公开(公告)号：AU2002319480A1

公开(公告)日：2003-02-17

申请号：AU2002319480

申请日：2002-07-26

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  WEISMAN RENEE ,  INTERRANTE MARIO ,  COFFIN JEFFREY THOMAS ,  STUTZMAN RANDALL JOSEPH ,  GAYNES MICHAEL ANTHONY ,  SPRING CHRISTOPHER TODD ,  PETERSON BRENDA LEE ,  SABLINSKI WILLIAM EDWARD ,  SHANNON MEGAN ,  HAMEL HARVEY CHARLES ,  ZITZ JEFFREY ALLEN

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

公开(公告)号：CZ363897A3

公开(公告)日：1998-11-11

申请号：CZ363897

申请日：1997-11-17

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  SATHE SANJEEV BALWANT

IPC: H05K7/20 ,  H01L21/56 ,  H01L23/12 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433

Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.