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公开(公告)号：KR1020140032301A
公开(公告)日：2014-03-14
申请号：KR1020120099033
申请日：2012-09-06
Applicant: 제일모직주식회사
IPC: C08L101/00 , C08K3/08 , C08L69/00 , C08J5/00
CPC classification number: C09D129/14 , C01P2004/03 , C01P2006/60 , C08K9/02 , C08K9/08 , C08K2003/0812 , C08K2201/005 , C08L33/12 , C08L33/14 , C09C1/64 , C09C1/644 , C09D183/00 , C08L101/00 , C08J5/00 , C08K3/08 , C08L69/00 , C08L69/005 , C08L67/00 , C08L51/04 , C08L25/04 , C08L23/00
Abstract: The present invention relates to a resin composition which comprises a thermosetting resin and metal-resin composite particles. The metal-resin composite particles comprises a metal deposition layer; a first coating layer on one surface of the metal deposition layer; a second coating layer on the other surface of the metal deposition layer; and each of the first and second coating layer comprises a thermosetting resin, and to a molded article using the same. [Reference numerals] (AA) Start; (BB) No; (CC) Yes
Abstract translation: 本发明涉及包含热固性树脂和金属 - 树脂复合颗粒的树脂组合物。 金属 - 树脂复合颗粒包括金属沉积层; 在所述金属沉积层的一个表面上的第一涂层; 在所述金属沉积层的另一个表面上的第二涂层; 并且第一和第二涂层中的每一个包括热固性树脂，以及使用其的成型制品。 （附图标记）（AA）开始; （BB）否 （CC）是的
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公开(公告)号：KR1020110079492A
公开(公告)日：2011-07-07
申请号：KR1020100101870
申请日：2010-10-19
Applicant: 제일모직주식회사
Abstract: PURPOSE: A electronic housing mold and a manufacturing method of the same are provided to reduce the total weight by decreasing the specific gravity and to change the form of succession into form of mold by using the pressure difference between the inside of the mold and outside of the mold. CONSTITUTION: The electronic housing mold has 0.2~2 mm of thickness. The apparent specific gravity of the molded product for the electronic device housing is 0.8~2.5 g/ml. The width / thickness of the molded product for the electronic device housing is 300,000~1500,000mm. The width / thickness of the molded product for the electronic device housing 500,000~1500,000mm. The electronic housing mold is manufactured by vacuum molding the extrusion flat board to have single layer or multi-layers. The curve modulus of the molded product for the electronic device housing is 1.8~20Gpa. The molded product for the electronic device housing is manufactured from the thermoplastic resin which is capable of extrusion.
Abstract translation: 目的：提供一种电子外壳模具及其制造方法，通过降低比重来降低总重量，并通过使用模具内部和外部之间的压力差将模具形式改变成模具的形式 模具。 规定：电子外壳模具的厚度为0.2〜2mm。 电子设备外壳的成型品的表观比重为0.8〜2.5g / ml。 电子设备外壳的成型品的宽度/厚度为30万〜150万。 用于电子设备外壳的模制产品的宽度/厚度为500,000〜1500,000mm。 电子外壳模具通过将挤出平板真空成型为具有单层或多层制造。 电子设备外壳的模制产品的弯曲模量为1.8〜20Gpa。 用于电子器件壳体的模制产品由能够挤出的热塑性树脂制成。
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公开(公告)号：KR1020110078945A
公开(公告)日：2011-07-07
申请号：KR1020090135872
申请日：2009-12-31
Applicant: 제일모직주식회사
Abstract: PURPOSE: Molded articles for electronic device housings and a method for preparing the same are provided to ensure excellent dimensional stability and mechanical strength and to secure thin thickness using a thermoplastic resin. CONSTITUTION: A molded product for an electronic device housing is molded from a thermoplastic resin composition including (A) 50-90 wt% of a polycarbonate resin and (B) 20 ~ 50 wt% of a polyester resin. The molded product for an electronic device housing has the thickness of 0.2-2mm and 0.8-2.5 g/ml of apparent specific gravity.
Abstract translation: 目的：提供用于电子设备外壳的模制品及其制备方法，以确保优异的尺寸稳定性和机械强度，并使用热塑性树脂确保薄的厚度。 构成：由（A）50-90重量％的聚碳酸酯树脂和（B）20〜50重量％的聚酯树脂的热塑性树脂组合物成型电子器件外壳的成型体。 用于电子设备外壳的模制产品具有0.2-2mm的厚度和0.8-2.5g / ml的表观比重。
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公开(公告)号：KR100705904B1
公开(公告)日：2007-04-10
申请号：KR1020050133067
申请日：2005-12-29
Applicant: 제일모직주식회사
Abstract: 본 발명은 열가소성 수지에 관한 것으로서, 구체적으로는 그라프트 공중합체 20-40 중량부와 스티렌 아크릴로니트릴 공중합체 40-80 중량부 및 폴리에틸렌테레프탈레이트 0.1-10중량부를 포함하는 것을 특징으로 하는 진공성형성이 우수한 열가소성 수지조성물에 관한 것이다.
본 발명에 의한 열가소성 수지는 폴리에틸렌테레프탈레이트를 첨가함으로 인해 고온인장강도가 향상되어 우수한 진공성형성을 제공할 수 있으며, 이러한 우수한 진공성형성을 가진 열가소성 수지는 냉장고 내상용 성형품 등 진공성형성 및 미려한 외관을 요구하는 성형품의 제조에 적용될 수 있다.
그라프트 공중합체, 스티렌 아크릴로니트릴 수지, 폴리에틸렌테레프탈레이트, 진공성형성, 연신특성Abstract translation: 本发明涉及一种热塑性树脂，具体而言，真空成型，其特征在于它包括20-40份的接枝共聚物（重量）的苯乙烯 - 丙烯腈共聚物和40至80份重量的聚对苯二甲酸乙二酯，0.1〜10重量份 本发明涉及具有优异性能的热塑性树脂组合物。
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公开(公告)号：KR1020060076161A
公开(公告)日：2006-07-04
申请号：KR1020050055782
申请日：2005-06-27
Applicant: 제일모직주식회사
CPC classification number: C08L55/02 , C08F279/04 , C08L25/12 , C08L51/04 , C08L2205/02 , C08L2205/03 , C08L2666/24 , C08L2666/02 , C08L2666/04
Abstract: 본 발명의 냉장고용 열가소성 수지 조성물은 (A) 평균 입자 크기가 0.1∼0.4 ㎛인 고무질 중합체 40∼70 중량% 존재 하에 시안화비닐 화합물과 방향족 비닐화합물의 단량체 혼합물 60∼30 중량%를 유화 그라프트 중 합한 아크릴로니트릴-부타디엔-스티렌 그라프트 공중합체 수지 20 내지 40 중량부; (B) (b
1 ) 평균 입자 크기가 0.1∼10 ㎛인 고무질 중합체 5∼20 중량%, 시안화비닐 화합물 10∼30 중량% 및 방향족 비닐화합물 65∼85 중량%를 공중합한 스티렌계 공중합체 0 내지 75 중량% 및 (b
2 ) 평균 입자 크기가 0.1∼10 ㎛인 고무질 중합체 5∼20 중량%, 및 방향족 비닐화합물 80∼95 중량%를 공중합한 스티렌계 공중합체 25 내지 100 중량%로 이루어진 스티렌계 공중합체 수지 1 내지 20 중량부; 및 (C) 시안화비닐 화합물-방향족 비닐화합물 공중합체 50 내지 79 중량부로 이루어진다.
냉장고용 수지, 환경응력 저항성, 진공성형성-
Patent Agency Ranking
公开(公告)号：KR1020050000631A
公开(公告)日：2005-01-06
申请号：KR1020030041096
申请日：2003-06-24
Applicant: 제일모직주식회사
IPC: C08K13/02
Abstract: PURPOSE: A lubricant for a resin is provided, which can prevent precipitates or crosslinked products, therefore improves processability of the resin and apparent property of products. And the resin composition containing the lubricant is also provided. CONSTITUTION: The lubricant is produced by a process comprising the steps of: injecting 20-50pts.wt. of magnesium oxide or calcium oxide into a sulfuric acid (15-45wt%) solution and reacting at 40-100deg.C; adding 30-70pts.wt. of at least one acid selected from abietic acid, neoabietic acid, dehydroabietic acid, pimaric acid, isopimaric acid, levopimaric acid, and palustric acid and reacting at 20-100deg.C to prepare precipitate; dehydrating and drying the precipitate. The lubricant can be also produced by reacting an abietic acid or its derivative, ionized by phosphorus or sodium, with a metal salt. And the resin composition contains 0.01-10wt% of the lubricant.
Abstract translation: 目的：提供用于树脂的润滑剂，其可以防止沉淀物或交联产物，从而提高树脂的加工性和产品的表观性能。 还提供含有润滑剂的树脂组合物。 构成：润滑剂通过包括以下步骤的方法生产：注入20-50pts.wt。 的氧化镁或氧化钙放入硫酸（15-45wt％）溶液中并在40-100℃反应; 加30-70pts.wt。 选自松香酸，新松酸，脱氢松香酸，海松酸，异海松酸，左旋海松酸和棕榈酸中的至少一种酸，并在20-100℃下反应以制备沉淀物; 脱水并干燥沉淀。 润滑剂也可以通过使由磷或钠离子化的松香酸或其衍生物与金属盐反应来制备。 树脂组合物含有0.01-10重量％的润滑剂。
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17.发明授权
公开(公告)号：KR101515430B1
公开(公告)日：2015-04-27
申请号：KR1020120118496
申请日：2012-10-24
Applicant: 제일모직주식회사
Abstract: 제1 열가소성 수지를 포함하는 적어도 하나의 기재층; 및 상기 기재층의 일면 또는 양면에 위치하고, 제2 열가소성 수지 및 금속-수지 복합 입자를 포함하는 적어도 하나의 메탈릭 수지층을 포함하고, 상기 제1 열가소성 수지와 상기 제2 열가소성 수지는 서로 동일하거나 상이하고, 상기 금속-수지 복합 입자는 금속 증착층, 상기 금속 증착층의 일면에 위치하는 제1 코팅층, 그리고 상기 금속 증착층의 다른 일면에 위치하는 제2 코팅층을 포함하고, 상기 제1 코팅층 및 상기 제2 코팅층은 각각 열경화성 수지를 포함하는 라미네이트 시트 및 상기 라미네이트 시트의 제조 방법, 상기 라미네이트 시트를 이용한 성형품 및 상기 성형품의 제조 방법에 관한 것이다.
Abstract translation: 至少一个基底层，其包含第一热塑性树脂; 并且至少一个金属树脂层位于基层的一侧或两侧并且包括第二热塑性树脂和金属 - 树脂复合颗粒，其中第一热塑性树脂和第二热塑性树脂彼此相同或不同 其中，金属树脂复合颗粒包括金属沉积层，位于金属沉积层一侧的第一涂层和位于金属沉积层另一侧的第二涂层， 并且第二涂层各自包含含有热固性树脂的层压片，制备该层压片的方法，使用该层压片的模制品以及制备该模制品的方法。
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18.发明公开
公开(公告)号：KR1020140052415A
公开(公告)日：2014-05-07
申请号：KR1020120118496
申请日：2012-10-24
Applicant: 제일모직주식회사
CPC classification number: B32B27/08 , B29C47/0019 , B29C47/065 , B29K2033/12 , B29K2055/02 , B29K2505/00 , B29K2995/0026 , B32B15/08 , B32B27/18 , B32B37/24 , B32B2038/0092 , B32B2264/0214 , B32B2264/105 , B32B2264/12 , B32B2307/406 , B32B2307/412 , B32B2307/414 , B32B2329/06 , B32B2509/10 , C08K2003/0812 , Y10T428/256
Abstract: The present invention relates to a laminate sheet, a manufacturing method thereof, an article using a laminate sheet, and a manufacturing method thereof. The laminate sheet includes at least one base layer including a first thermoplastic resin and at least one metallic layer which is located on one side or both sides of the base layer and includes a second thermoplastic resin and metal-resin composite particles. The first thermoplastic resin and the second thermoplastic resin are the same as or different from each other. The metal-resin composite particle includes a metal deposition layer, a first coating layer which is located on one side of the metal deposition layer, and a second coating layer which is located the other side of the metal deposition layer. The first coating layer and the second coating layer contain a thermosetting resin, respectively.
Abstract translation: 层叠片及其制造方法技术领域本发明涉及层叠片及其制造方法，其制造方法，使用层叠片的制品及其制造方法。 层压片包括至少一个包括第一热塑性树脂的基层和位于基层的一侧或两侧的至少一个金属层，并且包括第二热塑性树脂和金属 - 树脂复合颗粒。 第一热塑性树脂和第二热塑性树脂彼此相同或不同。 金属 - 树脂复合颗粒包括金属沉积层，位于金属沉积层一侧的第一涂层和位于金属沉积层另一侧的第二涂层。 第一涂层和第二涂层分别含有热固性树脂。
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公开(公告)号：KR1020140032604A
公开(公告)日：2014-03-17
申请号：KR1020120099034
申请日：2012-09-07
Applicant: 제일모직주식회사
IPC: C08J5/00 , C08L101/00 , C08K3/08 , C08L69/00
CPC classification number: B32B27/08 , B05D3/00 , B29C44/02 , B29C44/3442 , B29C44/3446 , B29C44/3453 , B29C45/1703 , B29C69/007 , B32B5/16 , C01P2004/03 , C01P2006/60 , C08J9/009 , C08J9/122 , C08J2203/06 , C08J2203/08 , C08J2333/12 , C09C1/64 , Y10T428/249986
Abstract: The present invention relates to a molded product which comprises a thermoplastic resin, a metal-resin complex particle, and an air hole. The metal-resin complex particle comprises: a metal deposition layer, a first coating layer positioned on one surface of the metal deposition layer, a second coating layer positioned on the other surface of the metal deposition layer, and the first and second coating layer respectively comprising a thermoplastic resin; and to a manufacturing method of a molded product.
Abstract translation: 本发明涉及一种包含热塑性树脂，金属 - 树脂复合颗粒和空气孔的模制产品。 金属 - 树脂复合颗粒包括：金属沉积层，位于金属沉积层的一个表面上的第一涂层，位于金属沉积层的另一个表面上的第二涂层，以及第一和第二涂层 包括热塑性树脂; 以及成型品的制造方法。
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公开(公告)号：KR1020130065457A
公开(公告)日：2013-06-19
申请号：KR1020110132315
申请日：2011-12-09
Applicant: 제일모직주식회사
IPC: C08L101/12 , C08K3/08 , C08K7/02 , C08J5/00
Abstract: PURPOSE: A thermoplastic resin composition is provided to have excellent processability, high bending strength, low surface resistance, high electric conductivity, and excellent electronic wave blocking effect. CONSTITUTION: A thermoplastic resin composition comprises 5-30 wt% of a first filler which is a fusible metal; 1-20 wt% of a second filler which is a non-fusible metal or fused of a metal and inorganic material; 10-60 wt% of a conductive fiber third filler; and 10-84 wt% of a thermoplastic resin. The first filler is a fusible metal filler which has a lower melting point than the melting point of the thermoplastic resin by 30 °C or more. The second filler is a fusible metal filler or fused filler of metal ad inorganic material which has a higher melting point than the melting point of the thermoplastic resin by 500 °C or more.
Abstract translation: 目的：提供热塑性树脂组合物以具有优异的加工性，高弯曲强度，低表面电阻，高导电性和优异的电子阻挡效果。 构成：热塑性树脂组合物包含5-30重量％的作为易熔金属的第一填料; 1-20重量％的第二填料，它是非易熔金属或熔融金属和无机材料; 10-60重量％的导电纤维第三填料; 和10-84重量％的热塑性树脂。 第一填料是熔融金属填料，其熔点比热塑性树脂的熔点低30℃以上。 第二填料是金属和无机材料的熔融金属填料或熔融填料，其熔点比热塑性树脂的熔点高500℃以上。
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