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公开(公告)号：US09433086B2
公开(公告)日：2016-08-30
申请号：US14283372
申请日：2014-05-21
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
CPC classification number: H05K1/0271 , H05K1/0277 , H05K1/028 , H05K1/0281 , H05K1/118 , H05K2201/09063 , H05K2201/09145
Abstract: Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is formed. The slit line has at least a terminal end from which a stress-diverting cut segment extends. The stress-diverting cut segment is formed by cutting in a cutting direction that defines an angle with respect to an extension direction of the extension section to serve as the tear protection structure of the flexible circuit board. The extension section of the flexible circuit board is foldable along the slit line. The stress-diverting cut segment may further include a tear protection hole formed in a termination end thereof.
Abstract translation: 公开了一种用于柔性电路板的撕裂保护结构。 在柔性电路板的延伸部中，至少形成有切割线。 切割线至少具有应力分流切割部分从该终端延伸的终端。 应力转向切割段通过沿切割方向切割形成，该切割方向限定相对于延伸部分的延伸方向的角度，以用作柔性电路板的撕裂保护结构。 柔性电路板的延伸部分沿着切口线可折叠。 应力转向切割段还可以包括在其终止端中形成的撕裂保护孔。
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公开(公告)号：US09386692B2
公开(公告)日：2016-07-05
申请号：US14704196
申请日：2015-05-05
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
CPC classification number: H05K1/028 , H05K1/118 , H05K3/361 , H05K2201/0394 , H05K2201/041 , H05K2201/055 , H05K2201/09481
Abstract: A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad. The first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.
Abstract translation: 提供了一种用于柔性电路板的电源路径结构，并且包括第一柔性电路板，其包括至少一个第一连接焊盘和第一相对连接焊盘以及连接在第一连接焊盘和第一相对连接之间的第一电源路径 垫和第二柔性电路板，其包括连接在第二连接焊盘和第二相对连接焊盘之间的至少一个第二连接焊盘和第二相对连接焊盘和第二电源路径。 第一柔性电路板在垂直方向上堆叠在第二柔性电路板上，使得第一电源路径和第二电源路径形成用作电源路径的并联连接的电源路径，或者 第一柔性电路板的接地路径。
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13.发明授权公开(公告)号：US09204561B2
公开(公告)日：2015-12-01
申请号：US14307652
申请日：2014-06-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K1/115 , H05K1/028 , H05K1/0298 , H05K3/002 , H05K3/426 , Y10T29/49165
Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.
Abstract translation: 电路板的通孔的结构包括在载体板上形成布线之后形成的粘合剂层和导体层。 至少一个通孔在垂直方向上穿过载板，布线，粘合剂层和导体层延伸并形成孔壁表面。 导体层相对于垂直方向上的电路迹线的暴露区域显示高度差。 导电覆盖部分覆盖导体层和通孔的孔壁表面。 载板是单面板，双面板，多层板或其组合，单面板，双面板和多层板可以是柔性板， 刚性板，或组合柔性和刚性板的复合板。
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14.发明授权公开(公告)号：US09041482B2
公开(公告)日：2015-05-26
申请号：US14108838
申请日：2013-12-17
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Gwun-Jin Lin , Kuo-Fu Su , Chih-Heng Chuo
CPC classification number: H01P1/22 , H01P1/227 , H01P3/026 , H03H7/38 , H05K1/00 , H05K1/0242 , H05K1/025 , H05K1/0393 , H05K2201/0969 , H05K2201/09827
Abstract: An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.
Abstract translation: 柔性电路板的高频信号传输线的衰减减小控制结构包括形成在基板的表面上的阻抗控制层。 阻抗控制层包括沿着衬底的高频信号传输线的延伸方向布置的衰减减小图案，并且对应于高频信号传输线的底角结构，以便改善高频信号传输线的衰减， 频率信号通过高频信号传输线路传输。 基板的相对表面包括形成在其上的导电屏蔽层。 导电屏蔽层形成有对应于高频信号传输线的顶角结构的衰减减小图案。
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公开(公告)号：US09775249B2
公开(公告)日：2017-09-26
申请号：US15240155
申请日：2016-08-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K3/007 , H05K1/0281 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/025 , H05K3/064 , H05K3/188 , H05K3/429 , H05K2201/0338 , H05K2201/0352 , H05K2201/09563 , H05K2203/0152
Abstract: Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from a top surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.
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Patent Agency Ranking
公开(公告)号：US09578747B2
公开(公告)日：2017-02-21
申请号：US14827668
申请日：2015-08-17
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K1/115 , H05K1/028 , H05K1/0298 , H05K3/002 , H05K3/426 , Y10T29/49165
Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.
Abstract translation: 电路板的通孔的结构包括在载体板上形成布线之后形成的粘合剂层和导体层。 至少一个通孔在垂直方向上穿过载板，布线，粘合剂层和导体层延伸并形成孔壁表面。 导体层相对于垂直方向上的电路迹线的暴露区域显示高度差。 导电覆盖部分覆盖导体层和通孔的孔壁表面。 载板是单面板，双面板，多层板或其组合，单面板，双面板和多层板可以是柔性板， 刚性板，或组合柔性和刚性板的复合板。
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17.发明授权公开(公告)号：US09468101B2
公开(公告)日：2016-10-11
申请号：US14659977
申请日：2015-03-17
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K1/115 , H05K1/0251 , H05K1/092 , H05K3/06 , H05K3/4038 , H05K3/4069 , H05K2201/0397 , H05K2201/09845 , H05K2201/09854
Abstract: Disclosed urea microvia structure of a flexible circuit board and a manufacturing method thereof. A first through hole is formed in a first conductive layer of a flexible circuit board and a first exposed zone is defined. A second conductive layer includes a second through hole formed therein and defines a second exposed zone. A dielectric layer includes a dielectric layer through hole corresponding to the second through hole of the second conductive layer. A conductive paste layer is filled in the second through hole of the second conductive layer, the dielectric layer through hole of the dielectric layer, and the first through hole of the first conductive layer in such a way that the conductive paste layer covers and electrically contacts the first exposed zone of the first conductive layer and the second exposed zone of the second conductive layer.
Abstract translation: 柔性电路板的尿素微孔结构及其制造方法。 在柔性电路板的第一导电层中形成第一通孔，并且限定第一暴露区域。 第二导电层包括形成在其中的第二通孔并且限定第二暴露区域。 电介质层包括与第二导电层的第二通孔对应的电介质层通孔。 导电膏层填充在第二导电层的第二通孔，电介质层的电介质层通孔和第一导电层的第一通孔中，导电膏层覆盖并电接触 第一导电层的第一暴露区域和第二导电层的第二暴露区域。
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18.发明授权Contact pad connection structure for connecting conductor assembly and flexible circuit board 有权用于连接导体组件和柔性电路板的接触垫连接结构公开(公告)号：US09468099B2
公开(公告)日：2016-10-11
申请号：US14731709
申请日：2015-06-05
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Gwun-Jin Lin
IPC: H05K1/11
CPC classification number: H05K1/111 , H05K1/118 , H05K3/3405 , H05K2201/09145 , H05K2201/09909 , H05K2201/10356 , H05K2201/2027
Abstract: Disclosed is contact pad connection structure for connecting a conductor assembly and a flexible circuit board. A substrate has a top surface on which a plurality of elevation pads are formed and respectively located in spacing zones between contact pads. Each of the elevation pads has a height above a top contact surface of the contact pads. The conductor assembly has exposed conductors that are respectively set in contact with the top contact surfaces of the contact pads and a solder material is applied to solder and fix the exposed conductors respectively in position on the top contact surfaces of the contact pads. Each of the elevation pads includes an extension section extended in a direction toward a front edge of the substrate.
Abstract translation: 公开了用于连接导体组件和柔性电路板的接触垫连接结构。 衬底具有其上形成有多个仰角垫的顶表面，并且分别位于接触垫之间的间隔区域中。 每个仰角垫具有高于接触垫的顶部接触表面的高度。 导体组件具有分别设置成与接触焊盘的顶部接触表面接触的暴露的导体，并且施加焊料材料以将暴露的导体分别焊接并固定在接触焊盘的顶部接触表面上的适当位置。 每个仰角垫包括在朝向基板的前边缘的方向延伸的延伸部分。
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公开(公告)号：US09271392B2
公开(公告)日：2016-02-23
申请号：US14039068
申请日：2013-09-27
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Gwun-Jin Lin
CPC classification number: H05K1/0237 , H05K1/0218 , H05K1/0245 , H05K1/025 , H05K3/4691 , H05K2201/09063
Abstract: A rigid-flexible circuit board includes at least one flexible circuit board and at least one rigid circuit board. The flexible circuit board includes a flexible-board substrate, a plurality of flexible circuit board differential mode signal lines, at least one flexible circuit board grounding line, a flexible circuit board insulation layer formed on the upper surface of the flexible-board substrate and covering the flexible circuit board differential mode signal lines and the flexible circuit board grounding line. The rigid circuit board is stacked on the stacking section of the flexible circuit board. A shielding layer is formed on the flexible circuit board insulation layer of the flexible circuit board and corresponds to the extension section of the flexible circuit board. The shielding layer further extends from the extension section to the stacking section. An impedance control structure is formed on the shielding layer to control the impedance of the flexible circuit board differential mode signal lines.
Abstract translation: 刚性柔性电路板包括至少一个柔性电路板和至少一个刚性电路板。 柔性电路板包括柔性电路板基板，多个柔性电路板差模信号线，至少一个柔性电路板接地线，柔性电路板绝缘层，形成在柔性基板基板的上表面和覆盖层 柔性电路板差分信号线和柔性电路板接地线。 刚性电路板堆叠在柔性电路板的堆叠部分上。 屏蔽层形成在柔性电路板的柔性电路板绝缘层上，对应于柔性电路板的延伸部分。 屏蔽层从延伸部分进一步延伸到堆叠部分。 在屏蔽层上形成阻抗控制结构，以控制柔性电路板差模信号线的阻抗。
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20.发明授权Penetration and assembly structure for flexible circuit board with hinge assembly 有权具有铰链组合的柔性电路板的穿透和组装结构公开(公告)号：US09225134B2
公开(公告)日：2015-12-29
申请号：US14138364
申请日：2013-12-23
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Gwun-Jin Lin , Chih-Heng Chuo , Kuo-Fu Su
CPC classification number: H01R35/02 , H05K1/028 , H05K1/118 , H05K5/0226 , H05K2201/055 , H05K2201/2009 , Y10T29/49002
Abstract: Disclosed is a penetration and assembly structure for a flexible circuit board with a hinge assembly. With a pre-folding line formed on a pre-prepared flexible circuit board serving as a center line, a connection section of the flexible circuit board is folded to a terminal distribution section, and then, the connection section and an extended sheet are wound up in a direction towards the terminal distribution section to form the connection section into a rolled body with the extended sheet wrapped around the rolled body to provide an effect of protection. The rolled body is then inserted through a bore of a hinge assembly so that after the rolled body completely passes through the bore of the hinge assembly, the extension section of the flexible circuit board is located in the bore of the hinge assembly and the first end and the second end are respectively set at opposite ends of the bore of the hinge assembly. In other applications, a reinforcement plate is included to reinforce the terminal distribution section of the flexible circuit board.
Abstract translation: 公开了一种具有铰链组件的柔性电路板的穿透和组装结构。 利用形成在作为中心线的预先准备好的柔性电路板上的预折线，将柔性电路板的连接部折叠到端子分配部，然后将连接部和延伸片卷起 在朝向终端分配部分的方向上，将连接部分形成为卷绕体，其中延伸的片材缠绕在卷绕体上以提供保护效果。 然后将卷绕的主体穿过铰链组件的孔插入，使得在卷绕体完全通过铰链组件的孔之后，柔性电路板的延伸部分位于铰链组件的孔中，第一端 并且第二端分别设置在铰链组件的孔的相对端。 在其他应用中，包括加强板以加强柔性电路板的端子分配部分。
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