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公开(公告)号：KR101362878B1
公开(公告)日：2014-02-14
申请号：KR1020100139682
申请日：2010-12-30
Applicant: 제일모직주식회사
IPC: C09J133/14 , C09J133/04 , C09J7/02 , H01L21/58
Abstract: 본 발명은 포스페이트기를 갖는 아크릴계 공중합체를 포함시켜, 링프레임에 대한 점착력을 높이고 우수한 픽업 성공율을 갖는 다이싱 다이 본딩 필름용 점착제 조성물을 제공하는 것이다.
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公开(公告)号：KR1020120076270A
公开(公告)日：2012-07-09
申请号：KR1020100138350
申请日：2010-12-29
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J9/00 , C09J133/04 , H01L21/58
CPC classification number: H01L24/27 , C09J7/22 , C09J7/38 , C09J133/04 , C09J2203/326 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/27001 , H01L2224/27436 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/83191 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01025 , H01L2924/01033 , H01L2924/01072 , H01L2924/01073 , H01L2924/01077 , H01L2924/01082 , H01L2924/0665 , H01L2924/15788 , Y10T428/28 , Y10T428/2817 , Y10T428/2826 , Y10T428/287 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , C09J7/385 , C09J7/40 , C09J9/00 , C09J2201/622
Abstract: PURPOSE: A dicing die bonding film is provided not to require additional processes like a ring frame coating, etc, to have good pick-up in die attach process, obtaining stable adhesion in a ring frame, and to be convenient because of not needing UV process at semiconductor molding. CONSTITUTION: A dicing die bonding film comprises an adhesive layer, and a tackier layer contacted to the adhesive layer. The storage modulus of the adhesive layer at 25°C is 400-600 kPA, and peeling force against the adhesive layer measured by KS-A-01107 is 200-350 mN/25mm. the tackifier layer is formed through thermosetting. The tackifier layer comprises a binder resin, and a thermosetting agent, and not comprises a photoinitiator. The weight average molecular weight of the binder resin is 150,000-700,000 g/mol, and the glass transition temperature is (-55) - (-30) °C.
Abstract translation: 目的：提供切割芯片接合膜，不需要诸如环框涂层等的附加工艺，以便在芯片附接工艺中具有良好的拾取性能，在环形框架中获得稳定的粘附性，并且由于不需要UV而方便 半导体模制过程。 构成：切割芯片接合膜包括粘合剂层和与粘合剂层接触的粘性层。 粘合剂层在25℃下的储能模量为400-600kPa，通过KS-A-01107测定的对粘合剂层的剥离力为200-350mN / 25mm。 增粘剂层通过热固化形成。 增粘剂层包括粘合剂树脂和热固化剂，不包含光引发剂。 粘合剂树脂的重均分子量为150,000-700,000g / mol，玻璃化转变温度为（-55） - （-30）℃。
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公开(公告)号：KR101542623B1
公开(公告)日：2015-08-06
申请号：KR1020130003679
申请日：2013-01-11
Applicant: 제일모직주식회사
IPC: H01L51/52 , C08L101/02
CPC classification number: C08L101/02 , H01L51/524 , H01L51/5259
Abstract: 본발명은측쇄에경화성작용기를갖는바인더수지및 개시제를포함하는유기발광소자용충진제및 그의경화물을포함하는유기발광장치에관한것이다.
Abstract translation: 本发明涉及用于有机发光器件的填料和包含其固化产物的有机发光器件，所述有机发光器件用填料包含在其侧链中具有可固化官能团的粘结剂树脂和引发剂。
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Patent Agency Ranking
公开(公告)号：KR1020140091415A
公开(公告)日：2014-07-21
申请号：KR1020130003679
申请日：2013-01-11
Applicant: 제일모직주식회사
IPC: H01L51/52 , C08L101/02
CPC classification number: C08L101/02 , H01L51/524 , H01L51/5259 , H01L51/0034 , H01L51/0035 , H01L2224/0539 , H01L2924/0635
Abstract: The present invention relates to a filler for an organic light emitting device and the organic light emitting device including the same. The filler for the organic light emitting device according to the present invention includes an initiator and a binder resin with a curable functional group. The filler for the organic light emitting device according to the present invention has high reliability.
Abstract translation: 本发明涉及一种用于有机发光器件的填料和包括其的有机发光器件。 根据本发明的有机发光器件的填料包括具有可固化官能团的引发剂和粘合剂树脂。 根据本发明的有机发光器件的填料具有高可靠性。
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公开(公告)号：KR1020120067197A
公开(公告)日：2012-06-25
申请号：KR1020100128660
申请日：2010-12-15
Applicant: 제일모직주식회사
IPC: H01L21/301
CPC classification number: H01L24/27 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2224/83191 , H01L2924/01012 , H01L2924/01029 , H01L2924/3512 , H01L2924/00
Abstract: PURPOSE: A dicing die-bonding film is provided to differently produce peeling force of a surface contacting with a base film and a surface contacting with a wafer by adding specific metal oxide filler. CONSTITUTION: A dicing die-bonding film(10) has a first side(A) contacting to a base film and a second side(B) contacting to a semiconductor wafer. The dicing die-bonding film is formed into monolayer. Peel force of the first side is under 0.1 N/25mm. The peel force of the second side is over 0.2 N/25mm. A light hardening degree of the first side is 90% to 99%. A light hardening degree of the second side is 10% to 50%. The ratio of the first side and the second side is 1:5-30. The dicing die-bonding film includes a metal oxide particle selected by titanium dioxide, zinc oxide, or mixture thereof.
Abstract translation: 目的：通过添加特定的金属氧化物填料，提供切割芯片接合薄膜以不同地产生与基底膜接触的表面和与晶片接触的表面的剥离力。 构成：切割芯片接合膜（10）具有与基膜接触的第一侧（A）和与半导体晶片接触的第二侧（B）。 切割芯片接合膜形成为单层。 第一面的剥离力在0.1N / 25mm以下。 第二面的剥离力超过0.2N / 25mm。 第一侧的光硬化度为90％〜99％。 第二面的光硬化度为10％〜50％。 第一面和第二面的比例为1:5-30。 切割芯片接合膜包括由二氧化钛，氧化锌或其混合物选择的金属氧化物颗粒。
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公开(公告)号：KR1020140085262A
公开(公告)日：2014-07-07
申请号：KR1020120155618
申请日：2012-12-27
Applicant: 제일모직주식회사
IPC: H01L51/52
CPC classification number: H01L51/0034 , H01L51/0035 , H01L51/004
Abstract: The present invention relates to a filler for an organic light emitting device which includes a multifunctional compound and a binder resin with a curable functional group on a branch chain. The filler for the organic light emitting device according to the embodiment of the present invention suppresses the generation and growth of a dark spot.
Abstract translation: 本发明涉及一种有机发光装置用填料，其包括多官能化合物和在分支链上具有可固化官能团的粘合剂树脂。 根据本发明的实施方案的有机发光器件的填料抑制黑斑的产生和生长。
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公开(公告)号：KR101362876B1
公开(公告)日：2014-02-14
申请号：KR1020100139675
申请日：2010-12-30
Applicant: 제일모직주식회사
IPC: C09J133/14 , C09J183/04 , C09J7/02 , H01L21/58
Abstract: 본 발명은 실란기를 갖는 아크릴계 공중합체를 포함시켜, 링프레임에 대한 점착력을 높이고 우수한 픽업 성공율을 갖는 다이싱 다이 본딩 필름용 점착제 조성물을 제공하는 것이다.
Abstract translation: 本发明公开了一种用于切割模片接合膜的压敏粘合剂组合物，其包含具有硅烷基团的丙烯酸类共聚物，增强了与环形框架的粘合性并且具有优异的拾取成功率。
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公开(公告)号：KR101351615B1
公开(公告)日：2014-01-15
申请号：KR1020100127236
申请日：2010-12-13
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J11/00 , H01L21/683 , B32B37/00
Abstract: 본 발명은 박리기재 중 미절단 부위의 두께와 미절단 부위 간의 거리를 특정 비율로 하고 단위면적 당 파단 강도가 40N/15mm 이상 90N/15mm 이하가 되도록 함으로써 필름 파단을 억제하고 롤 형태 안정성을 유지할 수 있는 반도체용 점접착시트 및 그의 제조 방법을 제공하는 것이다.
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