公开(公告)号：WO2008156658A1

公开(公告)日：2008-12-24

申请号：PCT/US2008/007380

申请日：2008-06-13

Applicant: FLEXTRONICS AP LLC ,  GORCEA, Dan

Inventor： GORCEA, Dan

IPC: H05K3/00 ,  B32B3/10 ,  H01L23/48

CPC classification number: H05K1/0248 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/09336 ,  H05K2201/09627 ,  H05K2201/0979 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31511

Abstract: In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

Abstract translation: 根据第一实施例，本发明提供了一种包括第一表面的电路基板; 第二表面 第一通孔具有靠近所述第一表面的第一端和靠近所述第二表面的第二端; 第二通孔，其具有靠近所述第一表面的第一端和靠近所述第二表面的第二端; 电连接所述第一通孔的所述第一端和所述第二通孔的所述第一端的第一导电元件; 电连接所述第一通孔的所述第二端和所述第二通孔的所述第二端的第二导电元件; 耦合到所述第一通孔的输入信号线; 以及耦合到所述第二通孔的输出信号线。

公开(公告)号：WO2008021217A1

公开(公告)日：2008-02-21

申请号：PCT/US2007/017763

申请日：2007-08-10

Applicant: TYCO ELECTRONICS CORPORATION ,  BARTHOLOMEW, Victor, L.

Inventor： BARTHOLOMEW, Victor, L.

IPC: H05K1/02

CPC classification number: H05K1/0219 ,  H05K1/0201 ,  H05K1/0293 ,  H05K1/117 ,  H05K3/3405 ,  H05K3/3452 ,  H05K2201/0305 ,  H05K2201/062 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09354 ,  H05K2201/0969 ,  H05K2201/10356 ,  H05K2203/173 ,  Y10S439/943 ,  Y10T29/49155

Abstract: A transition circuit board (100) for transitioning a cable to a connector is provided. A circuit board has an outer surface (104) with a circuit trace (106), ground plane (120) and ground link (118) provided thereon. A cable pad (114) and a contact pad (116) are provided at opposite ends of the circuit trace. The ground link is electrically common with the ground plane and is located adjacent to, and separated by a space from, the circuit trace. An insulating coating (168) is provided over at least part of the circuit trace, the ground plane and the outer surface of the circuit board. The insulating coating has a mask aperture there-through exposing an uncoated portion of the circuit trace and the ground link. A conductive jumper material is provided on the uncoated portion of the circuit trace and the ground link to electrically join the circuit trace with the ground plane.

Abstract translation: 提供了一种用于将电缆转换到连接器的过渡电路板（100）。 电路板具有带有电路迹线（106），设置在其上的接地平面（120）和接地连接（118）的外表面（104）。 在电路迹线的相对端设有电缆垫（114）和接触垫（116）。 接地链路与接地平面电气相同，并且位于与电路迹线相邻并由电路迹线隔开的空间。 绝缘涂层（168）设置在电路板的至少一部分，接地平面和电路板的外表面上。 绝缘涂层在其上具有掩模孔，通过暴露电路迹线的未涂覆部分和接地链路。 在电路迹线的未涂覆部分和接地链路上提供导电跳线材料，以将电路迹线与接地平面电连接。

公开(公告)号：WO2003075393A1

公开(公告)日：2003-09-12

申请号：PCT/JP2003/002584

申请日：2003-03-05

Applicant: ソニー株式会社 ,  小瀬村 孝彦 ,  奥洞 明彦

Inventor： 小瀬村 孝彦 ,  奥洞 明彦

IPC: H01P3/02

CPC classification number: H01L23/66 ,  H01L23/49838 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/19015 ,  H01L2924/19105 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/024 ,  H05K1/165 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/10674

Abstract: A high frequency module having a high frequency circuit part (3) formed on a base substrate part (2). The high frequency circuit part (3) having a multilayer wiring layer, each having a wiring pattern or a filming element formed on a dielectric insulation layer, where a large number of lands (22) and a ground pattern (20) are formed on the uppermost wiring layer (17) along with a wiring pattern and an inductor element (19), and a semiconductor chip (4) being mounted on the wiring layer (17) at the high frequency circuit part (3) are provided on a planarized buildup forming plane (16) at the base substrate part (2). A transmission line (24) formed in the wiring layer (17) and connecting between the inductor element (19) and specified lands (22) is led through a punched pattern region (20c) formed in the ground pattern (20), thus constituting a coplanar transmission line.

Abstract translation: 具有形成在基底部分（2）上的高频电路部分（3）的高频模块。 具有多层布线层的高频电路部分（3），每个具有布线图案或形成在介电绝缘层上的成膜元件，其中在该绝缘层上形成有多个焊盘（22）和接地图案（20） 最上面的布线层（17）以及布线图案和电感器元件（19），以及安装在高频电路部分（3）的布线层（17）上的半导体芯片（4）设置在平坦化的堆积 在基底部分（2）处形成平面（16）。 形成在布线层（17）中并且连接在电感器元件（19）和指定的焊盘（22）之间的传输线（24）被引导通过形成在接地图案（20）中的穿孔图案区域（20c），从而构成 共面传输线。

公开(公告)号：WO1991003144A1

公开(公告)日：1991-03-07

申请号：PCT/US1990004801

申请日：1990-08-22

Applicant: AST RESEARCH, INC.

Inventor： AST RESEARCH, INC. ,  BARAN, Jozef, B.

IPC: H05K01/14

CPC classification number: H05K1/0219 ,  H05K1/0218 ,  H05K3/429 ,  H05K9/0039 ,  H05K2201/09336 ,  H05K2201/09618 ,  H05K2201/10015 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A multi-layer printed circuit board is constructed to suppress radio frequency interference (RFI) generated by high frequency clock and data signals therein. Suppression is achieved by positioning clock lines (254) carrying the clock signal on a first voltage reference layer (152) proximate to a second voltage reference layer (154). The two layers shield the clock signal from the signal lines on other layers. Noise may be further reduced by forming bridges (270) in the second voltage reference layer (154) proximate to the clock lines so that the bridges (270) span the width of the clock line. Capacitors are also preferably utilized to further suppress radiated noise. The capacitors provide AC coupling between the first and second voltage reference layers (152, 154) so that a low impedance path is provided for high frequency noise generated by the clock signal. The second voltage reference layer (154) thus operates as an effectively continuous shield between the bridges (270).

公开(公告)号：EP3160216A1

公开(公告)日：2017-04-26

申请号：EP15290273.0

申请日：2015-10-21

Applicant: NXP B.V.

Inventor： Gamand, Patrice ,  Ansari, Kimia

IPC: H05K1/03 ,  H01Q9/04 ,  D04B1/12

CPC classification number: H05K1/038 ,  H01Q1/273 ,  H01Q9/0407 ,  H05K2201/0281 ,  H05K2201/09336 ,  H05K2201/10098

Abstract: Embodiments of a system are disclosed. In an embodiment, a system includes conductive textile portions and non-conductive textile portions. The conductive textile portions have conductive fibers and the non-conductive textile portions have non-conductive fibers. The conductive textile portions are connected to the non-conductive textile portions in the form of a coplanar antenna system.

Abstract translation: 公开了一种系统的实施例。 在一个实施例中，系统包括导电织物部分和非导电织物部分。 导电织物部分具有导电纤维，并且非导电织物部分具有非导电纤维。 导电织物部分以共面天线系统的形式连接到非导电织物部分。

公开(公告)号：EP2830405A4

公开(公告)日：2015-11-25

申请号：EP13765103

申请日：2013-02-08

Applicant: HITACHI AUTOMOTIVE SYSTEMS LTD

Inventor： KADOYA KIYOOMI ,  ISHIDA RYOSUKE ,  MAYUZUMI TAKUYA ,  HOSHINO KENICHI ,  OKADA YASUHIKO ,  SUGIYAMA YASUSHI

IPC: H05K9/00

CPC classification number: H05K9/0064 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/0224 ,  H05K1/0298 ,  H05K5/006 ,  H05K9/0039 ,  H05K2201/09336 ,  H05K2201/10371

公开(公告)号：EP2801123A4

公开(公告)日：2015-10-21

申请号：EP12864500

申请日：2012-11-01

Applicant: CRAY INC

Inventor： KIM HYUNJUN ,  CONGER JEFFREY SCOTT ,  SCOTT GREGORY ERWIN

IPC: H05K1/02 ,  H01R12/57

CPC classification number: H05K1/0225 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09609 ,  H05K2201/09618 ,  Y10T29/49155 ,  Y10T29/49165

公开(公告)号：EP1723689B1

公开(公告)日：2014-10-15

申请号：EP04795893.9

申请日：2004-10-18

Applicant: RAYTHEON COMPANY

Inventor： TONOMURA, Samuel, D.

IPC: H01P1/16 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L25/16 ,  H01P1/20 ,  H01Q15/00 ,  H05K1/02

CPC classification number: H01P1/16 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/01046 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/19032 ,  H01L2924/3025 ,  H01P1/2005 ,  H01Q15/006 ,  H05K1/0236 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09681 ,  H01L2924/00

公开(公告)号：EP2391191A1

公开(公告)日：2011-11-30

申请号：EP10164333.6

申请日：2010-05-28

Applicant: Thales

Inventor： Denis, Stéphane ,  Cazenave, Jean-Pierre ,  Haquet, Gérard

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0228 ,  H01L23/66 ,  H01L2223/6633 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01P5/028 ,  H05K1/0239 ,  H05K2201/09336 ,  H05K2201/09781 ,  H05K2201/10363 ,  H05K2201/1053 ,  H01L2924/00

Abstract: Dispositif d'interconnexion (100) de circuits électroniques, notamment de circuits électroniques hyperfréquence, caractérisé en ce qu'il comprend au moins une ligne de transmission (103) couplée à une ligne de masse (104), les deux lignes (103, 104) étant réalisées sur une face d'un substrat diélectrique (101), au moins une surface de métallisation formant sur l'autre face du substrat diélectrique (101) au moins un élément de couplage (102) disposé sur une surface sensiblement égale à la surface occupée par la ligne de transmission (103) et la ligne de masse (104), l'interconnexion se réalisant sensiblement au niveau des extrémités de la ligne de transmission (103) et de la ligne de masse (104).

Abstract translation: 所述装置（100）具有连接到接地线（104），其中，所述传输线和接地线的在电介质基片（101）的一侧形成的传输线（103）。 金属化表面上形成所述电介质基板的另一侧的耦合元件，用于传输线和接地之间的电耦合的加强。 所述耦合元件被设置等于由传输线和接地线，其中互连在所述传输线和接地线的端部上形成占据的表面的表面上。

公开(公告)号：EP2184964A2

公开(公告)日：2010-05-12

申请号：EP09159298.0

申请日：2003-01-23

Applicant: Mitsubishi Materials Corporation ,  Panasonic Corporation

Inventor： Yamaguchi, Kunio ,  Kimura, Ryouhei ,  Tanaka, Atsushi ,  Morozumi, Kenyu

IPC: H05K9/00 ,  H05K1/02 ,  H03H9/02

CPC classification number: H05K1/0243 ,  H03H9/0259 ,  H03H9/02913 ,  H05K1/111 ,  H05K2201/09063 ,  H05K2201/09281 ,  H05K2201/09336 ,  H05K2201/10083

Abstract: A protective member (315) which has a surface which is coated with, for example, a conductive sheet or the like is carried upon the surface (311A) of the SAW filter (311) which has been mounted in the fitting region (313) upon the printed substrate (312). Here, within the conductive surface of the protective member (315), by surface contact with the surface (311A) of the SAW filter (311), the size of a conductive coating surface (315A) of the protective member which covers this surface (311A) is set so as to be the same as the size of the surface (311A) of the SAW filter (311), or to be smaller than the size thereof.
Furthermore a shield frame member (316) which is shaped as a frame and which is made from a metal (for example from copper or the like) is provided so as to surround the periphery of the fitting region (313) for the SAW filter (311) and moreover a shield lid member (317) which is shaped as a lid and which is made from a metal (for examplefrom copper or the like) is provided so as to be sandwiched from both sides by the printed substrate (312).

Abstract translation: 在已安装在安装区域（313）中的SAW滤波器（311）的表面（311A）上承载具有例如导电片等的表面的保护构件（315） 在印刷基板（312）上。 这里，在保护构件（315）的导电表面内，通过与SAW滤波器（311）的表面（311A）的表面接触，覆盖该表面的保护构件的导电性涂覆面（315A）的尺寸 311A）被设定为与SAW滤波器（311）的表面（311A）的尺寸相同，或者小于其尺寸。 此外，被形成为框架并由金属（例如由铜等制成）的屏蔽框架构件（316）设置成围绕用于SAW滤波器的装配区域（313）的周边 311），并且还设有形成为盖并由金属（例如铜等）制成的屏蔽盖构件317，以便由印刷基板312从两侧夹持。