Abstract:
PURPOSE: Organic aluminosilicate based lamellar inorganic materials which are usefully used as a core material of various ultramodern industries such as electric, electronic, space and aviation industries by having superior heat resistance and organic affinity and low hygroscopic, and a method for preparing the same are provided. CONSTITUTION: In organic lamellar inorganic materials in which organic polymers are introduced between layers of aluminosilicate based lamellar inorganic materials, the organic aluminosilicate based lamellar inorganic materials are characterized in that the organic polymers introduced between layers of the aluminosilicate based lamellar inorganic materials are low polarity siloxane amine oligomer selected from siloxane amine oligomers represented as in chemical formulae 1a and 1b and siloxane amine oligomer in which alkyl group produced by reaction of alkyl carbonyl chloride is substituted represented as in chemical formula 2, where R1 and R2 are -(CH2)pX1(CH2)q- or formula 3 respectively, wherein X1 is -CH2- or -O-; R is -(CH2)nX2(CH2)k-, wherein X2 is -CH2- or -CH=CH-; l and m are an integral number between 1 to 300 respectively, and p, q, n and k are an integral number between 1 to 30 respectively.
Abstract:
PURPOSE: Photosensitive transparent polyamic acid derivative and polyimide-based resin are provided, to improve light transmittance in visible light range, transparency and solubility and to reduce a dielectric constant. CONSTITUTION: The polyamic acid derivative is represented by the formula 1, wherein l is an integer of 1-500 and 0
Abstract:
PURPOSE: A method for pretreating a polycarbonate prepolymer is provided, to improve the color of the polycarbonate prepared by a solid state polymerization by removing the material deteriorating the color. CONSTITUTION: The method comprises the steps of preparing a polycarbonate prepolymer from an aromatic dihydroxy compound and a diaryl carbonate; dissolving the polycarbonate prepolymer in a solvent, and adding the dissolved one in a non-solvent to remove the remaining unreacted one and by-products, thereby obtaining a crystalline polycarbonate prepolymer; and solid state polymerizing the pretreated prepolymer. Preferably the solvent is at least one selected from chlorine-based organic solvents dissolving the polycarbonate prepolymer at a room temperature, and the non-solvent is a solvent capable of not dissolving the polycarbonate prepolymer at a room temperature More preferably the solvent is at least one selected from the group consisting of chloroform, ethylene chloride, dichloroethane and tetrachloroethane, and the non-solvent is acetone.
Abstract:
PURPOSE: Provided are a polyimide nano complex material with high crystallinity and its preparation method. The material is heat resistant, has low thermal expansion and good mechanical property and is used in industrial machines, electronic parts and in automobiles as heat resistant material. CONSTITUTION: The material is prepared by adding polyimide (PI) of formula 1 or its precursor polyamic acid solution into 1-30 wt.% of organo-aluminosilicate of layered structure dispersed in solution such as dimethylacetamide or N-methyl-2-pyrrolidone, stirring at room temp. for 1-24 hours and heat treating at 80-200deg.C. The PI or polyamic resins have average Mw. of 20,000-300,000g/mol, 0.3-1.5dL/g viscosity and 200-400deg.C glass transition temperature. The aminosilicate layer has 10-50 angstrom of thickness and 1,000-5,000 angstrom of length. Ammonium salts of aliphatic or aromatic hydrocarbon are introduced between the aminosilicate layers in order to increase the affinity with PI polymers.
Abstract:
PURPOSE: Provided is a polyolefin resin composition which uses the polyolefin resin as a matrix by nano compositing the delaminated organophilic layered silicate, polyolefin compatibilizer and the conventional fire retardant. The composite has excellent properties of mechanical strength, heat resistance, impact resistance, fabricability and fire resistance compared with conventional material. CONSTITUTION: The composite comprises: 10- 35wt.%(based on 100wt.% of the polyolefin resin) of organohalogen-based fire retardant; 0.5-10wt.% of the organophilic layered silicate in which the silicate is emulsified with organophosphorus acid salt and organo ammonium salt which are substituted with C12-36 alkyl groups or aromatic groups; 1-30wt.% polyolefin compatibilizer grafted with maleic acid, having average mol wt. of 5,000-90,000 and graft rate of 0.2-10 and more than one additive selected from a photo-stabilizer, a UV absorber, an anti-static agent, wax, pigments, an ignition delaying agent and a filler.
Abstract:
본 발명은 무색 투명의 고접착성 지방족 폴리이미드 수지와 이를 이용한 폴리이미드/무기물 복합 소재에 관한 것으로서, 더욱 상세하게로는 지방족 고리 구조와 접착성 향상 기능기를 함유하는 가용성의 신규한 무색 투명의 고접착성 지방족 폴리이미드 수지와, 상기한 신규 지방족 폴리이미드 수지가 유리(glass), 전도성 유리, 알루미늄, 구리, 티타늄 또는 이들의 산화물 등의 무기소재에 코팅되어 있어 액정표시 소자의 칼라필터의 버퍼코팅판(buffer coating layer), 유리기판과 TFT 사이의 절연층 재료, 터치패널(touch panel)용 액정표시 소자의 고분자 격벽 재료 등으로의 응용에 적합한 폴리이미드/무기물 복합 소재에 관한 것이다.
Abstract:
PURPOSE: A high adhesive polyimide/poly(ethylene terephthalate) compound film and a manufacturing method thereof are provided to enable the compound film to be used as a high quality adhesive film suitable for a flexible printed circuit board by virtue of improved heat-resistance, transparency, and mechanical properties thereof. CONSTITUTION: The high adhesive polyimide/poly(ethylene terephthalate) compound film comprises a thin soluble polyimide resin solution layer(1) coated on the one surface or the both surfaces of a poly(ethylene terephthalate) film(3), and a high adhesive polyester layer(2) between the film and the resin layer so as to increase an interfacial adhesive property therebetween.
Abstract:
PURPOSE: Provided are an organized, inorganic material having improved heat resistance and organizing property, which can be used as a key composite material of high-tech industry such as various electric, electronic, (aero)space industry, aero industries. CONSTITUTION: The organized, layered inorganic material consists of a layered inorganic material based on aluminosilicate, and an organic polymer positioned between layers of the inorganic material. The organic polymer is a low-polar siloxane amine oligomer selected from polysiloxane amine represented by formula 1a, 1b and 1c. In the formulae, each of R1 and R2 is -(CH2)nX(CH2)k-; X is -CH2- or -O-; each of l, m, k is an integer of 1-300. The siloxane amine oligomer has weight average molecular weight(Mw) of 1,000-50,000 g/mol, and equivalent weight of functionality of 500-25,000 g/eq.
Abstract:
PURPOSE: A polyester/polyamide hybrid film is provided in which heat resistance, transparency and interfacial adhesive property are greatly improved by coating a mixture of a polyamide resin solution and a polyamic acid solution on an aromatic polyester film to a thin film, and a method for manufacturing the same is provided. CONSTITUTION: The polyester/polyamide hybrid film having superior adhesive property is characterized in that a mixed resin of soluble polyamide of the following Chemical Formula(II) and polyamic acid of the following Chemical Formula(III) is coated on one or both surfaces of an aromatic polyester film represented as in the following Chemical Formula(I) to a thin film. In the chemical formulae, m and n are integers greater than 1, X is -CH2- or -O-.