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公开(公告)号：KR1020140087744A
公开(公告)日：2014-07-09
申请号：KR1020120158339
申请日：2012-12-31
Applicant: 삼성전기주식회사
CPC classification number: H05K1/185 , H01L2224/16227 , H01L2924/15313 , H05K1/0231 , H05K3/4602 , H05K3/4644 , H05K2201/10015 , Y10T29/49139
Abstract: The present invention relates to an electronic component-embedded substrate. The electronic component-embedded substrate comprises: a first insulating layer which includes a cavity and is provided with a first circuit pattern and a second circuit pattern on upper and lower surfaces thereof; an electronic component, at least a portion of which is inserted into the cavity, and which includes an external electrode; a plurality of build-up insulating layers which are laminated on upper and lower sides thereof; an upper circuit pattern and a lower circuit pattern which are formed on the build-up insulating layers; a plurality of vias which connect the external electrode, the upper circuit pattern, the first circuit pattern, the second circuit pattern, and the lower circuit pattern to form an electric loop. Therefore, an impedance of a path through the electronic component and an external device is connected can be reduced, compared to the prior art.
Abstract translation: 本发明涉及电子元件嵌入式基板。 电子部件嵌入式基板包括：第一绝缘层，其包括空腔，并且在其上表面和下表面上设置有第一电路图案和第二电路图案; 电子部件，其至少一部分插入到所述空腔中，并且包括外部电极; 叠层在其上侧和下侧的多个堆积绝缘层; 形成在积层绝缘层上的上电路图案和下电路图案; 连接外部电极，上部电路图案，第一电路图案，第二电路图案和下部电路图案的多个通孔，形成电气回路。 因此，与现有技术相比，可以减少通过电子部件和外部装置的路径的阻抗。
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公开(公告)号：KR1020140084974A
公开(公告)日：2014-07-07
申请号：KR1020120155031
申请日：2012-12-27
Applicant: 삼성전기주식회사
CPC classification number: H05K1/185 , H01L21/568 , H01L2224/04105 , H01L2224/2518 , H01L2224/8203 , H01L2924/3512 , H05K3/4644 , H05K3/4697 , H05K2201/10015 , H05K2203/1469 , Y10T29/4913
Abstract: The present invention relates to a printed circuit board having an embedded electronic component and a manufacturing method thereof. A printed circuit board having an embedded electronic component according to the present invention includes a core having a cavity; an electronic component which is inserted into the cavity, has both sides where an external electrode having an illuminance surface is formed, and has a low illuminance surface which is partly formed in the illuminance surface; an insulating layer which is stacked on the upper and the lower part of the core and touches the outside of the electronic component which is inserted into the cavity; and an external circuit pattern which is formed on the insulating layer.
Abstract translation: 本发明涉及具有嵌入式电子部件的印刷电路板及其制造方法。 根据本发明的具有嵌入式电子部件的印刷电路板包括具有空腔的芯体; 插入到空腔中的电子部件具有形成具有照度表面的外部电极的两侧，并且具有部分地形成在照度表面中的低照度表面; 绝缘层，其堆叠在芯的上部和下部并且接触插入到空腔中的电子部件的外部; 以及形成在绝缘层上的外部电路图案。
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公开(公告)号：KR1020140083514A
公开(公告)日：2014-07-04
申请号：KR1020120153375
申请日：2012-12-26
Applicant: 삼성전기주식회사
CPC classification number: H05K1/185 , H05K3/4602 , H05K2201/0129 , H05K2201/0195 , H05K2201/10636 , Y02P70/611 , Y10T29/4913 , Y10T428/24942
Abstract: The present invention relates to a core substrate, a manufacturing method thereof, a substrate with a built-in electronic component, and a manufacturing method thereof. According to one embodiment of the present invention, suggested is the core substrate which includes a first insulation layer; and a second insulation layer which is laminated on the upper and lower sides of the first insulation layer and is made of a material with a glass transition temperature which is lower than the glass transition temperature of the first insulation layer. Also, according to another embodiment of the present invention, suggested is the substrate with the built-in electronic component which includes the electronic component which is built in a cavity; and the core substrate which includes the first insulation layer and the second insulation layer which is laminated on the upper and lower sides of the first insulation layer and is made of the material with the glass transition temperature which is lower than the glass transition temperature of the first insulation layer and on which the cavity is formed. The first insulation layer which is filled and flowed in a gap between the electronic component and the cavity fixes the electronic component.
Abstract translation: 芯基板及其制造方法技术领域本发明涉及芯基板及其制造方法，具有内置电子部件的基板及其制造方法。 根据本发明的一个实施例，提出了包括第一绝缘层的芯基板; 以及层叠在第一绝缘层的上侧和下侧上并由玻璃化转变温度低于第一绝缘层的玻璃化转变温度的材料制成的第二绝缘层。 此外，根据本发明的另一实施例，提出的是具有内置电子部件的基板，其包括内置在空腔中的电子部件; 以及所述芯基板，其包括层叠在所述第一绝缘层的上侧和下侧上的所述第一绝缘层和所述第二绝缘层，并且由所述材料制成，所述材料的玻璃化转变温度低于所述第一绝缘层的玻璃化转变温度 第一绝缘层，并且在其上形成空腔。 在电子部件和腔体之间的间隙填充并流动的第一绝缘层固定电子部件。
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公开(公告)号：KR1020140062995A
公开(公告)日：2014-05-27
申请号：KR1020120129425
申请日：2012-11-15
Applicant: 삼성전기주식회사
CPC classification number: H05K1/185 , H05K1/0231 , H05K1/0271 , H05K3/4602 , H05K2201/068
Abstract: The present invention relates to a capacitor embedded substrate. Disclosed is the capacitor embedded substrate including multiple capacitors having different capacities from each other in a laminated core, and connecting the capacitors in parallel, to form a low impedance through a wide radio frequency band and improve the radiating performance and the signal transmitting performance at the same time.
Abstract translation: 本发明涉及电容器嵌入式基板。 本发明公开了一种电容器嵌入式基板，其包括在叠层铁芯中具有彼此不同容量的多个电容器，并且并联连接电容器，通过宽的无线电频带形成低阻抗，并提高了辐射性能和信号传输性能 同时。
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公开(公告)号：KR1020130044978A
公开(公告)日：2013-05-03
申请号：KR1020110109377
申请日：2011-10-25
Applicant: 삼성전기주식회사
CPC classification number: H05K1/185 , H01L24/19 , H01L2224/04105 , H01L2224/16145 , H01L2224/16225 , H01L2924/12042 , H01L2924/19105 , H05K3/3436 , H05K2201/10477 , H05K2203/1461 , H01L2924/00
Abstract: PURPOSE: An embedded printed circuit board and a manufacturing method thereof are provided to prevent thickness increase of a substrate by optimizing wiring design and simplifying layers. CONSTITUTION: An embedded printed circuit board includes copper foil laminated plates(105), internal electronic components(110,120), first circuit pattern(113,123) and a second circuit pattern(130). The internal electronic components are inserted into the copper coil laminated plates. The first circuit patterns are formed on the surface of the internal electronic components. The second circuit pattern is formed on the copper foil laminated plates. The first circuit pattern is electrically connected to an electrode of an external electronic component embedded in the substrate. The second circuit pattern is electrically connected to an electrode of the internal electronic component.
Abstract translation: 目的：提供嵌入式印刷电路板及其制造方法，以通过优化布线设计和简化层来防止基板的厚度增加。 构成：嵌入式印刷电路板包括铜箔层压板（105），内部电子部件（110,120），第一电路图案（113,123）和第二电路图案（130）。 内部电子部件插入铜线圈层压板。 第一电路图案形成在内部电子部件的表面上。 第二电路图案形成在铜箔层压板上。 第一电路图案电连接到嵌入在基板中的外部电子部件的电极。 第二电路图案电连接到内部电子部件的电极。
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Patent Agency Ranking
公开(公告)号：KR101104210B1
公开(公告)日：2012-01-10
申请号：KR1020100020096
申请日：2010-03-05
Applicant: 삼성전기주식회사
CPC classification number: H05K1/16 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2224/73267 , H01L2924/14 , H01L2924/351 , H05K3/30 , Y10T29/4913 , H01L2924/00
Abstract: 전자소자 내장형 인쇄회로기판 및 그 제조방법이 개시된다. 상기 제조방법은, 지지체의 상면에 전자소자를 부착하는 단계; 상기 지지체의 상측에 순수 레진층과 절연성 보강층을 적층하는 단계 - 이 때, 상기 전자소자는 상기 순수 레진층에 내장됨 -; 상기 지지체를 제거하는 단계; 상기 전자소자의 하측에 보강재가 함침된 절연층을 적층하는 단계; 및 상기 보강층 및 상기 절연층에 회로를 패터닝하는 단계를 포함한다.
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公开(公告)号：KR1020110054348A
公开(公告)日：2011-05-25
申请号：KR1020090110960
申请日：2009-11-17
Applicant: 삼성전기주식회사
CPC classification number: H05K1/18 , H01L21/568 , H01L2224/04105 , H01L2224/32145 , H01L2224/73267 , H05K3/30 , H05K3/46 , Y10T29/49146 , Y10T156/10
Abstract: PURPOSE: A printed circuit board with an electronic component and manufacturing method thereof are provided to vertically laminate a plurality of electronic devices in a cavity. CONSTITUTION: A cavity(12) is formed on a first substrate(10). A first electronic device(30) is embedded in the cavity. A second electronic device(40) is laminated on the first electronic device and is embedded in the cavity. Second substrates are laminated on the upper/lower surfaces of the first substrate.
Abstract translation: 目的：提供一种具有电子部件的印刷电路板及其制造方法，以将多个电子设备垂直层叠在空腔中。 构成：在第一基板（10）上形成空腔（12）。 第一电子器件（30）嵌入在腔中。 第二电子设备（40）层压在第一电子设备上并嵌入在腔中。 第二基板被层压在第一基板的上/下表面上。
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公开(公告)号：KR1020110029791A
公开(公告)日：2011-03-23
申请号：KR1020090087616
申请日：2009-09-16
Applicant: 삼성전기주식회사
IPC: H05K13/08
Abstract: PURPOSE: A method and a device for measuring the alignment of an electronic device are provided to automate an alignment measurement process by automating a scan process and data comparison process. CONSTITUTION: Arrangement data is provided based on the arrangement of an electronic device(S110). Image data is generated by scanning a substrate including the electronic device(S120). The alignment of the electronic device is measured by comparing the arrangement data with the image data(S130). The electronic device is mounted on a cavity formed on an embedded substrate. In an alignment measuring process, the arrangement data is matched with the image data and the position difference of the electronic device is measured from the matched arranged data and image data.
Abstract translation: 目的：提供一种用于测量电子设备对准的方法和装置，用于通过自动化扫描处理和数据比较处理来自动化对准测量过程。 构成：基于电子设备的布置提供布置数据（S110）。 通过扫描包括电子设备的基板来生成图像数据（S120）。 通过将排列数据与图像数据进行比较来测量电子装置的对准（S130）。 电子装置安装在形成在嵌入式基板上的空腔上。 在对准测量过程中，排列数据与图像数据匹配，并且从匹配的排列数据和图像数据测量电子设备的位置差。
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公开(公告)号：KR1020100043461A
公开(公告)日：2010-04-29
申请号：KR1020080102508
申请日：2008-10-20
Applicant: 삼성전기주식회사
CPC classification number: H05K1/185 , H01L21/6835 , H01L23/49827 , H01L23/5389 , H01L23/544 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L25/0657 , H01L2223/54426 , H01L2224/04105 , H01L2224/2402 , H01L2224/24226 , H01L2224/24227 , H01L2225/06524 , H01L2225/06575 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H05K1/0269 , H05K3/305 , H05K3/386 , H05K3/4602 , H05K2201/0195 , H05K2201/09918 , H05K2201/10515 , H05K2203/063 , H05K2203/066 , Y10T156/1052
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce manufacturing time by simultaneously laminating an insulator in an upper and a lower part of an electric component. CONSTITUTION: A printed circuit board comprises a bonding layer(20), an electric component(30), a substrate part, a circuit pattern(12,45), and a via(14,46). The electric component is attached to the bonding layer. An alignment mark is formed in the bonding layer in order to align the electric component. The substrate part comprises a core substrate and an insulator. The core substrate is laminated in the upper side of the bonding layer. A cavity is formed in the core substrate. The Insulator is laminated in the upper side of the core substrate and the lower side of the bonding layer. The circuit pattern and the via are formed in the substrate part.
Abstract translation: 目的：提供一种印刷电路板及其制造方法，以通过在电气部件的上部和下部同时层叠绝缘体来缩短制造时间。 构成：印刷电路板包括接合层（20），电子部件（30），基板部分，电路图案（12,45）和通孔（14,46）。 电气部件附着在接合层上。 在接合层中形成对准标记，以对准电气部件。 基板部分包括芯基板和绝缘体。 核心基板层叠在接合层的上侧。 在芯基板中形成空腔。 绝缘体层叠在芯基板的上侧和接合层的下侧。 电路图案和通孔形成在基板部分中。
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公开(公告)号：KR1020100004248A
公开(公告)日：2010-01-13
申请号：KR1020080064318
申请日：2008-07-03
Applicant: 삼성전기주식회사
IPC: H05K1/18
CPC classification number: H01L2224/04105 , H01L2224/19 , H01L2924/14 , H01L2924/00 , H01L2924/00012
Abstract: PURPOSE: A method of manufacturing a printed circuit board comprising embedded electronic component therein is provided to match an external connection bump of an electronic component to a via of an external circuit layer by aligning the external connection bump of the electric component to an upper circuit pattern of a base substrate. CONSTITUTION: A base substrate(100) comprises a cavity(170) and an alignment mark. The base substrate is one side PCB(Printed Circuit Board), both-side PCB or a multi-layer PCB. An external connection bump(330) is formed on the one-side of the electric component(300). A position detection unit(500) detects the location of the external connection bump and the alignment mark. The position detection unit includes an infrared camera or a sensor. The electric component is installed on the base substrate so that the external connection bump is arranged with the alignment mark.
Abstract translation: 目的：提供一种制造其中包括嵌入式电子部件的印刷电路板的方法，以通过将电气部件的外部连接凸起与上部电路图案对准来将电子部件的外部连接凸块与外部电路层的通孔相匹配 的基底。 构成：基底（100）包括空腔（170）和对准标记。 基底是单面PCB（印刷电路板），双面PCB或多层PCB。 在电气部件（300）的一侧形成有外部连接突起（330）。 位置检测单元（500）检测外部连接凸起和对准标记的位置。 位置检测单元包括红外相机或传感器。 电气部件安装在基底基板上，使得外部连接凸起布置有对准标记。
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