散热中间管芯（9）。

公开(公告)号：EP1182768A3

公开(公告)日：2004-12-15

申请号：EP01307112.1

申请日：2001-08-21

Applicant: VLT CORPORATION

Inventor： Saxelby, John R. Jr. ,  Vinciarelli, Patrizio ,  Evans, Michael D.

IPC: H02M3/00 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K5/064 ,  H01L2224/05553 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K3/284 ,  H05K7/209 ,  H05K2201/1056 ,  H05K2201/10734 ,  H01L2924/00014

Abstract: A power converter assembly includes a heat sinking plate, a circuit board structure having a side that faces and is spaced by a gap from a surface of the heat sinking plate that is nearer to said side, a relatively thin, high heat density, dissipative semiconductor component mounted on said side, an encapsulating material filling the gap, and relatively taller, lower heat density, components mounted on the other side of the circuit board, the gap being characterized by an average thermal-resistance of less than 1 °C - in 2 /Watt.

公开(公告)号：EP1139019A1

公开(公告)日：2001-10-04

申请号：EP01301595.3

申请日：2001-02-22

Applicant: Relume Corporation

Inventor： Hochstein, Peter A.

IPC: F21V29/00 ,  H01L33/00 ,  H05K1/02

CPC classification number: F21V29/70 ,  F21V29/004 ,  F21V29/713 ,  F21Y2115/10 ,  H01L33/642 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/1056 ,  Y10S362/80

Abstract: A heat dissipater (30) of a metallic or metal material is disposed in parallel relationship to a circuit board (12) . The assembly is characterized by the circuit board 12 presenting a hole (32) therethrough and surrounding each of a plurality of LEDs (20, 22 or 24). A heat sink (28) integral with each LED (20, 22 or 24) is disposed in thermal contact with the heat dissipater (30) for conveying heat from the LEDs (20, 22 and 24) to the heat dissipater (30) . In other words, each LED (20, 22 or 24) extends through the hole (32) in the circuit board (12) with the light emitting portion or lens (34) extending from one of the surfaces (14 or 16) of the circuit board (12) and the heat sink (28) extending from the other one of the surfaces (14 or 16) of the circuit board (12). A thermal coupling agent (36 or 38) is disposed between the heat sink (28) and the heat dissipater (30) for providing a full thermal path between the heat sink (28) and the heat dissipater (30). In Figure 3, the first surface (14) of the circuit board (12), with the electrical leads (26) soldered or adhesively attached to the traces (18) thereon, faces the heat dissipater (30). The circuit board (12) is spaced from the heat dissipater (30) and, in Figure 3, the traces (18) face the heat dissipater. A step in the fabrication of the present invention is the disposing of a thermally insulating cap (40) around the heat sink (28) while disposing the LED (24) on the circuit board (12) to protect the LED from damage during soldering.

Abstract translation: 金属或金属材料的散热器（30）与电路板（12）平行地设置。 组件的特征在于电路板12呈现穿过其中并围绕多个LED（20,22或24）中的每一个的孔（32）。 与每个LED（20,22或24）成一体的散热器（28）设置成与散热器（30）热接触，用于将热量从LED（20,22和24）输送到散热器（30）。 换句话说，每个LED（20,22或24）延伸穿过电路板（12）中的孔（32），发光部分或透镜（34）从其中一个（14或16）延伸出来 电路板（12）和从电路板（12）的另一个表面（14或16）延伸的散热器（28）。 热耦合剂（36或38）设置在散热器（28）和散热器（30）之间，用于在散热器（28）和散热器（30）之间提供完整的热路径。 在图3中，电路板（12）的第一表面（14）与其上焊接或粘附到其上的迹线（18）上的电引线（26）面对散热器（30）。 电路板（12）与散热器（30）间隔开，并且在图3中，迹线（18）面向散热器。 本发明制造的一个步骤是在将LED（24）放置在电路板（12）上的同时，将热绝缘帽（40）设置在散热器（28）周围，以保护LED在焊接期间免受损坏。

公开(公告)号：EP0779775B1

公开(公告)日：1999-04-28

申请号：EP96402679.3

申请日：1996-12-10

Applicant: VALEO ELECTRONIQUE

Inventor： Herzberger, Erick ,  Wacheux, Patrick ,  Nicolai, Jean-Marc ,  Cassese, Bruno

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K1/0256 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/0338 ,  H05K2201/09063 ,  H05K2201/1056 ,  H05K2201/10977

公开(公告)号：EP0449640B1

公开(公告)日：1994-11-09

申请号：EP91302781.9

申请日：1991-03-28

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： Hayasi, Satoru, c/o Mitsubishi Denki K.K.

IPC: H05K7/20 ,  H01L23/40

CPC classification number: H05K1/0203 ,  H01L23/4006 ,  H01L24/01 ,  H01L2023/4031 ,  H01L2023/4062 ,  H01L2924/181 ,  H02M7/003 ,  H05K3/325 ,  H05K7/20436 ,  H05K7/20463 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10015 ,  H05K2201/10409 ,  H05K2201/1056 ,  H01L2924/00

公开(公告)号：EP2188839B1

公开(公告)日：2018-07-25

申请号：EP08785242.2

申请日：2008-07-31

Applicant: SEW-EURODRIVE GmbH & Co. KG

Inventor： POLJAK, Anton

IPC: H01L25/11 ,  H01L25/16 ,  H01L23/40 ,  H05K1/02 ,  H05K1/18 ,  H05K7/20 ,  H05K3/46 ,  H05K3/28 ,  H05K3/00 ,  H05K1/14

CPC classification number: H01L25/162 ,  H01L23/40 ,  H01L25/115 ,  H01L2023/4081 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/148 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/4691 ,  H05K7/20463 ,  H05K7/2049 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/1056 ,  H05K2203/1316 ,  H01L2924/00