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公开(公告)号：KR1020150049036A
公开(公告)日：2015-05-08
申请号：KR1020130129010
申请日：2013-10-29
Applicant: 삼성전자주식회사
IPC: H02K3/46
CPC classification number: H02K3/522
Abstract: 스테이터코일의권선패턴을간소화할수 있도록개선된구조를가지는모터및 스테이터코일의권선방법을개시한다. 모터는스테이터바디, 상기스테이터바디의상, 하부에각각결합되는제 1인슐레이터및 제 2인슐레이터를포함하는스테이터(STATOR), 상기스테이터의내측에배치되고, 상기스테이터와전자기적으로상호작용하여회전하도록구성되는로터(ROTOR) 및상기로터와함께회전하도록상기로터에결합되는모터축을포함하고, 상기제 1인슐레이터및 상기제 2인슐레이터중 어느하나에는서로다른전원을인가받는코일이권선되도록상기제 1인슐레이터및 상기제 2인슐레이터중 어느하나의원주방향을따라복수의바인딩보스(BINDING BOSS)가마련될수 있다.
Abstract translation: 公开了具有改进结构的电动机，以简化定子线圈的绕组图案和定子线圈的绕组方法。 电动机包括：定子体; 定子，包括分别与定子体的上部和下部结合的第一和第二绝缘体; 转子，其设置在定子的内部并且与定子电磁相互作用以旋转; 以及与转子耦合以与转子一起旋转的电机轴。 可以沿着来自第一和第二绝缘体的周向的圆周方向准备多个装订凸台，以具有从第一绝缘体和第二绝缘体围绕一个缠绕的不同功率的线圈。
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公开(公告)号：KR1020150040610A
公开(公告)日：2015-04-15
申请号：KR1020130119348
申请日：2013-10-07
Applicant: 삼성전자주식회사
CPC classification number: H02K1/28 , H02K1/2773 , H02K15/03
Abstract: 자속누설을최소화할수 있도록하는모터의회전자및 그제조방법을개시한다. 모터의회전자는비자성체로마련되는원통형상의지지부재와, 지지부재에결합되며회전중심을기준으로방사형으로배치되는일체형철심과, 철심사이에배치되는다수의영구자석을포함하는것을특징으로한다.
Abstract translation: 公开了能够最小化漏磁的电动机的转子及其制造方法。 电动机的转子包括：由非磁性材料制成的圆柱形支撑构件，与支撑构件组合并且基于旋转中心以径向形式布置的嵌入铁芯和布置在铁芯之间的永磁体 。
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公开(公告)号：KR1020100093356A
公开(公告)日：2010-08-25
申请号：KR1020090012505
申请日：2009-02-16
Applicant: 삼성전자주식회사
CPC classification number: H01L23/5258
Abstract: PURPOSE: A manufacturing method of a semiconductor device equipped with a fuse box is provided to prevent electrostatic defect of the fuse box by protecting an open region of the fuse box through an adhesive layer. CONSTITUTION: Fuse region and bonding pad region are formed in a semiconductor substrate(200). A fuse box including a fuse(210) is formed in the fuse region. A bonding pad is formed in the bonding pad region. An insulating layer(220) equipped with an opening respective exposing the fuse and the bonding pad is formed. A lamination tape for back grind process is attached to the front side of a semiconductor substrate including an insulating layer. The back side of the semiconductor substrate is ground.
Abstract translation: 目的：提供一种配备有保险丝盒的半导体器件的制造方法，以通过粘合剂层保护保险丝盒的开放区域来防止保险丝盒的静电缺陷。 构成：在半导体衬底（200）中形成保险丝区域和焊盘区域。 在保险丝区域中形成包括保险丝（210）的保险丝盒。 在焊盘区域中形成接合焊盘。 形成具有分别暴露熔丝和接合焊盘的开口的绝缘层（220）。 用于后研磨的叠层带粘附到包括绝缘层的半导体衬底的前侧。 研磨半导体衬底的背面。
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公开(公告)号：KR1020100007518A
公开(公告)日：2010-01-22
申请号：KR1020080068174
申请日：2008-07-14
Applicant: 삼성전자주식회사
IPC: H01L21/205
CPC classification number: C23C16/515 , C23C16/505 , H01J37/32091
Abstract: PURPOSE: A deposition device and a method for depositing a thin film using the same are provided to deposit the thin film with high film formation uniformity and deposition rate by supplying the high frequency power and the low frequency power with a pulse type to a plasma electrode. CONSTITUTION: A deposition apparatus includes a gas flow pipe(110), a plasma electrode(140), a substrate support, a plasma connection terminal, a first voltage applier(151), and a second voltage applier(152). The substrate support is used as an opposite electrode of a plasma electrode. A substrate(135) is mounted on the substrate support. The plasma connection terminal is connected to the plasma electrode. The first voltage applier is connected to the plasma connection terminal. The first voltage applier applies the voltage in a continuous mode. The second voltage applier is connected to the plasma connection terminal. The second voltage applier applies the voltage in a pulse mode.
Abstract translation: 目的：提供一种沉积装置和使用其沉积薄膜的方法，以通过向等离子体电极提供脉冲型的高频功率和低频功率来沉积具有高成膜均匀性和沉积速率的薄膜 。 构成：沉积装置包括气体流通管（110），等离子体电极（140），基板支架，等离子体连接端子，第一电压施加器（151）和第二电压施加器（152）。 衬底支撑体用作等离子体电极的相对电极。 衬底（135）安装在衬底支撑件上。 等离子体连接端子连接到等离子体电极。 第一电压施加器连接到等离子体连接端子。 第一电压施加器以连续模式施加电压。 第二电压施加器连接到等离子体连接端子。 第二个施压器以脉冲模式施加电压。
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公开(公告)号：KR1020080058790A
公开(公告)日：2008-06-26
申请号：KR1020060132893
申请日：2006-12-22
Applicant: 삼성전자주식회사
IPC: H01L23/48
CPC classification number: H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012
Abstract: A ball grid array package having a pocket wall in a ball land part and a method for forming the same are provided to reduce a thickness thereof by attaching a solder ball within a predetermined region surround with the packet wall. A lead frame(10) is electrically connected to a semiconductor chip(40). The lead frame includes at least one lead(17,18), a ball land part(30) formed on the lead, and a pocket wall(33) protruded from a surface of the ball land part to surround a predetermined region. A body(50) is formed to surround the semiconductor chip and the lead frame. A solder ball(60) is arranged in the inside of the predetermined region surrounded by the pocket wall. The body is composed of an epoxy molding compound. The solder ball is composed of one of Sn-Pb-based compound, Sn-Ag-based compound, and Sn-Ag-Cu-based compound.
Abstract translation: 提供了具有球场部分中的凹槽壁的球栅阵列封装及其形成方法，以通过将焊球安装在包壁周围的预定区域内来减小其厚度。 引线框架（10）电连接到半导体芯片（40）。 引线框架包括至少一个引线（17,18），形成在引线上的球接地部分（30）和从球形台面的表面突出以围绕预定区域的凹槽壁（33）。 主体（50）形成为围绕半导体芯片和引线框架。 在由袋壁包围的预定区域的内部布置有焊球（60）。 身体由环氧树脂模塑料组成。 焊球由Sn-Pb系化合物，Sn-Ag系化合物和Sn-Ag-Cu类化合物中的一种构成。
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Patent Agency Ranking
公开(公告)号：KR1020070062086A
公开(公告)日：2007-06-15
申请号：KR1020050121792
申请日：2005-12-12
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/181 , H01L2924/00014 , H01L2924/01005 , H01L2924/00012 , H01L2924/00
Abstract: A molding method for checking oxidation of a copper wiring pattern is provided to prevent oxidation of a ball pad due to degradation of an OSP(Organic Solderability Preservative) layer by performing a molding process after forming nitrogen atmosphere in an inside of a molding chamber. A wiring substrate including a copper wiring having an OSP layer and a semiconductor chip is prepared(91). The wiring substrate is supplied into a molding chamber including a mold(92). The density of oxygen gas is reduced in the inside of the molding chamber by supplying nitrogen gas to the inside of the molding chamber(93). The wiring substrate is supplied to the mold and a resin sealing part for sealing the semiconductor chip is formed on one side of the wiring substrate by implanting a liquefied molding resin(94,95).
Abstract translation: 提供一种用于检查铜布线图案的氧化的成型方法，以通过在模制室内形成氮气氛后进行成型工艺，防止由于OSP（有机可焊性防腐剂）层的劣化导致的球垫氧化。 制备包括具有OSP层和半导体芯片的铜布线的布线基板（91）。 将布线基板供给到包括模具（92）的模制室中。 通过向成型室（93）的内部供给氮气，在成型室的内部减少氧气的密度。 将配线基板供给到模具中，通过注入液化模塑树脂（94,95），在布线基板的一侧上形成用于密封半导体芯片的树脂密封部。
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公开(公告)号：KR100541740B1
公开(公告)日：2006-01-11
申请号：KR1020040011086
申请日：2004-02-19
Applicant: 삼성전자주식회사
IPC: H01L21/68
CPC classification number: H02K41/0354 , H02K2201/18
Abstract: 본 발명은, 이송장치에 관한 것으로서, 권취된 코일을 갖는 코일조립체와, 상기 코일조립체를 사이에 두고 서로 다른 극성을 가지며 상호 이격 배치된 한 쌍의 기동자석을 포함하는 적어도 4개의 미세구동유닛과; 상기 미세구동유닛들이 임의의 직선에 대해 대칭되게 한 쌍의 그룹으로 배치되도록 상기 적어도 4개의 코일조립체를 지지하는 코일지지부재와; 상기 각 코일조립체에 대응하여 상기 적어도 4쌍의 기동자석을 지지하는 자석지지부재와; 상기 코일지지부재 및 상기 자석지지부재 중 어느 하나에 대해 다른 하나의 이동을 조절하도록 상기 미세구동유닛들을 제어하는 제어부를 포함하는 것을 특징으로 한다. 이에 의하여, 초정밀의 위치제어가 가능하도록 위치제어오차를 용이하게 줄일 수 있다.
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公开(公告)号：KR1020150081740A
公开(公告)日：2015-07-15
申请号：KR1020140001517
申请日：2014-01-06
Applicant: 삼성전자주식회사
IPC: H04B7/04
CPC classification number: H04B7/0617 , H04B1/30 , H04B1/52 , H04B7/086 , H04B7/0408
Abstract: 본발명은무선통신시스템에서빔포밍을수행하는전자장치및 그방법을제공한다. 상기전자장치는다수개의안테나, 상기다수개의안테나와연결되며, 제어기의신호를제공받아다수개의송신기와수신기를선택하는다수개의송수신기선택용스위치, 상기다수개의수신안테나및 상기다수개의송수신기선택용스위치를통해수신되는다수개의 RF 신호의위상을상기제어기의신호를제공받아이동하는다수개의제 1 위상이동기, 위상이이동된다수개의 RF 신호를하나로병합하는컴바이너, 쿼드러처(Quadrature) 신호를생성하는쿼드러처신호발생기, 상기쿼드러처신호와상기병합한 RF 신호를제 1 기저대역신호로변환하여모뎀으로출력하는다운믹서, 및, 상기다수개의송수신기선택용스위치, 상기다수개의위상이동기및 다수개의제 2 위상이동기를제어하여상기다수개의송수신기선택용스위치의송수신모드, 및송수신되는 RF 신호의위상을결정하는상기제어기를포함한다.
Abstract translation: 本发明提供了一种用于在无线通信系统中执行波束成形的电子装置及其方法。 电子设备包括：天线; 用于选择收发器的交换机，其中开关连接到天线，并且能够通过从控制器接收信号来选择发射机和接收机; 通过接收控制器的信号来移动从天线接收的RF信号的相位和用于选择收发器的开关的第一相位移动器; 用于组合相位已被移动到一个的RF信号的组合器; 用于产生正交信号的正交信号发生器; 用于将正交信号和组合RF信号转换为第一基带信号并将其输出到调制解调器的下混频器; 以及控制器，用于控制用于选择收发器，相位推动器和第二相位移动器的开关，以及用于确定用于选择收发器的开关的收发模式，以及要发送和接收的RF信号的相位。
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公开(公告)号：KR1020150080400A
公开(公告)日：2015-07-09
申请号：KR1020140087256
申请日：2014-07-11
Applicant: 삼성전자주식회사
Abstract: 전동기는중공이형성된고정자, 권선이상기고정자에감겨형성되는복수의코일및 상기고정자를상기코일로부터절연시키는절연체를포함하는고정자어셈블리, 상기중공에삽입되고, 회전축을중심으로회전하는회전자를포함하고, 상기회전자는복수의극을포함하고, 상기극의중심의외곽선의곡률반경과상기극의가장자리의외곽선의곡률반경이서로상이할수 있다.
Abstract translation: 电动机包括具有开口的定子，包括缠绕在定子上的线圈的定子组件和用于将线圈与定子绝缘的绝缘体，以及插入到开口中并围绕旋转轴线旋转的转子。 转子包括杆。 极的中心的外线的曲率可以不同于极的边缘的曲率。
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公开(公告)号：KR1020080030267A
公开(公告)日：2008-04-04
申请号：KR1020060096133
申请日：2006-09-29
Applicant: 삼성전자주식회사
IPC: H01L21/60
Abstract: A method and an apparatus for forming a die attach film and a semiconductor package using the same are provided to consistently apply a liquid adhesive on a wafer by using a plurality of nozzles, and prevent cracks of a wafer chip while reducing manufacturing costs without using an expensive die attach tape. A method for forming a die attach film comprises the steps of: spinning a rotary stage(222) on which a wafer(103) is placed; spraying a liquid adhesive on the wafer by using a movable nozzle part(232) which comprises a plurality of nozzles; and hardening the wafer on which the liquid adhesive is coated. The nozzle part can move from the center of the wafer to the outer side of the wafer or from the outer side to the center.
Abstract translation: 提供了一种用于形成管芯附着膜的方法和装置以及使用其的半导体封装件，以通过使用多个喷嘴来一致地将液体粘合剂施加在晶片上，并且防止晶片芯片的裂纹，同时降低制造成本，而不使用 昂贵的贴片胶带。 用于形成管芯附着膜的方法包括以下步骤：旋转其上放置晶片（103）的旋转台（222）; 通过使用包括多个喷嘴的可移动喷嘴部分（232）将液体粘合剂喷射在晶片上; 并硬化其上涂覆有液体粘合剂的晶片。 喷嘴部分可以从晶片的中心移动到晶片的外侧或者从外侧移动到中心。
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