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公开(公告)号：KR1020110086202A
公开(公告)日：2011-07-28
申请号：KR1020100005802
申请日：2010-01-22
Applicant: 삼성전자주식회사
Abstract: PURPOSE: A jig for a printed circuit board is provided to prevent the defect and damage to a printed circuit board which is generated in a printing process and a process of mounting a component by enabling the substrate to be aligned accurately. CONSTITUTION: In a jig for a printed circuit board, a substrate mounting groove(110) is formed on the top side of a palette. At least one sliding guide grooves(120) is formed on one side of a substrate mounting groove. A sliding member(140) makes a PCB closely contact to the other side the substrate mounting groove. An elastic member(150) applies elastic force to the sliding member. The elastic member is received into an elastic member receiving groove which is formed in a sliding guide groove.
Abstract translation: 目的：提供一种用于印刷电路板的夹具，以防止在印刷过程中产生的印刷电路板的缺陷和损坏以及通过使基板准确地对准而安装部件的过程。 构成：在印刷电路板的夹具中，在调色板的上侧形成有基板安装槽（110）。 至少一个滑动导向槽（120）形成在基板安装槽的一侧上。 滑动构件（140）使得PCB与衬底安装槽的另一侧紧密接触。 弹性构件（150）向滑动构件施加弹性力。 弹性构件被容纳在形成在滑动导向槽中的弹性构件容纳槽中。
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公开(公告)号：KR1020090029355A
公开(公告)日：2009-03-23
申请号：KR1020070094519
申请日：2007-09-18
Applicant: 삼성전자주식회사
IPC: H05K5/00
CPC classification number: H05K5/003 , H05K5/0069 , H05K5/0247 , H05K5/03
Abstract: A case for the electronic device is provided to cut down the manufacturing cost by fixing directly the circuit line fixing the electronic component in the inner surface of the case to form the pattern. A plurality of circuit lines(11) is fixed to directly in the inner surface of the case(10). The connection unit(11a) is formed in the end of a plurality of circuit lines. The terminal of electronic component(12) is connected to the connection unit through the soldering. A plurality of fixed holes for fixing is formed in the circuit line. A plurality of fixed protrusion is protruded in the inner surface of the case. A plurality of support ribs is protruded to the upper in the inner surface of the case. The circuit line includes the conductive layer and insulating layer.
Abstract translation: 提供了一种用于电子设备的壳体，以通过将固定电子部件的电路线直接固定在壳体的内表面中来形成图案来降低制造成本。 多个电路线（11）直接固定在壳体（10）的内表面。 连接单元（11a）形成在多条电路线的端部。 电子部件（12）的端子通过焊接连接到连接单元。 在电路线上形成多个用于固定的固定孔。 多个固定突出部突出在壳体的内表面中。 多个支撑肋突出到壳体内表面的上部。 电路线包括导电层和绝缘层。
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公开(公告)号：KR1020040035942A
公开(公告)日：2004-04-30
申请号：KR1020020062297
申请日：2002-10-12
Applicant: 삼성전자주식회사
IPC: H01L21/60
CPC classification number: H01L24/11 , H01L24/02 , H01L24/13 , H01L2224/0401 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/16 , H01L2924/0001 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2224/29099 , H01L2924/00014 , H01L2924/00
Abstract: PURPOSE: A method for fabricating and mounting a flip chip is provided to reduce risks due to harmful gases in the fabrication process by performing an argon-hydrogen reflow process. CONSTITUTION: A plating seed layer is deposited on an upper surface of a substrate(102). An upper surface of the plating seed layer is patterned to form an UBM(Under Bump Metallurgy) layer(110) by using photoresist. The UBM layer(110) is deposited on an upper surface of a photoresist pattern. The photoresist and the plating seed layer are removed therefrom. A solder bump is formed on the UBM layer(110). A reflow process for the solder bump is performed by using an argon-hydrogen process.
Abstract translation: 目的：提供一种用于制造和安装倒装芯片的方法，以通过进行氩 - 氢回流工艺来减少由于制造过程中的有害气体引起的风险。 构成：电镀种子层沉积在基底（102）的上表面上。 通过使用光致抗蚀剂，将电镀种子层的上表面图案化以形成UBM（Under Bump Metallurgy）（110）。 UBM层（110）沉积在光刻胶图案的上表面上。 从中除去光致抗蚀剂和电镀种子层。 在UBM层（110）上形成焊料凸块。 通过使用氩 - 氢处理来进行焊料凸块的回流工艺。
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公开(公告)号：KR101735474B1
公开(公告)日：2017-05-16
申请号：KR1020100081686
申请日：2010-08-23
Applicant: 삼성전자주식회사
IPC: H05K3/38 , B29C45/14 , H01R43/24 , H01G9/20 , H01L23/498
CPC classification number: H01R43/24 , Y10T29/49147
Abstract: 본발명의일측면은실리콘또는유리의취성재질로형성되고, 외부연결부재와의전기적연결을위한커넥터가실장된인쇄회로기판조립체에있어서, 인쇄회로기판조립체에강성을부여하도록폴리머소재의수지를도포하여인쇄회로기판조립체전체를몰딩함과동시에외부연결부재와연결할수 있는전극단자를외부로안전하게노출시키는인쇄회로기판조립체의몰딩방법에관한것이다. 이를위하여본 발명의일측면에따른인쇄회로기판조립체의몰딩방법은인쇄회로기판과, 상기인쇄회로기판에실장되어상기인쇄회로기판과외부연결부재를전기적으로접속시키는커넥터를포함하는인쇄회로기판조립체의몰딩방법에있어서, 상기커넥터의외부연결부재접속용전극단자가노출되지않도록상기커넥터에커넥터덮개를결합하고, 상기커넥터덮개가결합된인쇄회로기판조립체에수지를도포하여상기인쇄회로기판조립체를몰딩하고, 상기커넥터의외부연결부재접속용전극단자를노출시키기위하여상기몰딩된인쇄회로기판조립체에서상기커넥터덮개를분리하는것을포함한다.
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公开(公告)号：KR1020130125606A
公开(公告)日：2013-11-19
申请号：KR1020120049257
申请日：2012-05-09
Applicant: 삼성전자주식회사
Abstract: A circuit film integrated with an electronic product case according to the present invention comprises an electronic product case, a circuit having a printed upper surface, a power supply unit prepared in a rear surface to supply power to the circuit, and a transparent film having an electric element prepared in the circuit for an electrical function operation and becomes integrated with the electronic product case by injecting resin between the transparent film and the electronic product case. By doing this, the whole thickness of an electronic product is reduced by integrating the transparent film having the circuit therein with the electronic product case to enable the electronic product case to be electrically operated and to realize the whole thickness of an LED emitting function realizing unit only with the thickness of the electronic product case. Also, in order to prevent reduction of the safety of the electric element by the thin thickness, underfill coating or transparent resin premolding are performed, thereby raising the durability of the electric element and simplifying the number of component parts.
Abstract translation: 与根据本发明的电子产品外壳集成的电路膜包括电子产品外壳，具有印刷的上表面的电路，在背面准备的用于向电路供电的电源单元，以及具有 用于电功能操作的电路中制备的电元件，并通过在透明膜和电子产品外壳之间注入树脂而与电子产品外壳集成。 通过这样做，通过将具有电路的透明膜与电子产品外壳集成来减少电子产品的整体厚度，使得电子产品外壳能够电动操作，并实现LED发射功能实现单元的整体厚度 只有电子产品外壳的厚度。 此外，为了防止薄膜的电气元件的安全性降低，进行底部填充涂层或透明树脂预成型，从而提高电气元件的耐久性并简化部件数量。
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Patent Agency Ranking
公开(公告)号：KR1020130034310A
公开(公告)日：2013-04-05
申请号：KR1020110098254
申请日：2011-09-28
Applicant: 삼성전자주식회사
CPC classification number: H05K1/147 , H01L2224/16225 , H01L2924/181 , H05K1/148 , H05K1/189 , H05K3/284 , H05K3/323 , H05K3/361 , H05K5/065 , H05K2201/055 , H05K2203/1316 , H01L2924/00012 , H05K7/1015 , H05K1/02 , H05K1/18 , H05K7/1053
Abstract: PURPOSE: A printed circuit board assembly is provided to mount an electrical component in a printed circuit board with a wafer level and to directly bond a flexible printed circuit board to the printed circuit board, and to secure a thin printed circuit board assembly. CONSTITUTION: An electronic component(111,112) is mounted on a printed circuit board(100). The printed circuit board includes a wafer printed circuit board. The electronic component includes a semiconductor chip of a wafer level. The one end of a flexible printed circuit board(20) is directly boned to one side of the printed circuit board. A protection material(120) covers the printed circuit board to protect the electronic component.
Abstract translation: 目的：提供印刷电路板组件以将电气部件安装在具有晶片级的印刷电路板中，并将柔性印刷电路板直接接合到印刷电路板，并且固定薄的印刷电路板组件。 构成：电子元件（111,112）安装在印刷电路板（100）上。 印刷电路板包括晶片印刷电路板。 电子部件包括晶片级的半导体芯片。 柔性印刷电路板（20）的一端被直接粘结到印刷电路板的一侧。 保护材料（120）覆盖印刷电路板以保护电子部件。
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公开(公告)号：KR1020120056916A
公开(公告)日：2012-06-05
申请号：KR1020100081685
申请日：2010-08-23
Applicant: 삼성전자주식회사
CPC classification number: H01L23/49833 , H01L23/147 , H01L23/15 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L2224/48227 , H01L2924/09701 , H01L2924/15311 , H01L2924/19107
Abstract: PURPOSE: A connection structure of an interposer and a component using the same are provided to prevent damage of a solder joint due to repetitive thermal shocks by reducing stress added to the solder joint in the thermal shock environment. CONSTITUTION: An electronic component(1) is mounted on the interposer(10) with wire bonding. A rigid printed circuit board(40) is arranged at the bottom of edge portion of the interposer. The rigid printed circuit board alleviates stress added to a solder joint(30) due to the difference of thermal expansion rate between the interposer and a main printed circuit board. A penetration silicon via(51) is electrically connected with the rigid printed circuit board. A package component(60) is mounted on the main printed circuit board with an SMT(Surface Mount Technology) method which using the solder joint.
Abstract translation: 目的：提供插入件和使用其的部件的连接结构，以通过减少在热冲击环境中添加到焊点上的应力而防止由于重复的热冲击导致的焊点的损坏。 构成：电子部件（1）通过引线接合安装在插入件（10）上。 刚性印刷电路板（40）布置在插入件的边缘部分的底部。 由于插入件与主印刷电路板之间的热膨胀率的差异，刚性印刷电路板减轻了加入焊接接头（30）的应力。 穿透硅通孔（51）与刚性印刷电路板电连接。 使用焊接接头的SMT（表面贴装技术）方法将封装部件（60）安装在主印刷电路板上。
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