公开(公告)号：EP2792483B1

公开(公告)日：2016-10-19

申请号：EP12865468.8

申请日：2012-01-13

Applicant: JX Nippon Mining & Metals Corporation

Inventor： TANAKA, Koichiro ,  KAMMURI, Kazuki

IPC: B32B15/08 ,  H05K1/02

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f 3 x t 3 )/(f 2 x t 2 ) => 1 wherein t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4%, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1

公开(公告)号：EP3031046A1

公开(公告)日：2016-06-15

申请号：EP14834654.7

申请日：2014-08-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： KIM, Song Hyeon ,  LEE, Jeong Roh ,  JUNG, Jin ,  HWANG, Kwang Sung ,  JUNG, Sung Soo

IPC: G09F9/00

CPC classification number: H05K5/0017 ,  G02F1/133305 ,  G02F1/133308 ,  G09F9/301 ,  H02K7/116 ,  H02P31/00 ,  H04N5/64 ,  H05K2201/05

Abstract: Disclosed herein is a display apparatus which may be selectively used in a flat state or a curved state. The display apparatus includes a display module that displays an image and is provided to be bent, and a bending device that is provided to enable the display module to be transformed into a flat state or a curved state. Here, the bending device includes a frame that is provided at a rear side of the display module and a hinge unit that connects between the frames and is provided to enable curvature of the frame to vary by torque.

Abstract translation: 本文公开了可以选择性地以平坦状态或弯曲状态使用的显示设备。 该显示装置包括显示图像并被设置为弯曲的显示模块以及被设置为使得显示模块能够变成平坦状态或弯曲状态的弯曲装置。 这里，弯曲装置包括设置在显示模块的后侧的框架和连接框架之间的铰链单元，铰链单元设置成使得框架的曲率能够通过扭矩而变化。

公开(公告)号：EP2843519A3

公开(公告)日：2015-04-08

申请号：EP14182146.2

申请日：2014-08-25

Applicant: LG Innotek Co., Ltd.

Inventor： Her, Jae Hak

IPC: G06F3/044

CPC classification number: G06F3/045 ,  B82Y10/00 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/0393 ,  H05K2201/0326 ,  H05K2201/05 ,  H05K2201/10128 ,  Y10S977/952

Abstract: Disclosed are a touch window and a touch device including the same. The touch window includes first and second areas, wherein the second area is bentable from the first area.

公开(公告)号：EP3386375A1

公开(公告)日：2018-10-17

申请号：EP16813045.8

申请日：2016-11-21

Applicant: The Charles Stark Draper Laboratory, Inc.

Inventor： KARPMAN, Maurice S. ,  MEULLER, Andrew

IPC: A61B5/00 ,  A61B5/04

CPC classification number: A61N1/0502 ,  A61B5/04001 ,  A61B5/685 ,  A61B2562/043 ,  A61B2562/125 ,  A61N1/0551 ,  A61N1/36139 ,  H05K1/028 ,  H05K1/09 ,  H05K1/111 ,  H05K3/0026 ,  H05K3/40 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/05 ,  H05K2201/09372 ,  H05K2203/107

Abstract: The present disclosure describes a closely spaced array of penetrating electrodes. In some implementations, the electrodes of the array are spaced less than 50 μm apart. The present disclosure also describes methods for manufacturing the closely spaced array of penetrating electrodes. In some implementations, each row of electrode of the array is manufactured in-plane and then coupled to other rows of electrodes to form an array.

公开(公告)号：EP3257036A1

公开(公告)日：2017-12-20

申请号：EP15851645.0

申请日：2015-09-18

Applicant: BOE Technology Group Co., Ltd.

Inventor： LI, Wusheng ,  KIM, Ki Man

IPC: G09F9/30 ,  G06F3/041

CPC classification number: G02B5/021 ,  B05D1/005 ,  G02B1/14 ,  G02B5/003 ,  G02B5/02 ,  G02B5/0215 ,  G02B5/0221 ,  G02B5/0226 ,  G02B5/0268 ,  G03F7/70025 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  H05K1/028 ,  H05K2201/05

Abstract: The present disclosure provides a display substrate. The display substrate includes a substrate having a display area and a border area surrounding the display area; a non-black photo-resist layer formed on the substrate in the border area; and a black photo-resist layer formed on the non-black photo-resist layer. The non-black photo-resist layer interfaces the black photo-resist layer with a diffusion structure.

公开(公告)号：EP3218928A1

公开(公告)日：2017-09-20

申请号：EP14889185.6

申请日：2014-11-12

Applicant: Intel Corporation

Inventor： TANG, Jiamiao ,  ZHAO, Junfeng ,  SKINNER, Michael P. ,  SHE, Yong ,  SIR, Jiun Hann ,  CHEAH, Bok Eng ,  PERIAMAN, Shanggar ,  OOI, Kooi Chi ,  CHEW, Yen Hsiang

IPC: H01L23/28

CPC classification number: G06F1/163 ,  A41B1/00 ,  A41D1/06 ,  A41D1/08 ,  A41F9/002 ,  A43B3/001 ,  A43B3/0015 ,  A43B7/141 ,  A44C5/0015 ,  A44C15/005 ,  F03G5/06 ,  G06F1/189 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/0002 ,  H01L2924/181 ,  H02J1/14 ,  H05K1/189 ,  H05K2201/05 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards an integrated circuit (IC) package. In embodiments, an integrated circuit (IC) package may include a flexible substrate (102). The flexible substrate (102) may have a plurality of dies (104 -112) coupled therewith. The IC package may include a first encapsulation material (116-120), having a first rigidity, disposed on the flexible substrate (102) to at least partially encapsulate each die of the plurality dies (104 -112). The IC package may further include a second encapsulation material (122), having a second rigidity, disposed on the flexible substrate (102). In embodiments, the second rigidity and the first rigidity are different from one another. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例针对集成电路（IC）封装。 在实施例中，集成电路（IC）封装可以包括柔性衬底。 柔性衬底可以具有与其耦合的多个管芯。 IC封装可以包括具有第一刚性的第一封装材料，该第一封装材料设置在柔性衬底上以至少部分地封装多个管芯中的每个管芯。 IC封装可以进一步包括设置在柔性基板上的具有第二刚性的第二封装材料。 在实施例中，第二刚性和第一刚性彼此不同。 其他实施例可以被描述和/或要求保护。

公开(公告)号：EP3010061A4

公开(公告)日：2017-03-15

申请号：EP14829978

申请日：2014-07-24

Applicant: LG DISPLAY CO LTD

Inventor： OH DUCKSU ,  PARK SUNG SOO ,  KANG MINSOO

IPC: H01L51/52 ,  G09F9/00 ,  H05B33/06 ,  H05K3/36

CPC classification number: H05K1/142 ,  H01L51/5203 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/147 ,  H05K3/361 ,  H05K3/363 ,  H05K3/403 ,  H05K2201/0397 ,  H05K2201/05 ,  H05K2201/097 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

Abstract translation: 提供了一种安装在显示装置中的基板上的柔性印刷电路板。

公开(公告)号：EP3052294A1

公开(公告)日：2016-08-10

申请号：EP14789923.1

申请日：2014-10-01

Applicant: NIKE Innovate C.V.

Inventor： STILLMAN, Martine ,  WEITMANN, Dane

IPC: B29C45/84 ,  B29C45/14 ,  B29C45/16 ,  G06F1/16 ,  C23C28/00

CPC classification number: B29C45/14836 ,  A61B5/681 ,  A61B2503/10 ,  A61B2560/04 ,  B29C45/14639 ,  B29C45/14819 ,  B29C2045/14844 ,  B29K2021/003 ,  B29K2063/00 ,  B29L2031/3468 ,  G04G17/04 ,  G06F1/163 ,  G06F1/1635 ,  H01M2/1055 ,  H01M2/1066 ,  H01M2/1094 ,  H01M10/425 ,  H05K1/181 ,  H05K2201/05 ,  H05K2201/10037 ,  H05K2201/10977

Abstract: A portable electronic device commonly includes one or more batteries. Further, a portable electronic device may be manufactured using one or more overmolding techniques to achieve certain aesthetic and/or mechanical characteristics. Batteries within the portable electronic device may be overmolded by using a covering, wherein the covering includes a protective layer such that the batteries are not exposed to the high temperatures and high pressures associated with an overmolding process which may be in excess of temperature and pressure thresholds associated with the batteries.

公开(公告)号：EP3010061A1

公开(公告)日：2016-04-20

申请号：EP14829978.7

申请日：2014-07-24

Applicant: LG Chem, Ltd.

Inventor： OH, Ducksu ,  PARK, Sung Soo ,  KANG, Minsoo

IPC: H01L51/52 ,  H05B33/06 ,  G09F9/00

CPC classification number: H05K1/142 ,  H01L51/5203 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/147 ,  H05K3/361 ,  H05K3/363 ,  H05K3/403 ,  H05K2201/0397 ,  H05K2201/05 ,  H05K2201/097 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

Abstract translation: 提供了安装在显示装置中的基板上的柔性印刷电路板。

公开(公告)号：EP2792483A4

公开(公告)日：2015-08-19

申请号：EP12865468

申请日：2012-01-13

Applicant: JX NIPPON MINING & METALS CORP

Inventor： TANAKA KOICHIRO ,  KAMMURI KAZUKI

IPC: B32B15/08 ,  H05K1/02

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f 3 x t 3 )/(f 2 x t 2 ) => 1 wherein t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4%, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1