METHOD OF AND EVAPORATOR FOR PERFORMING VAPORISATION OF COMPOUNDS SUSCEPTIBLE TO OXIDATION

    公开(公告)号:PL185951B1

    公开(公告)日:2003-09-30

    申请号:PL32815897

    申请日:1997-01-20

    Applicant: BASF AG

    Abstract: PCT No. PCT/EP97/00245 Sec. 371 Date Jul. 24, 1998 Sec. 102(e) Date Jul. 24, 1998 PCT Filed Jan. 20, 1997 PCT Pub. No. WO97/26970 PCT Pub. Date Jul. 31, 1997The invention relates to a process for evaporating a liquid containing vaporizable oxidation-sensitive compounds in an evaporator in which the liquid is brought into contact with a heated solid surface for evaporation, by a process in which direct contact between the resulting vapor phase and the heated solid surface is substantially avoided. It also directed to an evaporator composed of a heatable solid surface (16), an apparatus (2, 3) for heating the solid surface and an apparatus (10) for feeding a liquid containing vaporizable compounds to the heatable solid surface, wherein the apparatus for feeding the liquid is designed and arranged in the evaporator in such a way (12, 14, 18) that direct contact between a resulting vapor phase and the heatable solid surface is substantially avoided.

    EVAPORATION OF OXIDATION-SENSITIVE COMPOUNDS AND EVAPORATOR FOR THIS PURPOSE

    公开(公告)号:CA2244271C

    公开(公告)日:2005-11-29

    申请号:CA2244271

    申请日:1997-01-20

    Applicant: BASF AG

    Abstract: The invention concerns a method of vaporizing a fluid containing vaporizable oxidation-sensitive compounds in a vaporizer in which, for vaporization purposes, the fluid is brought into contact with a heated solid surface, direct contact between the resultant vapour phase and the heated solid surface axing largely prevented. The invention further concerns a vaporizer comprising a heatable solid surface (16), a device (2, 3) for heating the solid surface, and a device (10) for feeding a fluid containing vaporizable compounds to the healable solid surface. The fluid-feeding device is designe d and disposed (12, 14, 18) in the vaporizer such that direct contact between the resultant vapour phase and the healable solid surface is largely prevented.

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