Abstract:
A technique for and structures for camouflaging an integrated circuit structure. The integrated circuit structure is formed having a well of a first conductivity type under the gate region being disposed adjacent to active regions of a first conductivity type. The well forming an electrical path between the active regions regardless of any reasonable voltage applied to the integrated circuit structure.
Abstract:
Semiconducting devices, including integrated circuits, are protected from reverse engineering by passivation openings made in a passivation layer. When a reverse engineeretches away the passivation layer and typically the first metal layer, underlying metallayers and/or other elements of the device are destroyed making the reverse engineeringall the more difficult. A method for fabricating such devices is also disclosed.
Abstract:
The similarity of non-operable and operable transistors in an integrated circuit is increased by ensuring that the distance between the gate and source or drain electrodes is the same for both types of transistor. The use of non-operable transistors allow the circuit designer to disguise an AND gate so that it appears to be an OR gate to the reverse engineer. The disguised non-operable transistors cause the circuitry to operate in an unexpected manner to the reverse engineer.
Abstract:
A technique for and structures for camouflaging an integrated circuit structure. A layer of conductive material having a controlled outline is disposed to provide artifact edges of the conductive material that resemble an operable device when in fact the device is not operable.
Abstract:
A method and circuit for blocking unauthorized access to at least one memory cell in a semiconductor memory. The method includes providing a switch and/or a link which assumes an open state when access to the at least one memory cell is to be blocked; and coupling-a data line associated with the at least one memory cell to a constant voltage source in response to the switch or link assuming an open state.
Abstract:
Technique and structures for camouflaging an integrated circuit structure. The integrated circuit structure is formed by a plurality of layers of material having controlled outlines and controlled thicknesses. A layer of dielectric material of a controlled thickness is disposed among said plurality of layers to thereby render the integrated circuit structure intentionally inoperable.
Abstract:
A technique for and structures for camouflaging an integrated circuit structure. The integrated circuit structure is formed having a well of a first conductivity type under the gate region being disposed adjacent to active regions of a first conductivity type. The well forming an electrical path between the active regions regardless of any reasonable voltage applied to the integrated circuit structure.