公开(公告)号：US20150270151A1

公开(公告)日：2015-09-24

申请号：US14666196

申请日：2015-03-23

Applicant: EBARA CORPORATION

Inventor： Toshio YOKOYAMA ,  Masahiko SEKIMOTO ,  Kenichi KOBAYASHI ,  Kenichi AKAZAWA ,  Takashi MITSUYA ,  Keiichi KURASHINA

IPC: H01L21/677

CPC classification number: H01L21/67718 ,  H01L21/67086 ,  H01L21/67751 ,  H01L21/68707

Abstract: A substrate processing apparatus according to the present invention comprises a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented, and processing the substrate. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.

Abstract translation: 根据本发明的基板处理装置包括转印装置，该转印装置包括构造成夹持基板保持器的把持部，以及转印部，其被配置为转印由该抓持部抓住的基板支架，以及用于存储由 衬底保持器，使得衬底的表面垂直取向，并处理衬底。 把持部被配置为将基板的表面水平取向地抓握基板保持件。 转印部分被配置为将衬底保持器转移到处理槽上方，其中衬底的表面水平定向。

公开(公告)号：US20200255968A1

公开(公告)日：2020-08-13

申请号：US16315096

申请日：2017-06-07

Applicant: EBARA CORPORATION

Inventor： Yoshitaka MUKAIYAMA ,  Toshio YOKOYAMA ,  Kunio OISHI ,  Masaaki KIMURA ,  Jumpei FUJIKATA

IPC: C25D17/06 ,  C25D17/00 ,  C25D21/12 ,  G01N21/88

Abstract: An inspection apparatus, a plating apparatus, and an appearance inspection apparatus that are capable of automatically inspecting a substrate holder are provided. An inspection apparatus that includes an electric contact configured to contact a substrate to allow current flow to the substrate and a sealing member configured to seal a surface of the substrate and that inspects a substrate holder holding the substrate is provided. The inspection apparatus includes a stocker installation part in which a stocker configured to house the substrate holder is installed, a cleaning device configured to cleanse the substrate holder, a substrate attaching/detaching device configured to open and close the substrate holder, an appearance inspection apparatus configured to acquire image data or shape data of appearance of at least one of the sealing member and the electric contact, and a conveyer configured to convey the substrate holder among the stocker, the cleaning device, and the appearance inspection apparatus.

公开(公告)号：US20190214278A1

公开(公告)日：2019-07-11

申请号：US16236024

申请日：2018-12-28

Applicant: EBARA CORPORATION

Inventor： Toshio YOKOYAMA ,  Masahiko SEKIMOTO ,  Kenichi KOBAYASHI

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677

Abstract: A substrate attaching/detaching unit includes a stocker accommodating a plurality of substrate holders 80 and adapted so that the substrate holders 80 are aligned in a vertical direction with one another in a horizontal posture, a first substrate holder conveying mechanism that takes the substrate holders 80 into and out of the stocker, an elevating mechanism that raises and lowers the first substrate holder conveying mechanism in the vertical direction, a second substrate holder conveying mechanism that transfers the substrate holder to and from the first substrate holder conveying mechanism, and a substrate attaching/detaching mechanism that attaches and detaches the substrate to and from the substrate holder held in the second substrate holder conveying mechanism.

公开(公告)号：US20190093250A1

公开(公告)日：2019-03-28

申请号：US16129227

申请日：2018-09-12

Applicant: EBARA CORPORATION

Inventor： Gaku YAMASAKI ,  Tomonori HIRAO ,  Toshio YOKOYAMA

IPC: C25D5/02 ,  C25D17/00 ,  C25D21/12 ,  C25D17/12 ,  C25D5/04 ,  C25D5/10 ,  C25D5/16 ,  C25D7/12 ,  H05K3/42

Abstract: A plating apparatus including a plating bath, a substrate holder to be arranged in the plating bath and adapted to hold a substrate, an anode for generating an electric field between the substrate and the anode, and at least one electric field shielding body for shielding the substrate holder and a part or the whole of the electric field, wherein the electric field shielding body has an opening portion for allowing the electric field between the substrate and the anode to pass therethrough, and is configured so as to be capable of adjusting an opening size in a first direction of the opening portion and an opening size in a second direction of the opening portion independently of each other.

公开(公告)号：US20180223444A1

公开(公告)日：2018-08-09

申请号：US15868673

申请日：2018-01-11

Applicant: EBARA CORPORATION

Inventor： Toshio YOKOYAMA ,  Tomonori HIRAO ,  Sho TAMURA

IPC: C25D17/00 ,  C25D17/06 ,  C25D5/10 ,  C25D5/02 ,  H01L21/288

CPC classification number: C25D17/004 ,  C25D5/028 ,  C25D5/10 ,  C25D17/001 ,  C25D17/005 ,  C25D17/008 ,  C25D17/06 ,  H01L21/2885

Abstract: The present invention provides a plating apparatus capable of individually controlling a plating process on a front surface and a back surface of a substrate and a substrate holder usable for such a plating apparatus. A substrate holder for holding a substrate which is a plating target during a plating process is provided and such a substrate holder includes a body part for holding the substrate, provided with a first opening and a second opening, the body part is configured such that when the body part holds the substrate, a plated region on the front surface of the substrate is exposed through the first opening and a plated region on the back surface of the substrate is exposed through the second opening and a sealing part that protrudes from a peripheral portion is included in at least part of the peripheral portion of the body part.

公开(公告)号：US20150357213A1

公开(公告)日：2015-12-10

申请号：US14734983

申请日：2015-06-09

Applicant: EBARA CORPORATION

Inventor： Toshio YOKOYAMA ,  Masahiko SEKIMOTO ,  Kenichi KOBAYASHI

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/02 ,  H01L21/687 ,  H01L21/311 ,  B25J11/00 ,  H01L21/68

CPC classification number: H01L21/67086 ,  H01L21/67718 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/68707 ,  H01L21/68721

Abstract: A substrate attaching/detaching unit includes a stocker accommodating a plurality of substrate holders 80 and adapted so that the substrate holders 80 are aligned in a vertical direction with one another in a horizontal posture, a first substrate holder conveying mechanism that takes the substrate holders 80 into and out of the stocker, an elevating mechanism that raises and lowers the first substrate holder conveying mechanism in the vertical direction, a second substrate holder conveying mechanism that transfers the substrate holder to and from the first substrate holder conveying mechanism, and a substrate attaching/detaching mechanism that attaches and detaches the substrate to and from the substrate holder held in the second substrate holder conveying mechanism.

Abstract translation: 基板安装/拆卸单元包括容纳多个基板保持件80的储料器，并且适于使基板保持件80在垂直方向上以水平姿势彼此对准;第一基板保持器输送机构，其将基板保持件80 进出储存器的方法，是使第一基板保持架输送机构沿垂直方向升高并降低的升降机构，将基板保持件向第一基板保持架输送机构转移的第二基板保持架输送机构， /分离机构，其将基板附接到保持在第二基板保持架输送机构中的基板保持件和从基板保持器分离。

公开(公告)号：US20150270147A1

公开(公告)日：2015-09-24

申请号：US14666215

申请日：2015-03-23

Applicant: EBARA CORPORATION

Inventor： Kenichi KOBAYASHI ,  Masahiko SEKIMOTO ,  Toshio YOKOYAMA ,  Kenichi AKAZAWA ,  Keiichi KURASHINA ,  Takashi MITSUYA

IPC: H01L21/67 ,  B25J11/00 ,  H01L21/687

CPC classification number: H01L21/67057 ,  B25J11/0095 ,  H01L21/67034 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/68721 ,  H01L21/68742

Abstract: A substrate processing apparatus capable of inhibiting diffusion of a chemical solution atmosphere around a processing bath. The substrate processing apparatus has a processing bath for storing a substrate holder holding a substrate and for processing the substrate, a lifter configured to support the substrate holder, store the substrate holder in the processing bath, and take out the substrate holder from the processing bath, and a cover configured to cover the periphery of the substrate holder taken out from the processing bath by the lifter.

Abstract translation: 能够抑制处理槽周围的化学溶液气氛扩散的基板处理装置。 基板处理装置具有用于存储保持基板并用于处理基板的基板保持件的处理槽，构造成支撑基板保持器的升降器，将基板保持器存储在处理槽中，并从处理槽取出基板保持件 以及盖，其构造成覆盖由所述升降机从所述处理槽取出的所述基板保持器的周边。

公开(公告)号：US20150082613A1

公开(公告)日：2015-03-26

申请号：US14494038

申请日：2014-09-23

Applicant: EBARA CORPORATION

Inventor： Hiroyuki SHINOZAKI ,  Kenji SHINKAI ,  Tadakazu SONE ,  Hideo AIZAWA ,  Hiroshi AONO ,  Toshio YOKOYAMA

IPC: B23Q7/00

CPC classification number: H01L21/68742 ,  H01L21/6719 ,  Y10T29/49998

Abstract: [Problem] An object of the present invention is to facilitate height level adjustment of a substrate processing apparatus regardless of size thereof.[Means for Solving] A lifting device 630b includes: a lifting mechanism 640 that is provided between at least one of a plurality of units of a substrate processing apparatus and an installation surface of the unit, and that adjusts height of the at least one unit with respect to the installation surface; and an adjustment member 660 that is provided with an extended section 664 extended from the lifting mechanism 640, and that is capable of operating the lifting mechanism 640 through the extended section 664.

Abstract translation: 本发明的目的在于便于基板处理装置的高度调整，而不管其尺寸如何。 具体实施方式提升装置630b具有：提升机构640，其设置在基板处理装置的多个单元中的至少一个与该单元的安装面之间，并且调整至少一个单元的高度 相对于安装面; 以及调节构件660，其具有从提升机构640延伸的延伸部664，并且能够通过延伸部664操作提升机构640。