公开(公告)号：EP3081058A1

公开(公告)日：2016-10-19

申请号：EP14814807.5

申请日：2014-12-10

Applicant: Europlasma nv

Inventor： LEGEIN, Filip ,  ROGGE, Eva ,  MARTENS, Peter

IPC: H05K3/28 ,  B05D1/00

CPC classification number: H05K3/285 ,  B05D1/62 ,  B05D5/08 ,  C09D183/04 ,  C09D183/16 ,  H05K3/282 ,  H05K2201/015 ,  H05K2201/09872 ,  H05K2203/095

Abstract: The present invention concerns a process for the deposition of a solder-through polymer coating on an uncoated printed circuit board which comprises the use of an average low power and low pressure plasma polymerisation in a polymerisation chamber of an organosilane precursor monomer which is introduced into said polymerisation chamber by means of a carrier gas, said organosilane being of the Formula Y1-X-Y2 (I) or -[Si(CH3)2-X-]n- (II), wherein : X is O or NH; Y1 is - Si(Y3)(Y4)Y5; Y2 is Si(Y3')(Y4')Y5'; Y3, Y4, Y5, Υ3', Υ4', and Y5' are each independently H or an alkyl group of up to 10 carbon atoms; the monomer of formula (II) is cyclic wherein n is 2 to 10, and wherein at most one of Y3, Y4 and Y5 is hydrogen, at most one of Υ3', Y4' and Y5' is hydrogen and the total number of carbon atoms is not more than 20.

公开(公告)号：EP2822705A1

公开(公告)日：2015-01-14

申请号：EP13712890.6

申请日：2013-03-06

Applicant: Semblant Limited

Inventor： BROOKS, Andrew ,  VON WERNE, Timothy

IPC: B05D7/00 ,  B05D1/00 ,  H05K3/28

CPC classification number: H05K3/284 ,  B05D1/62 ,  B05D7/54 ,  B05D7/58 ,  B05D2506/10 ,  C08G2261/3424 ,  C09D127/20 ,  C09D165/04 ,  H05K2201/015 ,  H05K2201/09872 ,  H05K2203/095

Abstract: The present invention relates to an electrical assembly which has a conformal coating, wherein said conformal coating is obtainable by a method which comprises plasma polymerization of a compound of formula (I) and deposition of the resulting polymer and plasma polymerization of a fluorohydrocarbon and deposition of the resulting polymer: (I) wherein: R
1 represents C
1 -C
3 alkyl or C
2 -C
3 alkenyl; R
2 represents hydrogen, C
1 -C
3 alkyl or C
2 -C
3 alkenyl; R
3 represents hydrogen, C
1 -C
3 alkyl or C
2 -C
3 alkenyl; R
4 represents hydrogen, C
1 -C
3 alkyl or C
2 -C
3 alkenyl; R
5 represents hydrogen, C
1 -C
3 alkyl or C
2 -C
3 alkenyl;; and R
6 represents hydrogen, C
1 -C
3 alkyl or C
2 -C
3 alkenyl.

公开(公告)号：EP2795717A1

公开(公告)日：2014-10-29

申请号：EP12816584.2

申请日：2012-12-21

Applicant: Andrew LLC

Inventor： ZIMMERMAN, Martin

IPC: H01P5/02 ,  H01L23/48 ,  H01Q1/24 ,  H05K3/32

CPC classification number: H03H7/004 ,  H01L2924/0002 ,  H01P5/028 ,  H01Q1/246 ,  H05K1/0225 ,  H05K1/0239 ,  H05K3/28 ,  H05K3/40 ,  H05K2201/0175 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/09618 ,  H05K2201/09872 ,  H01L2924/0001

Abstract: A blind-mate capacitive coupling interconnection between a main module enclosure one or more sub-module enclosures has coupling surfaces each with a ground portion and an aperture, an inner element provided in the aperture, spaced away from the ground portion. The coupling surfaces may be provided, for example, as traces on a printed circuit board. To accommodate a degree of mis-alignment, one of the inner elements may be provided larger than the other. Capacitive coupling between the coupling surfaces occurs when the coupling surfaces are mated together, retained in position, for example, by a mechanical fixture.

Abstract translation: 一个或多个子模块外壳之间的主模块外壳之间的盲配电容耦合互连具有各自具有接地部分和开口的耦合表面，设置在孔中的内部元件，与接地部分间隔开。 耦合表面可以例如设置在印刷电路板上的迹线上。 为了适应一定程度的不对准，内部元件中的一个可以被提供为大于另一个。 耦合表面之间的电容耦合发生在耦合表面配合在一起时，例如通过机械夹具保持在适当位置。

公开(公告)号：EP2618373A1

公开(公告)日：2013-07-24

申请号：EP12151975.5

申请日：2012-01-20

Applicant: Research In Motion Limited

Inventor： Li, Fan Tommy ,  Liu, Tong

IPC: H01L23/552 ,  H05K3/28

CPC classification number: H01L23/552 ,  H01L25/18 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2203/1311 ,  H01L2924/00

Abstract: A mobile wireless communications device may include a portable housing, a printed circuit board (PCB) carried by the portable housing, and at least one electronic component carried by PCB and extending upwardly therefrom. The mobile wireless communications device may also include a conformable, shape-retaining film being vacuum formed onto the at least one electronic component and may include a peripheral edge secured to the PCB and a body portion conforming to the at least one electronic component.
The conformable, shape-retaining film may operate similar to a heat sink, for example, to facilitate removal of heat from a processor, for example. The processor may generate an increased amount of heat compared to other electronic components. Moreover, the conformable, shape-retaining film may also provide increased RF shielding of some electronic components from other circuitry, for example, the wireless transceiver and the antenna of the device.

Abstract translation: 一种移动无线通信设备可以包括一个便携式外壳，由所述便携式外壳承载的印刷电路板（PCB），以及至少一个电子元件由PCB承载并且扩展从那里向上。 因此，该移动无线通信设备可以包括形成在所述至少一个电子部件的贴合的，形状保持的电影为真空，并且可以包括固定到所述印刷电路板和符合所述至少一个电子部件的主体部的周缘。 在适形的，形状保持的电影可以类似于散热器，例如，从处理器便于除去的热，例如。 该处理器可以在热量增加量产生相对于其他电子元件。 更完了，适形的，形状保持片可因此提供从其它电路的一些电子部件的增加的RF屏蔽，例如，无线收发器和所述装置的天线。

公开(公告)号：EP0558114A3

公开(公告)日：1997-05-14

申请号：EP93200333.8

申请日：1993-02-08

Applicant: DELCO ELECTRONICS CORPORATION

Inventor： Litteral, Mary O'Connell

IPC: H05K3/28 ,  B05D1/18 ,  B05D3/06 ,  B05C3/10

CPC classification number: H05K13/0061 ,  B05C3/10 ,  B05D1/18 ,  B05D3/067 ,  H05K3/0091 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1518 ,  H05K2203/1572

Abstract: An automatic vertical dip coater provides for simultaneous ultraviolet curing of a conformal coating on both sides of a circuit board (18). A circuit board (18) to be coated on both sides with a conformal coating is placed on a tool (12) which is advanced towards a dip-coating tank (20) containing a ultraviolet radiation curable conformal coating (48) so that both sides of the circuit board (18) are immersed in said conformal coating to a predetermined position. The coating is then dried by means of opposed ultraviolet lamps (34,36).

Abstract translation: 一种自动垂直浸涂机，用于同时紫外线固化电路板（18）两侧的保形涂层。 将要涂覆在两侧的保形涂层的电路板（18）放置在工具（12）上，该工具（12）朝向包含紫外线辐射固化的保形涂层（48）的浸涂槽（20）前进，使得两侧 将电路板（18）浸入所述保形涂层中至预定位置。 然后通过相对的紫外线灯（34,36）将涂层干燥。

公开(公告)号：EP0501551B1

公开(公告)日：1996-10-09

申请号：EP92200378.5

申请日：1992-02-11

Applicant: DELCO ELECTRONICS CORPORATION

Inventor： O'Connell Litteral,Mary

IPC: B23Q7/00

CPC classification number: H05K3/0091 ,  H05K3/00 ,  H05K13/0061 ,  H05K13/0469 ,  H05K2201/09872 ,  H05K2203/0165 ,  H05K2203/1366 ,  H05K2203/1509 ,  Y10T29/49126 ,  Y10T29/49829 ,  Y10T29/53404

公开(公告)号：EP0710061A1

公开(公告)日：1996-05-01

申请号：EP95402343.8

申请日：1995-10-20

Applicant: COMPAGNIE EUROPEENNE DE COMPOSANTS ELECTRONIQUES LCC

Inventor： Stephan, Ronan ,  Val, Christian

IPC: H05K3/28

CPC classification number: H05K3/284 ,  H05K2201/0179 ,  H05K2201/09872 ,  H05K2203/1322

Abstract: La présente invention a pour objet l'encapsulation de circuits électroniques, encapsulation qui soit hermétique c'est-à-dire qui ne laisse pas passer les gaz et, tout particulièrement, pas la vapeur d'eau.
Selon l'invention, cette encapsulation est réalisée par une couche (13) dont la composition est variable; cette couche est constituée d'un matériau électriquement isolant du côté du circuit imprimé, dont la composition varie avec l'épaisseur de la couche entre matériau organique et matériau minéral, le matériau minéral formant une pellicule hermétique.

Abstract translation: 气密密封用于保护具有引线（12）的表面贴装封装（10）或组件（11），用于通过可变的沉积物（13）粘合到印刷电路板（50）中的电镀通孔（51） 通过在板和包装上形成密封性皮肤的组合。 有机绝缘层优选通过层状N 2等离子体的气体解离产物的聚合而沉积。 前体气体可以是烷氧基硅烷，硅氧烷或硅氮烷或具有末端Si-H基团的其它化合物。

公开(公告)号：EP0578469B1

公开(公告)日：1995-09-27

申请号：EP93305269.8

申请日：1993-07-05

Applicant: NORDSON CORPORATION

Inventor： Boger, Bentley ,  Benecke, Jürgen ,  Cieplik, Arthur ,  Burmester, Thomas ,  Gill, Michael L.

IPC: H05K3/28 ,  B05C5/02 ,  B05D1/26

CPC classification number: B05C5/0291 ,  B05B7/0861 ,  B05C5/0254 ,  B05D1/265 ,  B05D3/042 ,  H05K3/0091 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2201/0989 ,  H05K2203/0126 ,  H05K2203/081 ,  H05K2203/1366 ,  H05K2203/1476 ,  H05K2203/1509 ,  H05K2203/159

公开(公告)号：EP0609478A1

公开(公告)日：1994-08-10

申请号：EP93101857.6

申请日：1993-02-05

Applicant: SPECIALTY COATING SYSTEMS, INC.

Inventor： Bok, Hendrik F.

IPC: H05K3/28

CPC classification number: B05D1/30 ,  B05D3/0254 ,  H05K3/0091 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2203/1105 ,  H05K2203/111 ,  H05K2203/1366 ,  H05K2203/1509

Abstract: Spray coating, particularly flat spray coating of circuit boards. Applicant's method of discrete conformal coating eliminates "railroading" at the edges of the flat spray web and assures precise control of the amount of coating material placed on the circuit board surface, as well as on the varying and complex circuit board components. The method includes pressurizing the coating; longitudinally advancing a surface to be coated, such as a circuit board, beneath the coating, while simultaneously feeding the coating onto the advancing surface as a plural series of aligned droplets extending transversely across the advancing surface. The feeding of coating is triggered "ON/OFF" so as to define longitudinally the series of droplets feeding onto the advancing surface.

Abstract translation: 喷涂，特别是电路板的平面喷涂。 申请人的分立式保形涂层的方法消除了在平面喷涂网边缘处的“铁路”，并且确保精确控制放置在电路板表面上的涂层材料的量以及变化和复杂的电路板部件。 该方法包括加压涂层; 在涂层下方纵向推进待涂覆的表面（例如电路板），同时将涂层作为横向延伸穿过前进表面延伸的多个对准液滴进给到前进表面上。 触发“打开/关闭”涂层的供给，以便纵向地限定供给到前进表面上的一系列液滴。

公开(公告)号：EP0578469A2

公开(公告)日：1994-01-12

申请号：EP93305269.8

申请日：1993-07-05

Applicant: NORDSON CORPORATION

Inventor： Boger, Bentley ,  Benecke, Jürgen ,  Cieplik, Arthur ,  Burmester, Thomas ,  Gill, Michael L.

IPC: H05K3/28 ,  B05C5/02 ,  B05D1/26

CPC classification number: B05C5/0291 ,  B05B7/0861 ,  B05C5/0254 ,  B05D1/265 ,  B05D3/042 ,  H05K3/0091 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2201/0989 ,  H05K2203/0126 ,  H05K2203/081 ,  H05K2203/1366 ,  H05K2203/1476 ,  H05K2203/1509 ,  H05K2203/159

Abstract: Apparatus and methods for producing intermittent, discrete patterns of coating material onto discrete irregular substrate areas, such as electronic circuit boards (10), where the patterns have sharp, square leading and trailing edges (13,16), as well as side edges (14,15). A slot nozzle die (32) has elongated air slots (61,62) along the slot extrusion opening (40). In the operation of the apparatus, the air flow is initiated from both air slots (61,62) prior to the initiation of the coating material flow. Also, the air flow is continued beyond that point in time, when the coating material flow ceases. The delays between the operations of the air flow and the hot melt flow are on the order of micro seconds. Alternatively, the lead and lag air start and stop times on each side of the film of coating material are different to control the exact disposition of the square cut-on and square cut-off coating edge on the circuit board. The air flow carries the film coating material to the circuit board (10) for deposition in discrete areas thereon. The sharp cut-on and cut-off accommodate multiple discrete area coating or multiple automated circuit board coating.

Abstract translation: 用于在离散的不规则衬底区域（例如电子电路板）上产生间断的，离散的涂层材料图案的装置和方法，其中图案具有尖锐的，正方形的前缘和后缘以及侧边缘。 狭缝喷嘴模具沿着狭槽挤出口具有细长的空气槽。 在装置的操作中，在涂层材料流动开始之前，气流从两个空气槽开始。 此外，当涂料流动停止时，气流继续超过该时间点。 空气流动和热熔体流动的操作之间的延迟大约为微秒级。 或者，涂层材料膜两侧的引导和滞后空气开始和停止时间不同，以控制电路板上正方形切割和方形截止涂层边缘的准确布置。 空气流将膜涂层材料运送到电路板上，以便沉积在其上的离散区域中。 尖锐的切割和切割可适应多个离散区域涂层或多个自动化电路板涂层。