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公开(公告)号：BRPI0904795A2
公开(公告)日：2013-10-29
申请号：BRPI0904795
申请日：2009-11-24
Applicant: GEN ELECTRIC
Inventor： GUNTURI SATISH SIVARAMA , BALASUBRAMANIAM MADADEVAN , MALLINA RAMAKRISHNA VENKATA , BEAUPRE RICHARD ALFRED , YAN LE , ZHANG RICHARD S , STEVANOVIC LJUBISA DRAGOLJUB , PAUTSCH ADAM GREGORY , SOLOVITZ STEPHEN ADAM
IPC: H01L23/367
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公开(公告)号：CA2719179C
公开(公告)日：2013-08-13
申请号：CA2719179
申请日：2010-10-28
Applicant: GEN ELECTRIC
Abstract: A device is provided that includes a first conductive substrate (102) and a second conductive substrate (104). A first power semiconductor component (118a) having a first thickness can be electrically coupled to the first conductive substrate. A second power semiconductor component (118b) having a second thickness can be electrically coupled to the second conductive substrate. A positive terminal (142) can also be electrically coupled to the first conductive substrate, while a negative terminal (144) can be electrically coupled to the second power semiconductor component, and an output terminal (146) may be electrically coupled to the first power semiconductor component and the second conductive substrate. The terminals, the power semiconductor components, and the conductive substrates may thereby be incorporated into a common circuit loop, and may together be configured such that a width of the circuit loop in at least one direction is defined by at least one of the first thickness or the second thickness.
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公开(公告)号：CA2780658A1
公开(公告)日：2012-12-24
申请号：CA2780658
申请日：2012-06-22
Applicant: GEN ELECTRIC
Inventor： BEAUPRE RICHARD ALFRED , SMOLENSKI JOSEPH LUCIAN , GERSTLER WILLIAM DWIGHT , SHEN XIAOCHUN
IPC: H01L23/367 , H05K7/20
Abstract: A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling segment. The cooling segment includes an inlet plenum for entry of a cooling medium, a plurality of inlet manifold channels, a plurality of outlet manifold channels, and an outlet plenum. The plurality of inlet manifold channels are coupled orthogonally to the inlet plenum for receiving the cooling medium from the inlet plenum. The plurality of outlet manifold channels are disposed parallel to the inlet manifold channels. The outlet plenum is coupled orthogonally to the plurality of outlet manifold channels for exhaust of the cooling medium. A plurality of millichannels are disposed in the base plate orthogonally to the inlet and the outlet manifold channels. The plurality of milli channels direct the cooling medium from the plurality of inlet manifold channels to the plurality of outlet manifold channels.
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公开(公告)号：CA2700013C
公开(公告)日：2012-10-09
申请号：CA2700013
申请日：2010-04-15
Applicant: GEN ELECTRIC
Inventor： CAIAFA ANTONIO , NASADOSKI JEFFREY JOSEPH , GLASER JOHN STANLEY , SABATE JUAN ANTONIO , BEAUPRE RICHARD ALFRED
IPC: H03K17/687 , H03K17/60
Abstract: One embodiment is a gate drive circuitry (60) for switching a semiconductor device (62) having a non-isolated input, the gate drive circuitry (60) having a first circuitry (64) configured to turn-on the semiconductor device (62) by imposing a current on a gate of the semiconductor device (62) so as to forward bias an inherent parasitic diode of the semiconductor device (62). There is a second circuitry (66) configured to turn--off the semiconductor device (62) by imposing a current on the gate of the semiconductor device (62) so as to reverse bias the parasitic diode of the semiconductor device (62) wherein the first circuitry (64) and the second circuitry (66) are coupled to the semiconductor device (62) respectively through a first switch and a second switch.
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公开(公告)号：CA2704870A1
公开(公告)日：2010-11-29
申请号：CA2704870
申请日：2010-05-20
Applicant: GEN ELECTRIC
Abstract: A heatsink assembly (10) for cooling a heated device (50) includes a ceramic substrate (64) having a plurality of cooling fluid channels (26) integrated therein. The ceramic substrate (64) includes a topside surface (56) and a bottomside surface (68). A layer of electrically conducting material (62) is bonded or brazed to only one of the topside and bottomside surfaces (66), (68) of the ceramic substrate (64). The electrically conducting material (62) and the ceramic substrate (64) have substantially identical coefficients of thermal expansion.
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Patent Agency Ranking
公开(公告)号：CA2687936C
公开(公告)日：2017-12-05
申请号：CA2687936
申请日：2009-12-10
Applicant: GEN ELECTRIC
Inventor： BEAUPRE RICHARD ALFRED , STEVANOVIC LJUBISA DRAGOLJUB , ERNO DANIEL JASON , WOYCHIK CHARLES GERARD
Abstract: A cooling device (10) includes a ceramic substrate (16) with a metal layer (22) bonded to an outer planar surface (18). The cooling device (10) also includes a channel layer (24) bonded to an opposite side of the ceramic substrate (16) and a manifold layer (26) bonded to an outer surface (28) of the channel layer (24). The substrate layers (16), (22), (24), (26) are bonded together using a high temperature process such as brazing to form a single substrate assembly (14). A plenum housing (30) is bonded to the single substrate assembly (14) via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports (32), (34).
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公开(公告)号：BR102012015581A2
公开(公告)日：2013-10-29
申请号：BR102012015581
申请日：2012-06-25
Applicant: GEN ELECTRIC
Inventor： BEAUPRE RICHARD ALFRED , SMOLENSKI JOSEPH LUCIAN , DWIGHT GERSTLER WILLIAM , SHEN XIAOCHUN
IPC: H01L23/473
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公开(公告)号：CA2740681C
公开(公告)日：2013-10-15
申请号：CA2740681
申请日：2011-05-19
Applicant: GEN ELECTRIC
Inventor： DELGADO ELADIO CLEMENTE , STEVANOVIC LJUBISA , BEAUPRE RICHARD ALFRED
Abstract: A dual pole busbar power connector including opposing elements configured to form a slot configured to receive a dual-pole blade therebetween. The slot extends from busbars to opposing element distal ends. The opposing elements each includes: a first contact extending into the slot from the opposing element; and a second contact extending into the slot from the opposing element and disposed farther from a slot busbar end than the first contact. When the dual-pole blade is inserted in the slot the first contact contacts a respective blade element at a location in the slot more proximate the slot busbar end than a slot distal end.
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公开(公告)号：CA2740681A1
公开(公告)日：2011-12-03
申请号：CA2740681
申请日：2011-05-19
Applicant: GEN ELECTRIC
Inventor： DELGADO ELADIO CLEMENTE , STEVANOVIC LJUBISA , BEAUPRE RICHARD ALFRED
Abstract: A dual pole busbar power connector including opposing elements configured to form a slot configured to receive a dual-pole blade therebetween. The slot extends from busbars to opposing element distal ends. The opposing elements each includes: a first contact extending into the slot from the opposing element; and a second contact extending into the slot from the opposing element and disposed farther from a slot busbar end than the first contact. When the dual-pole blade is inserted in the slot the first contact contacts a respective blade element at a location in the slot more proximate the slot busbar end than a slot distal end.
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公开(公告)号：GB2470991A
公开(公告)日：2010-12-15
申请号：GB201008668
申请日：2010-05-25
Applicant: GEN ELECTRIC
IPC: H01L23/373 , H01L23/473 , H05K7/20
Abstract: A heatsink assembly 10 for cooling a heated device 50 includes an electrically isolating layer 64 such as a ceramic substrate having a plurality of cooling fluid channels 26 integrated therein. The electrically isolating layer 64 includes a topside surface 66 and a bottomside surface 68. A layer of electrically conducting material 62 is bonded or brazed either to the topside or the bottomside surfaces 66, 68 of the electrically isolating layer 64. The electrically conducting material 62 and the electrically isolating layer 64 have substantially identical coefficients of thermal expansion. Preferably the fluid cooling consists of inlet and outlet plena (20, fig 2), inlet and outlet manifolds (16,18, fig 2) connected to the plena, and cooling fluid channels 26, of micro-channel to milli-channel dimensions in the electrically isolating layer 64 . The electrically isolating layer 64 preferably consists of a ceramic such as AIN, BeO, Si3N4and A12O3. The cooling channels in the electrically isolating layer may be arranged to be continuous or in the form of discreet arrays as shown in fig 5.
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