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    Element structure, inertial sensor, and electronic apparatus
    181.
    发明专利
    Element structure, inertial sensor, and electronic apparatus 有权
    元件结构，惯性传感器和电子设备

    公开(公告)号：JP2011247768A

    公开(公告)日：2011-12-08

    申请号：JP2010121727

    申请日：2010-05-27

    Applicant: Seiko Epson Corp ,  セイコーエプソン株式会社

    Inventor： TAKAGI NARIKAZU

    IPC: G01P15/125 ,  B81B3/00 ,  G01C19/56 ,  G01P9/04 ,  H01L29/84

    CPC classification number: G01P15/0802 ,  B81B7/02 ,  B81B2201/025 ,  B81B2203/0118 ,  B81C1/00182 ,  B81C2201/019 ,  G01C19/5663 ,  G01P15/125 ,  G01P2015/0828 ,  G01P2015/0837 ,  G01P2015/0877 ,  G01P2015/088 ,  H01G5/18 ,  H01G5/38 ,  H01L28/60

    Abstract: PROBLEM TO BE SOLVED: To facilitate manufacturing of an element structure including a capacitive element.SOLUTION: The element structure includes: a first substrate BS1 including a first support layer 100 and a first movable beam 800a which has one end supported on the first support layer and has a space formed around the other end; and a second substrate BS2 including a second support layer 200 and a first fixed electrode 900a formed on the second support layer and is disposed so as to face the first substrate. A first movable electrode is formed on the first movable beam 800a, and the first fixed electrode and the first movable electrode are disposed so as to face each other with a space therebetween.

    Abstract translation: 要解决的问题：为了便于制造包括电容元件的元件结构。 元件结构包括：第一基板BS1，其包括第一支撑层100和第一可移动梁800a，第一可移动梁800a的一端支撑在第一支撑层上并且具有围绕另一端形成的空间; 以及第二基板BS2，其包括第二支撑层200和形成在第二支撑层上的第一固定电极900a，并且设置成面对第一基板。 第一可动电极形成在第一可移动光束800a上，并且第一固定电极和第一可动电极被设置成彼此面对地设置。 版权所有（C）2012，JPO＆INPIT

    Compact package for moving sensor sensing axis
    182.
    发明专利
    Compact package for moving sensor sensing axis 有权
    用于移动传感器感测轴的紧凑型包装

    公开(公告)号：JP2007155714A

    公开(公告)日：2007-06-21

    申请号：JP2006305141

    申请日：2006-11-10

    Applicant: Honeywell Internatl Inc ,  ハネウェル・インターナショナル・インコーポレーテッド

    Inventor： MACGUGAN DOUGLAS C

    IPC: G01P15/08 ,  G01P9/04

    CPC classification number: B81B7/007 ,  B81B7/0074 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  G01P1/023 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: PROBLEM TO BE SOLVED: To mount a micro electro-mechanical system (MEMS) with a moved sensing axis on an IRSPCB in a sealed IC type package processed by a standard SMT attachment and an assembly process.
    SOLUTION: An attaching device 10 for an MEMS sensor die 28 includes a bracket provided with a die attaching face plane 30 and an interface plane 22 substantially planar and directed orthogonally each other, an electric signal carrier coupled between a die attaching face plane part and the interface plane and for carrying electric, grounding and operation signals, and an electric interface pad 24 attached directly to a printed circuit board PCB.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：在由标准SMT附件和组装过程处理的密封IC型封装中，将带有移动感测轴的微机电系统（MEMS）安装在IRSPCB上。 解决方案：用于MEMS传感器模具28的附接装置10包括：托架，其设置有模具安装面平面30和基本上平面且相互指向的接口平面22;电信号载体，耦合在模具附接面 部分和接口平面并用于承载电气，接地和操作信号，以及直接连接到印刷电路板PCB的电接口焊盘24。 版权所有（C）2007，JPO＆INPIT

    TRANSLATING Z AXIS ACCELEROMETER
    185.
    发明公开
    TRANSLATING Z AXIS ACCELEROMETER 审中-公开
    翻译Z轴加速度计

    公开(公告)号：EP3250932A1

    公开(公告)日：2017-12-06

    申请号：EP16703025.3

    申请日：2016-01-21

    Applicant: InvenSense, Inc.

    Inventor： THOMPSON, Matthew Julian ,  SEEGER, Joseph

    IPC: G01P15/125 ,  G01P15/08 ,  B81B5/00

    CPC classification number: B81B3/0016 ,  B81B3/0037 ,  B81B2201/025 ,  B81B2203/0109 ,  B81B2203/0145 ,  B81B2203/053 ,  G01P15/125 ,  G01P2015/0837 ,  G01P2015/0854 ,  G01P2015/086

    Abstract: A system and method for providing a MEMS sensor are disclosed. In a first aspect, the system is a MEMS sensor that comprises a substrate, an anchor region coupled to the substrate, at least one support arm coupled to the anchor region, at least two guiding arms coupled to and moving relative to the at least one support arm, a plurality of sensing elements disposed on the at least two guiding arms to measure motion of the at least two guiding arms relative to the substrate, and a proof mass system comprising at least one mass coupled to each of the at least two guiding arms by a set of springs. The proof mass system is disposed outside the anchor region, the at least one support arm, the at least two guiding arms, the set of springs, and the plurality of sensing elements.

    MEMS SENSOR DEVICE HAVING INTEGRATED MULTIPLE STIMULUS SENSING
    186.
    发明公开
    MEMS SENSOR DEVICE HAVING INTEGRATED MULTIPLE STIMULUS SENSING 审中-公开
    微机电传感器多功能一体机

    公开(公告)号：EP3159301A1

    公开(公告)日：2017-04-26

    申请号：EP16195086.0

    申请日：2016-10-21

    Applicant: NXP USA, Inc.

    Inventor： Li, Fengyuan ,  McNeil, Andrew C ,  Arvind, Salian ,  Schlarmann, Mark Edward ,  Dawson, Chad

    IPC: B81B3/00 ,  G01L19/00

    CPC classification number: G01P15/125 ,  B81B3/0078 ,  B81B2201/025 ,  B81B2201/0264 ,  G01L9/0042 ,  G01L9/0073 ,  G01L19/0092

    Abstract: A sensor device comprises a device structure (22) and a cap coupled with the device structure to produce a cavity in which components of the sensor device are located. The device structure includes a substrate (28,136,232) and a movable element (30,124,138,194,230) spaced apart from a surface (32,140) of the substrate. A port (34,142,234) extends through the substrate underlying the movable element. A sense element is spaced apart from the movable element and is displaced away from the port. The movable element and the sense element (40,42,146,148,150,152,190,244,246) form an inertial sensor to sense a motion stimulus as movement of the movable element relative to the sense element. An additional sense element (44,155,204,206,208,210,237) together with a diaphragm spans across the port. The movable element and the additional sense element form a pressure sensor for sensing a pressure stimulus from an external environment (84) as movement of the additional sense element together with the diaphragm relative to the movable element.

    Abstract translation: 传感器装置包括装置结构（22）和与装置结构联接的帽，以产生传感器装置的部件所在的空腔。 器件结构包括与衬底的表面（32,140）间隔开的衬底（28,136,232）和可移动元件（30,124,138,194,230）。 端口（34,142,234）延伸穿过可移动元件下方的基板。 感测元件与可移动元件间隔开并且远离端口移位。 可移动元件和感测元件（40,42,146,148,150,152,190,244,246）形成惯性传感器，以感测运动刺激作为可移动元件相对于感测元件的移动。 附加感测元件（44,155,204,206,208,210,237）以及隔膜横跨端口。 可移动元件和附加感测元件形成用于感测来自外部环境（84）的压力刺激的压力传感器，作为附加感测元件与隔膜相对于可移动元件一起的移动。

    MONOLITHIC FABRICATION OF THERMALLY ISOLATED MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES
    187.
    发明公开
    MONOLITHIC FABRICATION OF THERMALLY ISOLATED MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES 有权
    单片机HISTELLUNG VON THERMISCH ISOLIERTEN VORRICHTUNGEN MIT MIKROELEKTROMECHANISCHEN SYSTEMEN（MEMS）

    公开(公告)号：EP3095755A1

    公开(公告)日：2016-11-23

    申请号：EP16168459.2

    申请日：2016-05-04

    Applicant: Honeywell International Inc.

    Inventor： REINKE, John ,  LODDEN, Grant

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0019 ,  B81B3/0081 ,  B81B7/0087 ,  B81B2201/0228 ,  B81B2201/025 ,  B81C1/0069 ,  H02N1/00

    Abstract: A method for fabricating a thermally isolated microelectromechanical system (MEMS) structure is provided. The method includes processing a first wafer of a first material with a glass wafer to form a composite substrate including at least one sacrificial structure of the first material and glass; forming a MEMS device in a second material; forming at least one temperature sensing element on at least one of: the composite substrate; and the MEMS device; and etching away the at least one sacrificial structure of the first material in the composite substrate to form at least one thermally isolating glass flexure. The MEMS device is thermally isolated on a thermal isolation stage by the at least one thermally isolating glass flexure. The at least one temperature sensing element in on a respective at least one of: the thermal isolation stage; and the MEMS device.

    Abstract translation: 提供了一种用于制造热隔离微机电系统（MEMS）结构的方法。 该方法包括用玻璃晶片处理第一材料的第一晶片以形成包括第一材料和玻璃的至少一个牺牲结构的复合衬底; 在第二材料中形成MEMS器件; 在所述复合衬底中的至少一个上形成至少一个温度感测元件; 和MEMS器件; 并且蚀刻所述复合衬底中的所述第一材料的所述至少一个牺牲结构以形成至少一个热隔离玻璃弯曲部。 MEMS器件通过至少一个隔热玻璃弯曲件在热隔离台上热隔离。 所述至少一个温度感测元件位于以下各自中的至少一个中：热隔离级; 和MEMS器件。

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