Abstract:
A pulse plasma matching system capable of preventing processing defect and method thereof are provided to perform an impedance matching of plasma by shifting a phase of an impedance matching correction pulse in order to be synchronized to a high frequency power pulse. A pulse plasma matching system capable of preventing processing defect comprises a high frequency power source(114), a phase shifter, a high frequency matching box, a network analyzer, and a controller. The high frequency power source generates a high frequency power. The phase shifter shifts a phase of a predetermined impedance matching correction pulse in order to be synchronized to a high frequency power pulse. The high frequency matching box supplies RF(Radio Frequency) power pulse to a processing chamber by matching plasma impedance using the high frequency power generated from the high frequency power source. The network analyzer measures impedance about the plasma generated from the processing chamber. The controller outputs the impedance matching correction pulse to the phase shifter.
Abstract:
PURPOSE: A semiconductor device and a manufacturing method thereof are provided to prevent a stringer by forming an etch stop layer after a peripheral circuit gate electrode is formed in a peripheral circuit region. CONSTITUTION: A device isolation layer(102) defining an active region(104) is formed on a substrate(100). A buried gate pattern is formed on the substrate in a first direction to fill trenches across the active region and the device isolation layer. An etch stop layer(120) and a first insulation layer(122) are successively formed on the substrate. A bit line structure is formed on the first insulation layer and is extended in a second direction across the buried gate pattern. The bit line structure includes a barrier pattern(130), a metal pattern(132), and a capping pattern(134). A second insulation layer(140) covers the bit line structure.
Abstract:
PURPOSE: A signal process device and a liquid crystal display device including the same are provided to remove a display failure of a liquid crystal display panel by preventing an excessive compensation voltage corresponding to compensation data from being applied to the liquid display panel. CONSTITUTION: A memory(110) receives image data of a current frame and outputs the image data of a previous frame which is previously stored. A lookup table outputs the reference gray value display from the liquid display panel for the previous frame by the combination of the current data and the previous data as the previous compensation data. A first data compensation unit(150) receives the current data and converts the current data to the first sub data and the second sub data with different gray values. The first data compensation unit receives the previous compensation data from the lookup table and converts the data into the third and fourth sub data with the different gray value. A second data compensation unit(170) converts the first sub data to the first compensation data using the first and third sub data. The second data compensation unit converts the second sub data to the second compensation data using the second and fourth data and outputs the second compensation data.
Abstract:
An estimation system of a process parameter of a semiconductor structure, a semiconductor manufacturing apparatus having the estimation system of a process parameter, and a method for using the same are provided to estimate a size of a shape of a semiconductor structure by using an estimation parameter generated after or while manufacturing the semiconductor. Semiconductor structures are reacted with the process gas and the plasma is sequentially produced in a processing chamber. Sensor parameters from the plasma are obtained by using a sensor. Observation parameters from the semiconductor structures detached from the process chamber are obtained by using a measuring unit(15). The selected observation parameters corresponding to the selected semiconductor structures and the process estimation model equation and a boundary condition based on the linearity of the selected sensor parameters are selected(20). One sensor parameter which is firstly manufactured among the remaining semiconductor structures is compared with the boundary condition by using the process estimation unit(25). The semiconductor structures are classified by the process sequence of the semiconductor manufacturing process. The selected semiconductor structures are previously manufactured in comparison with the remaining semiconductor structures.
Abstract:
A method for fabricating a semiconductor device is provided. The method for fabricating a semiconductor device includes forming a capping layer including a bit line contact hole on a substrate, forming a spacer in the inner sidewall of the bit line contact hole, forming a bit line contact in the bit line contact hole, forming a bit line layer on the substrate, exposing the spacer by etching the bit line layer, and etching the spacer.
Abstract:
신호 처리 장치 및 이를 포함하는 액정표시장치가 제공된다. 이 신호 처리 장치와 이를 포함하는 액정표시장치는 이전 영상 데이터의 목표 계조값을 기준 계조값으로 보상한다. 이때, 상기 기준 계조값은 상기 이전 영상 데이터에 의해 표시패널로부터 실제로 시인되는 계조값이다. 상기 신호 처리 장치 및 상기 액정 표시 장치는 이 기준 계조값과 현재 영상 데이터의 목표 계조값을 이용하여 보상 데이터를 생성한다. 따라서, 상기 현재 영상 데이터의 목표 계조값이 과잉 보상되는 것을 방지한다.
Abstract:
A liquid crystal display and the control method is provided to minimize motion blur and flickering by driving the liquid crystal display with the impulsive type. A liquid crystal panel includes a plurality of pixels and a data driver(500) supplying a data signal to pixel. A signal control unit(700) receives the original gradation signal from outside and supplies the correction gray scale signal to data driver. A first and second correction gray scale signal is supplied to the region where the difference of the original gradation value and the correction gray scale signal at the nth frame and(n+2)th frame is lower than the predetermined value, and third correction gray scale signal is higher than the set value. The first correction gray scale signal is applied to the n-th frame and(n+1)th frame, and the second correction gray scale signal is applied to(n+2)th frame and(n+3)th frame, and the third correction gray scale signal is applied to the nth frame or(n+3)th frame so that pixel is operated in the impulsive type.
Abstract:
PURPOSE: A method for forming a minute pattern using a mask structure and a method for manufacturing a semiconductor device using the same are provided to form minute patterns with an aspect ratio of 6 : 1 to 16 : 1 by using a mask structure made of carbon materials. CONSTITUTION: A first sacrificial layer and first mask patterns(42) are successively formed on a bottom layer. Trenches are formed in the first sacrificial layer by patterning the first sacrificial layer using the first mask patterns as an etch mask. A second sacrificial layer fills the trenches. The sacrificial layer remains in the trenches by etching a second sacrificial layer to expose the first mask patterns. Second mask patterns(72) are formed on the first mask patterns cross the trenches. Second sacrificial patterns(64) are formed in the trenches by patterning the second sacrificial layer using the second mask patterns as the etch mask.