公开(公告)号：EP2069429B1

公开(公告)日：2015-05-27

申请号：EP07837857.7

申请日：2007-09-06

Applicant: Siemens Energy, Inc.

Inventor： STEVENS, Gary ,  SMITH, James, D., B. ,  WOOD, John, W.

IPC: C08K3/14 ,  C08K3/22 ,  C08K3/28 ,  C08K9/08 ,  H05K1/03

CPC classification number: H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0248 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31993

公开(公告)号：EP2851907A1

公开(公告)日：2015-03-25

申请号：EP13790886.9

申请日：2013-05-08

Applicant: Material Concept, Inc.

Inventor： KOIKE, Junichi ,  HOANG, Tri Hai

IPC: H01B1/22 ,  B22F1/00 ,  C22C9/00 ,  H01B1/00 ,  H01B13/00 ,  H01L31/04 ,  H05K1/09 ,  H05K3/12

CPC classification number: H01L31/02013 ,  B22F1/0011 ,  B22F1/0059 ,  C22C1/0425 ,  C22C9/00 ,  H01B1/026 ,  H01B1/22 ,  H01L31/022425 ,  H05K1/092 ,  H05K3/1291 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2203/1131 ,  Y02E10/50 ,  Y10T428/2982

Abstract: This conductive paste is such that the printing properties and sintering properties are superior and is formed such that resistance of wiring after sintering is lowered. This conductive paste is characterized by being formed from copper-based metal particles and by an aspect ratio (dmax/dmin), which is defined as the ratio of the maximum diameter (dmax) and minimum diameter (dmin) for the metal particles, being greater than or equal to 1.0 and smaller than 2.2.

公开(公告)号：EP2653016A1

公开(公告)日：2013-10-23

申请号：EP11802185.6

申请日：2011-11-12

Applicant: Carestream Health, Inc.

Inventor： ZOU, Chaofeng ,  STEBBINS, Mathew, T. ,  DAWSON, Jennifer, C. ,  ECKERT, Karissa, L. ,  LABELLE, Gary, E.

IPC: H05K1/09 ,  B41M1/10 ,  H01B1/22

CPC classification number: H05K1/095 ,  B41M1/10 ,  H01B1/22 ,  H05K3/1275 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/026

Abstract: Methods for gravure printing of transparent conductive films comprising metal nanowires. Such films exhibiting low resistivity and superior coating uniformity may be used in electronic or optical articles. When the gravure cell opening size approches the average wire length distribution, the gravure cells can behave like an effective filter that allows only small amounts of short wires to be incorporated into the grooves. Use of gravure cells with larger cell opening sizes can allow nanowires to enter gravure cells without such severe skewing of the wire size distribution in the cells.

公开(公告)号：EP2450911A4

公开(公告)日：2013-04-17

申请号：EP11783348

申请日：2011-04-13

Applicant: TOKAI RUBBER IND LTD

Inventor： TAKAHASHI WATARU ,  YOSHIKAWA HITOSHI ,  KOBAYASHI JUN

IPC: H01B5/14 ,  C08K7/04 ,  C08L21/00 ,  G01L1/20 ,  G06F3/044 ,  H01L29/84 ,  H02N1/00 ,  H05K1/09

CPC classification number: H05K1/095 ,  C08K2201/001 ,  G06F3/044 ,  H01L41/0478 ,  H02N1/006 ,  H05K1/162 ,  H05K2201/0133 ,  H05K2201/0245 ,  H05K2201/0248

公开(公告)号：EP2082436A2

公开(公告)日：2009-07-29

申请号：EP07844249.8

申请日：2007-10-12

Applicant: Cambrios Technologies Corporation

Inventor： ALLEMAND, Pierre-Marc ,  DAI, Haixia ,  NA, Shuo ,  PAKBAZ, Hash ,  PSCHENITZKA, Florian ,  QUAN, Xina ,  SEPA, Jelena ,  SPAID, Michael A.

IPC: H01L31/0224

CPC classification number: H01L31/022425 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01B1/02 ,  H01L27/1421 ,  H01L29/0669 ,  H01L29/413 ,  H01L31/022466 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/1884 ,  H01L33/38 ,  H01L33/40 ,  H01L51/0021 ,  H01L51/0048 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5212 ,  H05K1/095 ,  H05K1/097 ,  H05K3/06 ,  H05K3/245 ,  H05K3/249 ,  H05K9/009 ,  H05K9/0092 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  Y02E10/549 ,  Y02P70/521 ,  Y10S977/95 ,  Y10T29/49155

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可以嵌入矩阵中的纳米线网络。 导电层是透明的，可图案化的，并且适合作为诸如触摸屏，液晶显示器，等离子体显示面板等的视觉显示装置中的透明电极。

公开(公告)号：EP2069430A1

公开(公告)日：2009-06-17

申请号：EP07836993.1

申请日：2007-08-17

Applicant: Siemens Energy, Inc.

Inventor： STEVENS, Gary ,  SMITH, James, D., B. ,  WOOD, John, W.

IPC: C08K3/28 ,  C08K3/22 ,  C08K3/38

CPC classification number: C09K5/14 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0248 ,  Y10T428/249959 ,  Y10T428/252 ,  Y10T428/26 ,  Y10T428/2916

Abstract: A high thermal conductivity resin that has a host resin matrix, and a high thermal conductivity filler. The high thermal conductivity filler ( 30 ) forms a continuous organic-inorganic composite with the host resin matrix. The fillers are from 1-1000 nm in length, and have average aspect ratios of between 3-100. At least a portion of the high thermal conductivity fillers comprise morphologies ( 31 ) chosen from one or more of hexagonal, cubic, orthorhombic, rhombohedral, tetragonal, whiskers and tubes. In particular, some of the fillers will aggregate into secondary structures.

公开(公告)号：EP1475170A3

公开(公告)日：2006-05-24

申请号：EP04252631.9

申请日：2004-05-06

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Shimoda, Kohei, c/o Osaka Works of Sumitomo ,  Majima, Masatoshi, c/o Osaka Works of Sumitomo ,  Koyama, Keiji, c/o Osaka Works of Sumitomo ,  Okada, Issei, c/o Osaka Works of Sumitomo ,  Kuwabara, Tetsuya, c/o Osaka Works of Sumitomo

IPC: B22F1/00 ,  B22F9/24

CPC classification number: H05K3/321 ,  B22F1/0007 ,  B22F1/0022 ,  B22F1/0096 ,  B22F9/24 ,  B22F2998/00 ,  B82Y30/00 ,  C08K3/08 ,  C09D5/24 ,  H01B1/02 ,  H01B1/22 ,  H05K2201/0248 ,  C08L21/00

Abstract: A metal powder composed of nickel or an alloy thereof and used for a producing a conductivity-afforded material is provided, in which particles are integrated in particle aggregates having a chain structure. The average diameter of the particle aggregates is in the range of 30 to 200 nm, and the average length thereof is in the range of 0.5 to 50 µm. The increased conductivity bestowing effect can be obtained by the addition of a small amount of the metal powder.

公开(公告)号：EP0763562B1

公开(公告)日：2000-11-22

申请号：EP96306669.1

申请日：1996-09-13

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Okano, Norio ,  Kobayashi, Kazuhito ,  Nakaso, Akishi

IPC: C08K7/02 ,  C08J5/04 ,  C08J5/24 ,  H05K1/03

CPC classification number: C08K7/02 ,  C08J5/24 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/0278 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249995 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/269 ,  Y10T428/2949 ,  Y10T428/31529

公开(公告)号：EP0873047A3

公开(公告)日：1999-11-24

申请号：EP98106742.4

申请日：1998-04-14

Applicant: HITACHI CHEMICAL CO., LTD.

Inventor： Kobayashi, Kazuhito ,  Kumashiro, Yasushi ,  Takahashi, Atsushi ,  Morita, Koji ,  Tanabe, Takahiro ,  Yamamoto, Kazunori ,  Nakaso, Akishi ,  Arike, Shigeharu ,  Otsuka, Kazuhisa ,  Urasaki, Naoyuki ,  Fujimoto, Daisuke ,  Takano, Nozomu

IPC: H05K3/46

CPC classification number: H05K3/4655 ,  C09D5/00 ,  H05K1/0373 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249946 ,  Y10T428/249952

Abstract: An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

公开(公告)号：EP0873047A2

公开(公告)日：1998-10-21

申请号：EP98106742.4

申请日：1998-04-14

Applicant: HITACHI CHEMICAL CO., LTD.

Inventor： Kobayashi, Kazuhito ,  Kumashiro, Yasushi ,  Takahashi, Atsushi ,  Morita, Koji ,  Tanabe, Takahiro ,  Yamamoto, Kazunori ,  Nakaso, Akishi ,  Arike, Shigeharu ,  Otsuka, Kazuhisa ,  Urasaki, Naoyuki ,  Fujimoto, Daisuke ,  Takano, Nozomu

IPC: H05K3/46

CPC classification number: H05K3/4655 ,  C09D5/00 ,  H05K1/0373 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249946 ,  Y10T428/249952

Abstract: An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

Abstract translation: 绝缘漆包含树脂组分，电绝缘须晶，和如果需要，一种或多种添加剂：如在离子吸附剂，和/或用于通过将所述添加剂加入树脂成分和所述晶须由铜防止损伤，产生的有机试剂 或过滤晶须，或通过使用珠磨机或三辊磨，或类似的研磨，是优良的用于生产具有高布线密度，高可靠性和其它电性能优良的多层印刷电路板。