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11.发明申请公开(公告)号：US20190027366A1
公开(公告)日：2019-01-24
申请号：US16142343
申请日：2018-09-26
Applicant: EBARA CORPORATION
Inventor： Mizuki NAGAI , Masashi SHIMOYAMA
IPC: H01L21/288 , C25D17/06 , C25D17/00 , C25D7/12
Abstract: To suppress thicknesses of a plating film of dies adjacent to a portion in which patterns are not formed on a resist, and improve uniformity of a plated metal layer thickness in a substrate surface. A substrate holder according to the present invention has: a holding surface 57 for holding a substrate; a second holding member 60 configured to have an opening part 63 for exposing the holding surface 57, and to press the substrate placed on the holding surface 57 against the holding surface 57 to thereby hold the substrate; and a shielding plate 65 configured to protrude to an inside of the opening part 63 of the second holding member 60 in a radial direction and to shield a part of the holding surface 57. The shielding plate 65 is configured to be movable along the opening part 63.
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公开(公告)号：US20180038008A1
公开(公告)日：2018-02-08
申请号：US15669735
申请日：2017-08-04
Applicant: EBARA CORPORATION
Inventor： Takashi MITSUYA , Ryuya KOIZUMI , Toshio YOKOYAMA , Masashi SHIMOYAMA , Kunio OISHI
IPC: C25D17/00 , H01L23/00 , H01L21/288 , C25D21/12 , H01L21/768
CPC classification number: C25D17/001 , C25D17/004 , C25D17/008 , C25D17/06 , C25D21/12 , H01L21/2885 , H01L21/6723 , H01L21/67253 , H01L21/76879 , H01L21/76885 , H01L21/76898 , H01L22/26 , H01L24/11 , H01L2224/11462 , H01L2224/117
Abstract: A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. At least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and the result is reflected in the plate processing for the subsequent substrate.
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13.发明申请公开(公告)号：US20170226656A1
公开(公告)日：2017-08-10
申请号：US15426631
申请日：2017-02-07
Applicant: EBARA CORPORATION
Inventor： Chunhui DOU , Yoshitaka MUKAIYAMA , Yuji ARAKI , Masashi SHIMOYAMA , Jumpei FUJIKATA
CPC classification number: C25D21/14 , C25D3/38 , C25D17/00 , C25D17/001 , C25D17/02 , C25D21/10 , C25D21/18
Abstract: An improved apparatus for adding powder comprising at least a metal, such as copper, to a plating solution, and supplying the plating solution to a plating tank is disclosed. The apparatus includes a hopper having an inlet which is connectable to a powder conduit of a powder container holding the powder therein, a feeder which communicates with a bottom opening of the hopper, a motor coupled to the feeder, and a plating-solution tank coupled to an outlet of the feeder and configured to dissolve the powder in the plating solution.
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公开(公告)号：US20160265135A1
公开(公告)日：2016-09-15
申请号：US15163588
申请日：2016-05-24
Applicant: EBARA CORPORATION
Inventor： Jumpei FUJIKATA , Masashi SHIMOYAMA
CPC classification number: C25D21/08 , B08B3/08 , C25D5/12 , C25D17/001 , C25D17/06
Abstract: A plating apparatus includes: a plating bath configured to store a plating solution therein; a substrate transport device configured to remove a substrate before plating from a substrate cassette and return the substrate after plating to the substrate cassette; a substrate holder configured to detachably hold the substrate with a sealing member sealing a peripheral portion of the substrate and immerse the substrate in the plating solution in the plating bath; a dummy substrate arranged in a position accessible by the substrate transport device; and a substrate holder cleaning bath configured to immerse the substrate holder in a cleaning liquid to clean the substrate holder when holding the dummy substrate with the sealing member sealing a peripheral portion of the dummy substrate.
Abstract translation: 电镀装置包括：电镀液，其被配置为在其中存储电镀液; 基板输送装置，其被配置为在从基板盒进行电镀之前去除基板，并且在电镀之后将所述基板返回到所述基板盒; 衬底保持器，其被构造成用封闭所述衬底的周边部分的密封构件可拆卸地保持所述衬底，并将所述衬底浸入所述电镀液中的所述电镀溶液中; 布置在由所述基板输送装置可接近的位置的虚设基板; 以及衬底保持器清洗槽，其被配置为当用密封构件密封虚设衬底的周边部分来保持虚设衬底时，将衬底保持器浸入清洁液中以清洁衬底保持器。
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公开(公告)号：US20140166492A1
公开(公告)日：2014-06-19
申请号：US14103767
申请日：2013-12-11
Applicant: EBARA CORPORATION
Inventor： Masashi SHIMOYAMA , Jumpei FUJIKATA , Yuji ARAKI , Masamichi TAMURA , Toshiki MIYAKAWA
CPC classification number: C25D21/14 , C25D3/30 , C25D5/003 , C25D17/001 , C25D17/002 , C25D17/008 , C25D21/10 , C25D21/18
Abstract: An Sn alloy plating apparatus includes: a plating bath having a cathode chamber for holding therein an Sn alloy plating solution in which the substrate is to be immersed and an anode chamber for holding therein an anolyte containing Sn ions and an acid; an Sn anode located in the anode chamber; and an electrolytic solution supply line configured to supply an electrolytic solution containing the acid into the anode chamber such that a Sn ion concentration of the anolyte in the anode chamber is kept not less than a predetermined value and a concentration of the acid in the anolyte is kept not less than a predetermined acceptable value. The electrolytic solution supply line supplies the electrolytic solution into the anode chamber to increase an amount of the anolyte in the anode chamber and supply the anolyte into the Sn alloy plating solution by the increased amount.
Abstract translation: 一种Sn合金电镀装置，具备：具有阴极室的电镀槽，其具有用于保持浸渍有基板的Sn合金电镀液和用于保持含有Sn离子和酸的阳极电解液的阳极室; 位于阳极室中的Sn阳极; 以及电解液供给管线，被配置为将含有酸的电解液供给到阳极室中，使得阳极室中的阳极电解液的Sn离子浓度保持不低于预定值，阳极电解液中的酸浓度为 保持不低于预定的可接受值。 电解液供给线将电解液供给到阳极室，以增加阳极室中的阳极电解液的量，并通过增加量将阳极电解液供给到Sn合金电镀液中。
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Patent Agency Ranking
公开(公告)号：US20250034744A1
公开(公告)日：2025-01-30
申请号：US18280640
申请日：2022-05-27
Applicant: EBARA CORPORATION
Inventor： Ryosuke HIWATASHI , Yasuyuki MASUDA , Masashi SHIMOYAMA
Abstract: A resistor and the like capable of enhancing uniformity of a plating film formed on a substrate are provided. A resistor for a plating apparatus, for adjusting an electric field, the resistor being disposed between an anode and a holder holding a target object to be plated in the plating apparatus, is provided. The resistor for the plating apparatus includes a first resistance member having a first surface and including a plurality of first through holes formed open on the first surface, and a second resistance member having a second surface and including a plurality of second through holes formed open on the second surface, the first resistance member and the second resistance member are arranged with the first surface and the second surface facing each other, and a size of overlap between the plurality of first through holes and the plurality of second through holes is variable.
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公开(公告)号：US20240314936A1
公开(公告)日：2024-09-19
申请号：US18589195
申请日：2024-02-27
Applicant: EBARA CORPORATION
Inventor： Tsubasa ISHII , Ryosuke HIWATASHI , Masashi SHIMOYAMA
IPC: H05K3/24
CPC classification number: H05K3/241 , H05K2203/0165 , H05K2203/0723 , H05K2203/1554
Abstract: In a plating apparatus, a potential sensor capable of accurately confirming flatness in thickness of a plating film is provided. The plating apparatus includes a plating tank to store a plating solution, a substrate holder that holds the substrate, an anode disposed in the plating tank to oppose the substrate held by the substrate holder, a resistor disposed between the substrate held by the substrate holder and the anode and having a plurality of holes extending through sides of the resistor facing the anode and the substrate, and a potential sensor assembly disposed between the substrate held by the substrate holder and the resistor and configured to measure a potential of the plating solution, and the potential sensor assembly includes a base plate, a plurality of potential sensors arranged on the base plate, electrical wirings formed on the base plate for taking out signals from the plurality of potential sensors, and a protective film that protects the base plate and the electrical wirings.
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公开(公告)号：US20240295045A1
公开(公告)日：2024-09-05
申请号：US18589059
申请日：2024-02-27
Applicant: EBARA CORPORATION
Inventor： Tsubasa ISHII , Ryosuke HIWATASHI , Masashi SHIMOYAMA , Koichi MASUYA
IPC: C25D21/12
CPC classification number: C25D21/12
Abstract: Provided is a plating apparatus to determine appropriate control parameters for forming plating with high film thickness flatness on a substrate. The plating apparatus includes an estimation unit that estimates a density of a current flowing through an outer edge of the substrate, a current density calculation unit that calculates a density of a plating current flowing through a plating solution into the substrate based on the estimated current density, and a control parameter that specifies an operation mode of the plating apparatus, the current density calculation unit calculating the plating current density for each of a plurality of different operation modes of the plating apparatus, a film thickness calculation unit that calculates a thickness of a plating film formed on the substrate for each of the plurality of operation modes, based on each calculated plating current density, and a control parameter determination unit that determines a control parameter corresponding to an optimal operation mode, based on the calculated plating film thickness for each operation mode of the plating apparatus.
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公开(公告)号：US20230279579A1
公开(公告)日：2023-09-07
申请号：US18086319
申请日：2022-12-21
Applicant: EBARA CORPORATION
Inventor： Tsubasa ISHII , Masashi SHIMOYAMA , Masashi OBUCHI , Koichi MASUYA
CPC classification number: C25D21/12 , C25D17/007 , C25D17/06
Abstract: Provided is a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder that holds a substrate, and an anode disposed in the plating tank to oppose the substrate held by the substrate holder. The plating apparatus also includes a conduit having a first portion including an opening end disposed in a region between the substrate held by the substrate holder and the anode, and a second portion apart from the region between the substrate held by the substrate holder and the anode, the conduit having at least a part filled with a plating solution, and a potential sensor that is disposed in the second portion of the conduit and that is configured to measure a potential of the plating solution.
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公开(公告)号：US20230167574A1
公开(公告)日：2023-06-01
申请号：US17761550
申请日：2020-12-28
Applicant: EBARA CORPORATION
Inventor： Ryosuke HIWATASHI , Masashi SHIMOYAMA , Yasuyuki MASUDA
CPC classification number: C25D21/04 , C25D17/002 , C25D21/10 , C25D17/008
Abstract: A technique capable of preventing bubbles from being accumulated on a lower surface of an electric field shield plate is provided. A plating apparatus includes: a plating tank in which a plating solution is retained, and an anode is arranged: a substrate holder that is arranged above the anode, and holds a substrate serving as a cathode such that a surface to be plated of the substrate faces the anode; a diaphragm that partitions an inside of the plating tank into an anode region where the anode is arranged, and a cathode region where the substrate is arranged; and a supporting member that is in contact with a lower surface of the diaphragm and supports the diaphragm, and includes a plurality of beam components extending over regions between the anode and the substrate along the lower surface of the diaphragm, the beam components including bubble guide paths for guiding bubbles from the regions between the anode and the substrate to an outside.
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