公开(公告)号：EP1862040A4

公开(公告)日：2009-11-04

申请号：EP06738633

申请日：2006-03-15

Applicant: STABLCORE INC

Inventor： VASOYA KALU K

IPC: H05K3/30

CPC classification number: H05K3/4641 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0047 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/4638 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2203/056 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T156/1062

公开(公告)号：EP1911090A4

公开(公告)日：2009-07-22

申请号：EP06800678

申请日：2006-07-28

Applicant: FOSTER MILLER INC

Inventor： FARRELL BRIAN ,  GANNON JOHN J JR ,  CAMPBELL THOMAS G ,  COPPOLA PAT ANHTONY ,  O'REILLY SEAN GERALD ,  BURKE JOSEPH F

IPC: H01L23/02

CPC classification number: H01Q1/286 ,  B64D43/00 ,  H01Q21/065 ,  H05K1/00 ,  H05K1/038 ,  H05K1/147 ,  H05K3/0058 ,  H05K3/0064 ,  H05K3/3447 ,  H05K3/36 ,  H05K3/4046 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10303

Abstract: A dual function composite system includes a first electronic subsystem, a second electronic subsystem, and a composite member between the first and second electronic subsystems. The composite member includes plies of fabric, and resin impregnating the plies of fabric. At least one ply of the fabric includes signal transmission elements integrated therewith and interconnecting the first electronic subsystem with the second electronic subsystem.

公开(公告)号：EP2074872A2

公开(公告)日：2009-07-01

申请号：EP07826631.9

申请日：2007-10-03

Applicant: Koninklijke Philips Electronics N.V.

Inventor： BHATTACHARYA, Rabin

IPC: H05K1/00 ,  D03D11/00

CPC classification number: H05K1/038 ,  D03D1/0088 ,  D03D11/00 ,  D03D15/00 ,  D10B2401/16 ,  H05K1/189 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10106 ,  Y10T442/3179

Abstract: A textile (100; 300; 400) having a multi-layer warp which includes an upper warp layer (101) comprising an upper array of conductive warp yarns (104a-b; 303a-e; 406a-b), a lower warp layer (102) comprising a lower array of conductive warp yarns (106a-b; 306a-e; 421a-d), and an intermediate warp layer (103) arranged between the upper (101) and lower (102) warp layers. The textile further includes a weft in which a first set of conductive weft yarns (108; 302a- f; 407a-b) cross the upper array of conductive warp yarns (104a-b, 303a-e; 406a-b), such that electrical contact is achieved there between, and a second set of conductive weft yarns (109a-b; 305a-f; 424, 430, 440) cross the lower array of conductive warp yarns (106a-b; 306a-e; 421a-d), such that electrical contact is achieved there between. The second set of conductive weft yarns (109a-b; 305a-f; 424, 430, 440) form loops (110; 425, 431, 441) around non-conductive warp yarns in the upper (101) and intermediate (103) warp layers, each of the loops (110; 425, 431, 441) providing a first upper layer connection point (307; 408-410) for enabling connection of an electronic device (309; 401-403) between the first upper layer connection point (307; 408- 410) and a second upper layer connection point (308).

公开(公告)号：EP2030491A2

公开(公告)日：2009-03-04

申请号：EP07764352.6

申请日：2007-06-04

Applicant: Future-Shape GmbH

Inventor： LAUTERBACH, Christl ,  STEINHAGE, Axel

IPC: H05K1/00 ,  D03D15/00

CPC classification number: H03K17/962 ,  H03K2017/9602 ,  H03K2217/94094 ,  H03K2217/960755 ,  H05K1/0263 ,  H05K1/038 ,  H05K3/0058 ,  H05K3/321 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10151 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10727

Abstract: A textile layer arrangement has a first textile layer (1) and a second textile layer (13), wherein the second textile layer is formed on or above the first textile layer. The textile layer arrangement also has at least one electronic component (3) which is formed between the first textile layer and the second textile layer. The textile layer arrangement further has at least one power line (8), which is formed in at least one boundary region of the textile layer arrangement, for providing electrical power. The textile layer arrangement also has at least one supply line (7), which at least one supply line electrically couples the at least one electronic component to the at least one power line. The at least one power line is arranged at a distance from the at least one electronic component, and the at least one supply line is arranged at an angle with respect to the at least one power line.

公开(公告)号：EP1910852A2

公开(公告)日：2008-04-16

申请号：EP06788901.4

申请日：2006-07-28

Applicant: FOSTER MILLER, INC.

Inventor： FARRELL, Brian ,  GANNON, John, J. ,  CAMPBELL, Thomas, G. ,  COPPOLA, Pat, Anthony ,  O'REILLY, Sean, Gerald ,  BURKE, Joseph, F.

IPC: G01R29/10

CPC classification number: H01Q1/286 ,  B64D43/00 ,  H01Q21/065 ,  H05K1/00 ,  H05K1/038 ,  H05K1/147 ,  H05K3/0058 ,  H05K3/0064 ,  H05K3/3447 ,  H05K3/36 ,  H05K3/4046 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10303

Abstract: An electromechanical structure includes a core and a plurality of conductive pins through the core. The pins are configured to form a signal distribution network from a first side of the core to a second side of the core.

公开(公告)号：EP1722614A1

公开(公告)日：2006-11-15

申请号：EP05010475.1

申请日：2005-05-13

Applicant: Sefar AG

Inventor： Kirstein, Tünde ,  Locher, Ivo ,  Maurer, Christoph

IPC: H05K3/10 ,  D03D15/00 ,  H05K1/00

CPC classification number: H05K1/038 ,  H05K1/0289 ,  H05K1/0393 ,  H05K2201/0281 ,  H05K2201/029

Abstract: Die Erfindung betrifft eine Leiterplatte sowie ein Verfahren zu deren Herstellung. Die hochflexible Leiterplatte weist elektrisch nicht-leitende und elektrisch leitende Fäden auf. Diese Fäden bilden ein Gewebe mit einer regelmäßigen Gitterstruktur. Hierbei sind mindestens elektrisch leitende Fäden als Kett- und Schussfäden verwendet.

Abstract translation: 电路板及其制造方法技术领域本发明涉及电路板及其制造方法。 高度柔性的印刷电路板具有不导电且导电的螺纹。 这些线形成具有规则网格结构的织物。 这里，至少导电线用作经线和纬线。

公开(公告)号：EP1611642A1

公开(公告)日：2006-01-04

申请号：EP04716886.9

申请日：2004-03-03

Applicant: 3M Innovative Properties Company

Inventor： DIVIGALPITIYA, Ranjith ,  KANNO, David A., ,  JANNIC, Patrice ,  ARNOLD, Christophe ,  SABATIER, Richard ,  CONNELL, Glen

IPC: H01R4/04 ,  C09J9/02 ,  H05K3/32

CPC classification number: H01L24/29 ,  C08L67/00 ,  C08L77/00 ,  C09J9/02 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0281 ,  H01L2924/00

Abstract: An electronic assembly comprising a first electronic element, a second electronic element, and a durably flexible bond therebetween. The bond comprises an anisotropic conductive adhesive that includes elongated electrically conductive particles. The bond provides at least one electrical pathway between the first electronic element and the second electronic element through an elongated contact region. This bond is functionally maintained for at least about 200 flexes.

公开(公告)号：EP1595013A1

公开(公告)日：2005-11-16

申请号：EP04712472.2

申请日：2004-02-19

Applicant: Infineon Technologies AG

Inventor： GLASER, Rupert, Hermann, Josef ,  JUNG, Stefan ,  LAUTERBACH, Christl

IPC: D03D15/00 ,  A41D1/00

CPC classification number: D03D15/00 ,  D02G3/441 ,  D03D1/0088 ,  D03D15/0066 ,  D03D15/02 ,  D10B2101/12 ,  D10B2101/20 ,  D10B2401/16 ,  D10B2401/20 ,  D10B2503/04 ,  H05K1/0274 ,  H05K1/038 ,  H05K3/284 ,  H05K2201/0281 ,  Y10T442/30 ,  Y10T442/3976

Abstract: The invention relates to a textile fabric structure having a plurality of microelectronic components that are arranged in said textile fabric structure, in addition to electrically conductive threads coupling the plurality of microelectronic components to one another, conductive data transmission threads coupling the plurality of microelectronic components to one another and electrically non-conductive threads. The conductive threads and the conductive data transmission threads are provided with electrical interfaces or data transmission interfaces on the edge of the textile fabric structure.

公开(公告)号：EP1489696A3

公开(公告)日：2004-12-29

申请号：EP04012943.9

申请日：2004-06-01

Applicant: Infineon Technologies AG

Inventor： Jung, Stefan ,  Lauterbach, Christl

IPC: H01R12/08 ,  H01R12/38

CPC classification number: H01R12/59 ,  H01R12/77 ,  H05K3/103 ,  H05K3/321 ,  H05K3/3405 ,  H05K3/363 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/1028 ,  H05K2201/1034 ,  Y10T29/49135 ,  Y10T29/49169

Abstract: Die Erfindung betrifft ein Verfahren zum elektrischen Verbinden eines elektrischen Leiters mit einem elektronischen Bauelement mit den Schritten: Bereitstellen eines textilen Materials, in welchem zumindest ein flexibler, draht- und/oder fadenartiger elektrischer Leiter angeordnet ist; Durchtrennen des elektrischen Leiters an der zu verbindenden Stelle; Anordnen einer Kontaktierungseinrichtung des Bauelements an zumindest einer Flächenseite des textilen Materials an der zu verbindenden Stelle des Leiters; elektrisches Verbinden des Leiters mit der Kontaktierungseinrichtung. Ferner betrifft die Erfindung eine Vorrichtung mit einem textilen Material, in welchem zumindest ein flexibler, draht- und/oder fadenartiger elektrischer Leiter angeordnet ist; zumindest einer Kontaktierungseinrichtung eines elektronischen Bauelements, welche mit dem Leiter elektrisch verbunden ist; wobei der Leiter an der Verbindungsstelle mit der Kontaktierungseinrichtung durchtrennt ist.

公开(公告)号：EP1469707A2

公开(公告)日：2004-10-20

申请号：EP04368029.7

申请日：2004-04-14

Applicant: Integral Technologies, Inc.

Inventor： Aisenbrey, Thomas

IPC: H05B33/14 ,  C09K11/08

CPC classification number: H05K3/101 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/095 ,  H05K1/167 ,  H05K1/18 ,  H05K1/181 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/0215 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/0113 ,  H05K2203/1327 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Lighting devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based lighting devices can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the lighting devices can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

Abstract translation: 照明装置形成的导电加载的树脂基材料制成。 导电负载的树脂基材料包括微米导电性粉末（S），导电纤维（S），或导电性粉末和导电性纤维的在基础树脂中的主机的组合。 导电性粉末（S），导电纤维（S），或导电导电粉和纤维与基体树脂宿主的重量的组合的重量的比为约12:20和00:40之间。 微米的导电粉末由非金属，颜色形成的：如碳，石墨，并因此可以被金属镀覆，或类似物，或由金属：如不锈钢，镍，铜，银，没因此可以金属镀，或 等，或由非金属的组合，镀，或与金属粉末的组合。 微米导体纤维优选是镀镍的碳纤维，不锈钢纤维，铜纤维，银纤维，或类似的。 如注塑压缩成型或挤出：所述导电加载的基于树脂的照明装置可使用的方法来形成。 因而用于形成照明装置的导电性加载的树脂基材料可以是在一个薄的柔性织物的形式也可容易地被切成期望的形状。