公开(公告)号：KR1020140050793A

公开(公告)日：2014-04-30

申请号：KR1020120117033

申请日：2012-10-22

Applicant: 제일모직주식회사

Inventor： 김지호 ,  양승용 ,  유용식 ,  조경래 ,  최재원

IPC: C09J7/02 ,  C09J133/04 ,  C09J11/00 ,  H01L21/60

CPC classification number: C09J7/385 ,  C09J7/22 ,  C09J7/30 ,  C09J11/00 ,  C09J133/04 ,  C09J2201/60 ,  C09J2203/326 ,  H01L21/6836 ,  H01L2021/60067

Abstract: The present invention relates to an adhesive film including an adhesive layer and a substrate film, and specifically, to an adhesive film for a semiconductor, wherein a ratio (B/A) of an elongation rate of an adhesive film (B) on an elongation rate of a substrate film (A) is 0.7 or less. The thickness of the adhesive layer is 20-40% of the thickness of the substrate film. The adhesive layer contains an isocyanate based hardener. The isocyanate based hardener is an isocyanate trimer.

Abstract translation: 本发明涉及一种粘合剂膜和基材膜，具体地说涉及一种用于半导体的粘合剂膜，其中粘合膜（B）的伸长率与伸长率之比（B / A） 基片（A）的比例为0.7以下。 粘合剂层的厚度为基底膜厚度的20-40％。 粘合剂层含有异氰酸酯类固化剂。 异氰酸酯类固化剂是异氰酸酯三聚体。

公开(公告)号：KR1020130070964A

公开(公告)日：2013-06-28

申请号：KR1020110138245

申请日：2011-12-20

Applicant: 제일모직주식회사

Inventor： 서광원 ,  조경래 ,  최재원

IPC: C09J7/02 ,  C09J133/04 ,  C08F20/10 ,  H01L21/58

CPC classification number: C08F20/10 ,  C08L33/10 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68386 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2224/27 ,  H01L21/78 ,  H01L2224/83 ,  C08L33/066 ,  C08L33/14 ,  C09J7/38 ,  C09J7/22 ,  C09J7/385 ,  C09J133/04 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/30

Abstract: PURPOSE: A non-UV type dicing die bonding film is provided to show an excellent pick-up characteristic, and to be able to maintain the adhesiveness to a ring frame without separation from the ring frame and the water leaching. CONSTITUTION: A non-UV type dicing die-bonding film comprises acrylic copolymer and a thermosetting material. The acrylic copolymer comprises (a) 55-99 parts by weight of alkyl acrylate monomer; (b) 5-30 parts by weight of acrylate monomer having hydroxyl group; and (c) 1-15 parts by weight of polyethyleneglycol (meth)acrylate to 100.0 parts by weight of the acrylic copolymer. The total content of the acrylate monomer having hydroxyl group and polyethyleneglycol (meth)acrylate to 100.0 parts by weight of the acrylic copolymer is 20-40 parts by weight.

Abstract translation: 目的：提供非UV型切割芯片接合膜，以显示出优良的拾取特性，并且能够保持与环形框架的粘合性而不会与环形框架分离和水浸。 构成：非UV型切割芯片接合薄膜包括丙烯酸共聚物和热固性材料。 丙烯酸共聚物包含（a）55-99重量份的丙烯酸烷基酯单体; （b）5-30重量份具有羟基的丙烯酸酯单体; 和（c）1-15重量份聚乙二醇（甲基）丙烯酸酯与100.0重量份的丙烯酸共聚物。 具有羟基的丙烯酸酯单体和聚乙二醇（甲基）丙烯酸酯与丙烯酸共聚物100.0重量份的总含量为20-40重量份。

公开(公告)号：KR1020120068453A

公开(公告)日：2012-06-27

申请号：KR1020100130084

申请日：2010-12-17

Applicant: 제일모직주식회사

Inventor： 어동선 ,  김지호 ,  황민규 ,  조경래 ,  송기태

IPC: C09J7/02 ,  C09J9/00 ,  C09J133/04 ,  H01L21/58

CPC classification number: C09J7/0217 ,  C08K5/0025 ,  C08K5/54 ,  C08L2312/08 ,  C09J7/20 ,  C09J133/04 ,  C09J133/14 ,  C09J143/04 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/6836 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/0665 ,  Y10T428/264 ,  Y10T428/2848 ,  Y10T428/2852 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2924/0635 ,  C09J7/38 ,  C09J7/35 ,  C09J7/385 ,  C09J9/00 ,  C09J2201/622

Abstract: PURPOSE: A pressure-sensitive dicing die bonding film is provide to comprise adhesive layers having different adhesion each other to an adhesive layer and a ring frame, thereby having frame stability, and high pick-up success rate. CONSTITUTION: A pressure-sensitive dicing die bonding film comprises a base film(4), a tackifying layer(5) formed on the base film, and an adhesive layer formed on the top of the adhesive layer. The adhesive force between the tackifying layer and the ring frame(B) is B/A>=1.1. The slid distance of the tackifying layer is 0-0.1 mm, when applying force to the tackifying layer by 10 gf per unit area 1mm^2. The tackifying layer is a monolayer, the thickness of the tackifying layer is 3-40 micron, and the tackifying layer comprises silane coupling agent.

Abstract translation: 目的：提供一种压敏切片模接合薄膜，其包括对粘合剂层和环形框架具有不同粘附性的粘合剂层，从而具有框架稳定性和高的拾取成功率。 构成：压敏切割芯片接合膜包括基膜（4），形成在基膜上的增粘层（5）和形成在粘合剂层顶部上的粘合剂层。 增粘层与环框架（B）之间的粘合力为B / A> = 1.1。 增粘层的滑动距离为0-0.1mm，当对单位面积1mm ^ 2施加力至增粘层10gf时。 增粘层为单层，增粘层的厚度为3-40微米，增粘层为硅烷偶联剂。