公开(公告)号：EP2174324B1

公开(公告)日：2017-01-11

申请号：EP07872304.6

申请日：2008-03-18

Applicant: Alpha Metals, Inc.

Inventor： KHASELEV, Oscar ,  DESAI, Nitin ,  MARCZI, Michael, T. ,  SINGH, Bawa

IPC: H01F5/00 ,  B22F9/24 ,  C09D11/00 ,  H05K1/09 ,  H05K3/10 ,  H05K3/24

CPC classification number: H01F5/003 ,  B22F2998/00 ,  C09D11/52 ,  H01L51/0022 ,  H05K3/1241 ,  H05K3/1258 ,  H05K3/38 ,  H05K2201/098 ,  H05K2201/09909 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/1105 ,  H05K2203/1131 ,  H05K2203/1476 ,  B22F1/0062

公开(公告)号：EP2195829A4

公开(公告)日：2014-01-15

申请号：EP08835327

申请日：2008-10-01

Applicant: KOVIO INC

Inventor： KAMATH ARVIND ,  SCHER ERIK ,  SMITH PATRICK ,  CHANDRA ADITI ,  MOLESA STEVEN

IPC: H01L21/336 ,  H01L29/788

CPC classification number: H01L21/36 ,  C23C18/08 ,  C23C18/122 ,  C23C18/1245 ,  C23C18/1295 ,  H01L21/02532 ,  H01L21/02601 ,  H01L21/02628 ,  H01L21/28273 ,  H01L21/28518 ,  H01L21/288 ,  H01L21/76871 ,  H01L21/76895 ,  H01L27/1285 ,  H01L27/1292 ,  H01L28/40 ,  H01L29/0657 ,  H01L29/66143 ,  H01L29/6675 ,  H01L29/7881 ,  H01L29/872 ,  H05K1/16 ,  H05K1/162 ,  H05K3/125 ,  H05K2201/098

Abstract: The present invention relates to electrically active devices (e.g., capacitors, transistors, diodes, floating gate memory cells, etc.) having dielectric, conductor, and/or semiconductor layers with smooth and/or dome-shaped profiles and methods of forming such devices by depositing or printing (e.g., inkjet printing) an ink composition that includes a semiconductor, metal, or dielectric precursor. The smooth and/or dome-shaped cross-sectional profile allows for smooth topological transitions without sharp steps, preventing feature discontinuities during deposition and allowing for more complete step coverage of subsequently deposited structures. The inventive profile allows for both the uniform growth of oxide layers by thermal oxidation, and substantially uniform etching rates of the structures. Such oxide layers may have a uniform thickness and provide substantially complete coverage of the underlying electrically active feature. Uniform etching allows for an efficient method of reducing a critical dimension of an electrically active structure by simple isotropic etch.

公开(公告)号：EP1918632A1

公开(公告)日：2008-05-07

申请号：EP06123475.3

申请日：2006-11-03

Applicant: Asetronics AG

Inventor： Meister, Bruno

IPC: F21L4/00 ,  A61B17/00 ,  F21Y101/02

CPC classification number: F21V21/32 ,  F21W2131/20 ,  F21Y2115/10 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/057 ,  H05K2201/098 ,  H05K2201/10106

Abstract: Die insbesondere für die Verwendung im Medizinalbereich vorgesehene Leuchtvorrichtung weist eine wenigstens eine Leuchtdiode (11) umfassende Leuchteinheit (1) auf, die über elektrische Leitungen (21, 22) mit einer Energieversorgungsvorrichtung (3) verbunden oder verbindbar ist. Erfindungsgemäss ist ein Verbindungselement (2) vorgesehen, das ein streifenförmiges, flexibles und isolierendes Basissubstrat (21) aufweist, das einseitig oder beidseitig mit Metall beschichtet ist, in das die elektrischen Leitungen (22; 23) eingearbeitet sind, die an einem Ende des Verbindungselements (2) zu Anschlüssen (25) der Leuchteinheit (1) und am anderen Ende des Verbindungselements (2) zu Anschlüssen (26) der Energieversorgungsvorrichtung (3) geführt sind, wobei die auf einer oder beiden Seiten des Basissubstrats (21) vorgesehenen Metallschichten (22, 23, 24) derart dimensioniert sind, dass sie das Basissubstrat (21) in einer gewählten Form halten.

Abstract translation: 设备（100）具有带有LED（11）的照明单元（1），并通过电线（22,23）与电源装置（3）连接。 连接单元（2）通过印刷电路板技术制造并且具有涂覆有金属的基底（21）。 线路被引导到连接单元的一端处的照明单元的连接（25）和连接单元的另一端处的电源装置的连接（26）。 金属层（231,232）设置在基板的一侧或两侧并且被设计成尺寸，使得这些层以选定的形式保持基板。

公开(公告)号：EP0935286A4

公开(公告)日：2008-04-09

申请号：EP98921813

申请日：1998-05-26

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： SASAKI KAZUTAKA ,  NAKATA HIROHIKO

IPC: H01L23/12 ,  H01L23/373 ,  H05K1/02 ,  H05K1/03 ,  H05K3/38 ,  H05K1/09

CPC classification number: H05K1/0271 ,  C04B35/111 ,  C04B35/581 ,  C04B35/587 ,  C04B35/62655 ,  C04B37/026 ,  C04B2235/3208 ,  C04B2235/3225 ,  C04B2235/5445 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2235/723 ,  C04B2235/77 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/66 ,  C04B2237/704 ,  C04B2237/708 ,  H01L23/3735 ,  H01L2224/48091 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/09145 ,  H05K2201/098 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/24917 ,  H01L2924/00014

Abstract: A highly reliable copper circuit junction substrate which enables a semiconductor chip or a lead frame to be mounted on a ceramic base without causing the base to be broken or deformed by the conventional junction utilizing brazing or copper-copper oxide eutectic, thus accomplishing a junction with a high strength. The substrate is produced by forming on a ceramic base (1) either an intermediate layer (2) comprising a brazing material layer containing chiefly silver and copper containing an active metal or an intermediate layer (2) comprising a first intermediate layer containing the above brazing material layer or a high-melting metal layer and a second intermediate layer containing chiefly nickel, iron and copper and having a melting point of not higher than 1000 °C in order from the side of the base, and forming thereon a conducting layer (3) containing chiefly copper and being shorter by at least 0.05 mm than the intermediate layer in both the direction of length and the direction of width. An outer layer (5) containing chiefly Ni is further formed on the upper surface of the base substrate to give a copper circuit junction substrate. A semiconductor chip is mounted on the above substrate to give a semiconductor device.

公开(公告)号：EP1746869A1

公开(公告)日：2007-01-24

申请号：EP06005244.6

申请日：2006-03-15

Applicant: Interuniversitair Microelektronica Centrum ,  UNIVERSITEIT GENT

Inventor： Vanfleteren, Jan ,  Brosteaux, Dominique ,  Axisa, Fabrice

IPC: H05K3/20

CPC classification number: H01L25/50 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/205 ,  H05K2201/0133 ,  H05K2201/098 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49158 ,  H01L2924/00

Abstract: A method of producing a composite substrate involves, providing a flexible sacrificial layer (2), producing a patterned conducting layer or stack of conducting layers (3) on a flexible sacrificial layer (2), bending the sacrificial layer into a predetermined shape, providing a stretchable and/or flexible material (4) on top of and in between features of the patterned layer while the sacrificial layer is bent. The patterned features can be shaped such that they are anchored into said stretchable and/or flexible material. This can enable the patterned conductor to be anchored into this stretchable and/or flexible material in a more reliable way..Bending prior to depositing the flexible and/or stretchable material reduces the risk that the conducting material jumps out of the surrounding flexible and/or stretchable material during bending. Also this shape will be (partially) maintained after removing the sacrificial substrate.

Abstract translation: 制造复合基板的方法包括，提供了灵活的牺牲层（2），从而产生导电层的图案化导电层或堆叠（3）上的柔性牺牲层（2），弯曲该牺牲层成预定的形状，从而提供 可拉伸的和/或柔性材料（4）的顶部，并在图案化层的特征之间，而所述牺牲层是弯曲的。 图案化特征可以被成形检查GDP是可以被锚定到所述伸展和/或柔性材料。 这可以沉积该柔性和/或可拉伸的材料之前，以使图案化导体以更可靠的way..Bending被锚定到该可伸展和/或柔性的材料降低了风险做导电材料跳出的周围柔性和/ 或弯曲期间拉伸的材料。 所以这种形状将是（部分地）去除所述牺牲衬底后保持。

公开(公告)号：EP1713170A2

公开(公告)日：2006-10-18

申请号：EP06007600.7

申请日：2006-04-11

Applicant: FANUC LTD

Inventor： Odaka, SHunichi ,  Kariya, Isao, Rm. 6-303

IPC: H02N1/00

CPC classification number: H05K1/0254 ,  H02N1/004 ,  H05K3/244 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/098 ,  Y10T29/49002 ,  Y10T29/49009

Abstract: A method of production of electrodes for an electrostatic motor generating electrostatic force between a facing stator and slider, including forming core electrodes on a board of at least one of the stator and the slider by patterning a conductive substance and depositing a conductive substance on the core electrodes so that the side edges become rounded. Any method selected from electroplating, electroless plating, electrostatic coating, or screen printing can be used to deposit the conductive substance on the core electrodes. The core electrodes may be patterned using non-etching means. Further, electrodes for an electrostatic motor generating an electrostatic force between a facing stator and slider provided with core electrodes patterned on the board of at least one of the stator and the slider and a conductive substance deposited on the core electrodes to form deposition layers so that the side edges become rounded.

Abstract translation: 生产电极的用于在静电马达产生面向定子和滑动件之间的静电力，其中包括在所述定子的至少一个的板以及通过对所述芯图案化的导电物质和沉积导电物质滑块形成芯电极的方法 电极所以没有侧边变得圆润。 从电镀，化学镀，静电涂装法，或丝网印刷中的任意方法可以被用来对导电电极芯沉积物质。 芯电极可以使用非蚀刻装置来形成图案。 此外，电极，用于在设置有图案化在所述定子的至少一个的板和滑块并沉积在芯电极的导电物质，以形成沉积层，从而做芯电极的面临定子和滑动件之间的静电力的静电马达产生 侧边缘变圆。

公开(公告)号：EP1551037A1

公开(公告)日：2005-07-06

申请号：EP04405004.5

申请日：2004-01-05

Applicant: Alcan Technology & Management Ltd.

Inventor： Ziegler, Andreas ,  Dörr, Norman ,  Hammon, Werner ,  Lüthi, Markus ,  Lohwasse, Wolfgang ,  Reinhold, Matthias

IPC: H01B7/08 ,  H05K3/20 ,  H05K3/46

CPC classification number: H05K3/245 ,  H01B7/0861 ,  H05K1/0393 ,  H05K3/12 ,  H05K3/207 ,  H05K3/281 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0179 ,  H05K2201/0715 ,  H05K2201/098 ,  H05K2203/0113 ,  H05K2203/1476

Abstract: Bei einem flexiblen Träger (10) mit einer Basisschicht (12) aus Kunststoff und wenigstens einer mit elektrisch leitfähiger Farbe zumindest auf der Basisschicht (12) einseitig aufgedruckten, elektrisch leitfähigen Struktur (20) ist die wenigstens eine elektrisch leitfähige Struktur (20) zwischen der Basisschicht (12) und wenigstens einer Deckschicht (14) aus Kunststoff und jede der gegebenenfalls weiteren elektrisch leitfähigen Strukturen (22) zwischen jeweils zwei aufeinander der folgenden weiteren Deckschichten angeordnet, und die Basisschicht (12) ist mit der wenigsten einen Deckschicht (14) und jede der gegebenenfalls weiteren Deckschichten ist mit den angrenzenden Deckschichten verbunden.

Abstract translation: 具有导电结构的柔性载体（10）作为电路，具有使用导电油墨的电路在至少一侧印刷的塑料基层（12）。 所述印刷电路位于所述基底层与至少一个塑料覆盖层（14）之间，所述至少一个塑料覆盖层（14）在一侧具有另外的印刷电路（22）。 该结构与中间层（18）一起被外部阻挡层（16）覆盖，全部粘合在一起。

公开(公告)号：EP1370123A3

公开(公告)日：2005-07-06

申请号：EP03012604.9

申请日：2003-06-03

Applicant: Dowa Mining Co., Ltd.

Inventor： Nakamura, Jynji ,  Kamihira, Noboru

IPC: H05K3/06 ,  H05K1/02 ,  H01L23/373

CPC classification number: H05K1/0271 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/061 ,  H05K2201/098 ,  H05K2201/09845 ,  Y10T428/12535 ,  H01L2924/00

Abstract: There is provided a method for producing a metal/ceramic bonding article wherein a metal member 12 is formed so as to have a predetermined shape by printing a resist 14 in a predetermined region on the metal member 12 to etch the metal member 12 after bonding the metal member 12 to a ceramic member 10. In this method, at least one strip-like non-printed portion 16 having a width of, e.g. 0.01 to 0.5 mm, in which the resist is not printed, is provided in a region inwardly spaced from the outer periphery of the resist 14 by a predetermined distance, e.g. 0.01 to 0.5 mm, to control the etch rate in the outer peripheral portion of the metal member 12. Thus, the width and thickness of a fillet is freely changed. For example, a stepped portion (or a stepped portion and fillet) having a width of 0.05 to 0.5 mm and a thickness of 0.005 to 0.25 mm is formed in the outer peripheral portion of the metal member 12.

公开(公告)号：EP1298968A3

公开(公告)日：2005-02-02

申请号：EP02021755.0

申请日：2002-09-25

Applicant: Dowa Mining Co., Ltd.

Inventor： Tsukaguchi, Nobuyoshi ,  Kimura, Masami

IPC: H05K1/03 ,  H05K3/06 ,  H05K1/02 ,  H01L23/373

CPC classification number: H05K3/38 ,  C04B37/021 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/706 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/067 ,  H05K3/244 ,  H05K2201/0355 ,  H05K2201/098 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

Abstract: There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness of 0.1 mm to 0.5 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 µm.

公开(公告)号：EP1274125A3

公开(公告)日：2004-12-15

申请号：EP02254289.8

申请日：2002-06-20

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Tatoh, Nobuyoshi, c/o Itami Works ,  Nakanishi, Hidenori, c/o Itami Works

IPC: H01L23/498 ,  H01L23/66

CPC classification number: H01L23/15 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49866 ,  H01L2924/0002 ,  H01L2924/13055 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/062 ,  H05K3/108 ,  H05K3/388 ,  H05K2201/098 ,  H05K2203/1184 ,  H01L2924/00

Abstract: A circuit board comprising a first metal layer 14 formed in patterns on a ceramic substrate 11, and a second metal layer 16 formed in patterns at least 0.5 µm thick on the first metal layer, wherein the first metal layer is reduced in width by etching. Also, a third metal layer 13 may be formed in patterns on the same plane as the first metal layer. The outermost surface of the second metal layer 16 is a metal such as gold that will not be etched. The circuit board has a fine and high-resolution wiring pattern and makes it possible to realize a miniature high-performance high-output module by mounting at least one high-output semiconductor element thereon.