Abstract:
본 발명은 m-면 사파이어 기판에 질화물계 박막을 형성하는 방법 및 이에 의해 제조된 질화물계 반도체에 관한 것이다. 본 발명에 따른 질화물계 박막을 형성하는 방법은 (A) m-면 사파이어 기판을 질화 처리하는 단계와; (B) 상기 질화 처리된 m-면 사파이어 기판을 고온 수소 분위기 하에서 질화물계 물질을 기 설정된 제1 성장 시간 동안 에피텍셜 성장시켜 에피텍셜 성장층을 형성하는 단계와; (C) 상기 에피텍셜 성장층의 표면을 열 에칭시켜 상기 에피텍셜 성장층의 표면에 식각면을 형성하는 단계와; (D) 고온 수소 분위기 하에서 기 설정된 제2 성장 시간 동안 상기 식각면으로부터 질화물계 물질을 에피텍셜 성장시켜 질화물계 박막을 형성하는 단계를 포함하는 것을 특징으로 한다. 이에 따라, m-면 사파이어 기판 상에 질화물계 박막을 형성하는데 있어, 표면 특성과 결정성, 광학적 효율을 증가시킬 수 있다.
Abstract:
PURPOSE: A high quality nitride semiconductor thin film and a manufacturing method thereof are provided to improve a surface profile property by forming a low temperature defect reducing layer between a first nitride semiconductor layer and a second nitride semiconductor layer. CONSTITUTION: A first nitride semiconductor layer(110) is formed on a substrate at a first temperature. A low temperature defect reducing layer(120) is formed on the first nitride semiconductor layer. A second nitride semiconductor layer(130) is formed on the low temperature defect reducing layer at a third temperature. The second temperature is lower than the first temperature and the third temperature. [Reference numerals] (AA) Growth temperature; (BB) Growth time
Abstract:
PURPOSE: A high quality non-polar/antipolarity semiconductor device and a manufacturing method thereof are provided to reduce the defect of a template layer and improve the crystalline quality by forming the template layer as a double buffer layer. CONSTITUTION: A sapphire substrate(110) comprises a crystal plane for the growth of non-polar or the antipolarity nitride semiconductor layer. A template layer(120) is formed on the sapphire substrate. The template layer comprises a low temperature buffer layer(121) and a high temperature buffer layer(122). The high temperature buffer layer is formed at the temperature higher than the formation temperature of the low temperature buffer layer.
Abstract:
PURPOSE: A method for forming a nitride thin film on an m-surface sapphire substrate and the nitride semiconductor manufactured thereby are provided to increase photoluminescence intensity by epitaxially re-growing an etching surface after a heat etching process. CONSTITUTION: An M-surface sapphire substrate(10) is nitrified. A nitride thin film(32) is formed by epitaxially growing the nitrified M-surface sapphire substrate with nitride materials under a high temperature hydrogen atmosphere. The M-surface sapphire substrate is nitrified within an MOCVD(Metalorganic Chemical Vapor Deposition) chamber in an atmosphere including hydrogen gas and ammonia gas for over 5 minutes. The growth temperature for the nitrified M-surface sapphire substrate is 1030°C. The nitride materials include GaN(Gallium Nitride).