Abstract:
The invention relates to a device (20), comprising: • - a liquid container (21) for containing a liquid; • - a capillary-stop valve (22) that is in medium through flow connection with said liquid container (21) for stopping said liquid in said container from flowing out of said container via said capillary- stop valve (22); • - a first electrode (7) being arranged such that in use said first electrode is in contact with said liquid in said liquid container; • - a second electrode (2) that is spaced apart from said capillary- stop valve by an electrically insulating medium gap (24), and • - a voltage source (V) connected to said first and second electrode which is activatable for applying an electric potential difference at the first and second electrode such that the liquid in the liquid container is attracted in the direction of said second electrode so as to allow the liquid to overcome the stopping effect of the capillary- stop valve for discharging liquid from said liquid container via said capillary-stop valve. The invention also relates to a method for activating a capillary-stop valve of a device.
Abstract:
A method for forming an electrically conductive via in a substrate that includes the steps of: forming a through hole in a first substrate; bringing a first surface of a second substrate into contact with the first surface of the first substrate, such that the through hole in the first substrate is covered by the first surface of the second substrate; filling the through hole in the first substrate with an electrically conductive material by electroplating to form the electrically conductive via, and removing the second substrate, wherein the first surface of the first and the second substrate each have a surface roughness Ra of less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and the first surface of the first and the second substrate are brought in direct contact with each other, such that a direct bond is formed there between.
Abstract:
The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.
Abstract:
The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.
Abstract:
The invention relates to a device (20), comprising: a liquid container (21) for containing a liquid; a capillary-stop valve (22) that is in medium through flow connection with said liquid container (21) for stopping said liquid in said container from flowing out of said container via said capillary-stop valve (22); a first electrode (7) being arranged such that in use said first electrode is in contact with said liquid in said liquid container; a second electrode (2) that is spaced apart from said capillary-stop valve by an electrically insulating medium gap (24), and a voltage source (V) connected to said first and second electrode which is activatable for applying an electric potential difference at the first and second electrode such that the liquid in the liquid container is attracted in the direction of said second electrode so as to allow the liquid to overcome the stopping effect of the capillary-stop valve for discharging liquid from said liquid container via said capillary-stop valve. The invention also relates to a method for activating a capillary-stop valve of a device.
Abstract:
The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.
Abstract:
A process for the modification of a surface of a solid material, said solid material comprising a polymer material arranged at the surface of the solid material. Said process comprises the step of: contacting the polymer at the surface of the solid material with an oxygen source and a catalytic amount of a transition metal compound under such conditions that oxygen is incorporated into the polymer surface, wherein a hydroxy group is formed, which is attached to a carbon atom of the polymer.
Abstract:
Micromixing chamber, roughly in the form of an hourglass which is provided at a first outer end with a tangential inflow opening (3a, 3c) and at a second outer end with a tangential outflow opening (5a, 5d), which mixing chamber in the overall flow direction first narrows more or less gradually and subsequently widens more or less abruptly. Also micromixer comprising a plurality of such micromixing chambers connected fluidically in series. Also methods for manufacturing such a micromixing chamber or such a micromixer. Also methods for mixing by means of such a micromixing chamber or by means of such a micromixer. A circulating flow in the form of a helix is formed in such a micromixing chamber. A circulating movement forming the beginning of the helix is created in a first part. The circulating movement is gradually accelerated by the more or less gradual narrowing. The gradualness is important in keeping the overall pressure drop over the micromixing chamber within limits. A more or less abrupt widening of the rapidly rotating helix then takes place which is found to provide an additionally good mixing. It is thus found possible to achieve a very efficient and rapid mixing. A micromixing chamber or micromixer according to the invention compatible with known microfluidic devices can be manufactured here from materials usual for the purpose, such as glass, preferably by means of techniques usual in the relevant field, such as powder blasting, etching and bonding.
Abstract:
The invention relates to a device for measuring a volume of a liquid, said device comprising: - a receptacle for receiving said liquid, said receptacle comprising an inlet opening and an outlet opening, and - a capillary channel having capillary action, which capillary channel has a predetermined internal transverse cross-section, wherein an inlet opening of the capillary channel at an first end thereof is in liquid through flow connection with the outlet opening of the receptacle and wherein the other, second end of the capillary channel comprises an opening; wherein: - the inlet opening of the receptacle has a larger transverse cross-section than the inlet opening of said capillary channel, and - a length of a liquid slug in the capillary channel is a measure for said volume. The invention further relates to a method for measuring a volume of a liquid using such a device, a method for calibrating a liquid dispensing system using such a device, a calibrating system for calibrating a liquid dispensing system using such a device and a support for supporting a plurality of such devices.
Abstract:
The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic,aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.