公开(公告)号：SG11201707720SA

公开(公告)日：2017-10-30

申请号：SG11201707720S

申请日：2016-03-31

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： VENKATAGIRIYAPPA RAMAKRISHNA HOSUR ,  DE AVILA RIBAS MORGANA ,  DAS BARUN ,  SIDDAPPA HARISH HANCHINA ,  MUKHERJEE SUTAPA ,  SARKAR SIULI ,  SINGH BAWA ,  RAUT RAHUL ,  PANDHER RANJIT

IPC: B23K1/00 ,  B23K35/00 ,  C08K3/00 ,  C08K3/04 ,  C08K5/00 ,  C08K7/02 ,  C08L83/04 ,  H01L21/00 ,  H01L23/00

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalised graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminium oxide, zinc oxide, aluminium nitride, boron nitride, silver, nano fibres, carbon fibres, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt.% of the filler based on the total weight of the composition.

公开(公告)号：SG11202012605UA

公开(公告)日：2021-01-28

申请号：SG11202012605U

申请日：2019-06-21

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： GHOSAL SHAMIK ,  CHANDRAN REMYA ,  MANOHARAN VENODH ,  SARKAR SIULI ,  SINGH BAWA ,  RAUT RAHUL

IPC: B22F1/00 ,  B22F9/24 ,  B23K35/02

Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.

公开(公告)号：MY179941A

公开(公告)日：2020-11-19

申请号：MYPI2015000887

申请日：2013-10-09

Applicant: ALPHA METALS ,  ALPHA ASSEMBLY SOLUTIONS INC

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  KUMAR ANIL ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA

IPC: B23K1/00 ,  B23K3/06 ,  B23K35/02 ,  B23K35/26

Abstract: A lead-free, antimony-free solder alloy comprising: (a) 10 wt.% or less of silver (b) 10 wt.% or less of bismuth (c) 3 wt.% or less of copper (d) at least one of the following elements up to 1 wt.% of nickel up to 1 wt.% of titanium up to 1 wt.% of cobalt up to 3.5 wt.% of indium up to 1 wt.% of zinc up to 1 wt.% of arsenic (e) optionally one or more of the following elements 0 to 1 wt.% of manganese,0 to 1 wt. % of chromium 0 to 1 wt.% of germanium, 0 to 1 wt.% of iron, 0 to 1 wt.% of aluminum, 0 to 1 wt.% of phosphorus, 0 to 1 wt.% of gold, 0 to 1 wt.% of gallium, 0 to 1 wt.% of tellurium, 0 to 1 wt.% of selenium, 0 to 1 wt.% of calcium, 0 to 1 wt.% of vanadium, 0 to 1 wt.% of molybdenum, 0 to 1 wt.% of platinum, 0 to 1 wt.% of magnesium, 0 to 1 wt.% of rare earths, (f) the balance tin, together with any unavoidable impurities. (Fig.1)

公开(公告)号：SG10201801481SA

公开(公告)日：2018-04-27

申请号：SG10201801481S

申请日：2014-08-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： KHASELEV OSCAR ,  MO BIN ,  BOUREGHDA MONNIR ,  MARCZI MICHAEL T ,  SINGH BAWA

Abstract: A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.

公开(公告)号：ES2628028T3

公开(公告)日：2017-08-01

申请号：ES13777315

申请日：2013-10-09

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  KUMAR ANIL ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA

IPC: B23K35/26 ,  B23K1/002 ,  B23K1/012 ,  B23K1/19 ,  B23K35/02 ,  C22C13/00 ,  C22C13/02

Abstract: Una aleación de soldadura libre de plomo y antimonio que consta: del 3 al 5 % en peso de plata del 2 al 5 % en peso de bismuto del 0,3 al 3 % en peso de cobre del 0,03 al 1 % en peso de níquel al menos uno de los siguientes elementos del 0,005 al 1 % en peso de manganeso del 0,005 al 1 % en peso de titanio del 0,01 al 1 % en peso de cobalto el resto de estaño, junto con cualquier impureza inevitable.

公开(公告)号：EP2171755A4

公开(公告)日：2018-04-04

申请号：EP08782059

申请日：2008-07-18

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： BOUREGHDA MONNIR ,  DESAI NITIN ,  LIFTON ANNA ,  KHASELEV OSCAR ,  MARCZI MICHAEL T ,  SINGH BAWA

IPC: H01L23/488 ,  B22F1/02 ,  H01L21/60

CPC classification number: H05K13/0465 ,  B22F1/0062 ,  H01L23/373 ,  H01L24/03 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0381 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/83075 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/8321 ,  H01L2224/83211 ,  H01L2224/83438 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/83907 ,  H01L2224/8393 ,  H01L2224/83931 ,  H01L2224/8584 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/203 ,  H01L2924/3512 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T428/24893 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/01014

Abstract: Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate.

公开(公告)号：EP3257109A4

公开(公告)日：2018-08-01

申请号：EP16749792

申请日：2016-02-10

Applicant: ALPHA ASSEMBLY SOLUTIONS INC

Inventor： PROKOPIAK STEVEN DANE ,  ARORA SANYOGITA ,  PANDHER RANJIT S ,  TORMEY ELLEN S ,  SINGH BAWA

IPC: H01R4/04 ,  B23K35/00 ,  B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  B23K35/362 ,  B23K101/36

CPC classification number: B23K1/0016 ,  B23K3/04 ,  B23K35/00 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/362 ,  B23K2201/36 ,  C09J7/10 ,  C09J2201/28 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01R4/04

Abstract: A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.