Abstract:
PURPOSE: A shared pixel type image sensor is provided to improve a coupling property of a transmitting device and a floating diffusion region by symmetrically arranging a local wiring in a transmitting device which shares a floating diffusion region. CONSTITUTION: A shared pixel type image sensor includes a floating diffusion region(FD), a first photoelectric conversion region(PD1), a second photoelectric conversion region(PD2), two transmitting devices(TG1,TG2), a drive device(DG), a first contact(C1), a second contact(C2), and a local wiring(L1). The floating diffusion region is formed inside the semiconductor substrate. Two transmitting devices transmit electric charge charged in the first photoelectric conversion region and the second photoelectric conversion region to the floating diffusion region. The first contact is formed on the floating diffusion region. The second contact is formed on the drive device.
Abstract:
A method for manufacturing a semiconductor device is provided to enhance reliability by preventing the generation of noise of an image sensor. An interlayer dielectric(120) is formed on a substrate(100) including a gate insulating layer(105), a gate electrode, and a photodiode region(118). A mold insulating layer is formed on the interlayer dielectric in order to expose the interlayer dielectric on the photodiode region. A protective layer(185) including hydrogen atoms are formed along a profile of the mold insulating layer. An annealing process is performed to diffuse the hydrogen atoms from the protective layer to the gate insulating layer and the photodiode region.
Abstract:
An image device including an inner lens and a method for fabricating the same are provided to increase a refractive index and to improve light transmittance by adding nitrogen. A light receiving element(110) is formed on a top surface of a substrate(100). An interlayer dielectric structure(A) is formed with a transistor(120) for driving the light receiving element, and a metal contact and a metal wiring connected electrically to the transistor. A cavity is formed by removing a top part of the light receiving element from the interlayer structure. A transparent material layer is formed to fill up the cavity. A material layer for inner lens is formed by adding nitrogen to a part higher than the interlayer dielectric structure in the transparent material layer. The inner lens is manufactured by forming the material layer for inner lens with a type of lens. A color filter is formed on the inner lens.
Abstract:
이미지 센서 및 그 제조 방법이 제공된다. 본 발명의 이미지 센서 및 그 제조 방법에 따르면, 포토 다이오드 영역에 실리콘 게르마늄 에피택시얼층과 실리콘 에피택시얼층이 적층된다. 이후 상기 포토 다이오드 영역 상에 N형 불순물을 이온 주입하여 반도체 기판 내에 N형의 불순물층을 형성하고, 상기 실리콘 게르마늄 에피택시얼층과 실리콘 에피택시얼층에 P형 불순물을 주입하여 포토 다이오드를 형성한다. 상기 실리콘 게르마늄 에피택시얼층은 밴드 갭이 낮기 때문에 전하 생성량이 증가하여 광감도가 향상된다.
Abstract:
PURPOSE: A semiconductor device and a method for manufacturing the same are provided to reduce a current leakage using a high reliability gate insulating layer for high voltage. CONSTITUTION: A semiconductor substrate(100) has a high voltage region and a low voltage region. A high voltage transistor(TR-I) is formed in the high voltage region. The high voltage transistor includes a first active region, a first source/drain region, a first gate insulating layer, and a first gate electrode. A low voltage transistor(TR-II) is formed in the low voltage region. The low voltage transistor includes a second active area, a second source/drain region, a second gate insulating layer, and a second gate electrode.
Abstract:
An image sensor and a manufacturing method thereof are provided to form a pad for inputting/outputting a signal inside an insulation film structure by removing a passivation film on a sensor array region. A substrate includes a sensor array region(II) and a peripheral circuit region(I). A first insulation film structure(140) is formed on the peripheral circuit region, and includes a first multilayer line(M1a,M2a,M3a,M4a). A second insulation film structure(150) is formed on the sensor array region, and includes a second multilayer line(M1b,M2b). A top line of the first multilayer line is higher than a top line of the second multilayer line. The first insulation film structure includes an isotropic etch stop film(200). The second insulation structure does not include an isotropic etch stop film.
Abstract:
A processing method of a substrate surface, an image sensor manufacturing method using the same, and an image sensor manufactured thereby are provided to improve a low illumination characteristic of an image sensor by removing defects of a surface of a substrate. A silicon substrate preparation process is performed to prepare a silicon substrate having a surface defect(S510). A chemical solution supply process is performed to supply a chemical solution for processing a surface of the silicon substrate(S520). A chemical oxide layer manufacturing process is performed to consume the surface of the silicon substrate and to manufacture a chemical oxide layer on the silicon substrate(S530). A surface defect removal process is performed to remove defects from the surface of the silicon substrate.
Abstract:
An image sensor and a manufacturing method thereof are provided to control flicker noise in a source follower transistor by suppressing noise due to a channel at an interface between an isolation layer and an active region, particularly at a corner part of the isolation layer. An image sensor includes an isolation layer(108) and a channel-forming prevention region(107). The isolation layer is formed in the inside of the semiconductor substrate(101). The isolation layer is formed to define the active region. The channel-forming prevention region is formed with one conductive type impurity at an upper part of the interface between the active region and the isolation layer. The channel-forming prevention region is formed to prevent migration of charges. The channel-forming prevention region is formed with a P-type impurity.
Abstract:
이미지 센서 및 그 제조 방법이 제공된다. 비도핑된 절연 물질로 형성된 소자 분리막에 의해 활성 영역이 정의된 반도체 기판, 활성 영역 내에 형성된 광전 변환부 및 전하 검출부, 광전 변환부와 전하 검출부 사이의 활성 영역 상에 형성되어 광전 변환부에 축적된 전하를 전하 검출부로 전송하는 전하 전송부 및 광전 변환부와 소자 분리막의 경계에 일도전형의 불순물로 형성되어 암전류를 방지하는 전하 이동 방지 영역을 포함한다. 소자 분리막, 전하 이동 방지 영역, 암전류