公开(公告)号：AU2002319480A1

公开(公告)日：2003-02-17

申请号：AU2002319480

申请日：2002-07-26

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  WEISMAN RENEE ,  INTERRANTE MARIO ,  COFFIN JEFFREY THOMAS ,  STUTZMAN RANDALL JOSEPH ,  GAYNES MICHAEL ANTHONY ,  SPRING CHRISTOPHER TODD ,  PETERSON BRENDA LEE ,  SABLINSKI WILLIAM EDWARD ,  SHANNON MEGAN ,  HAMEL HARVEY CHARLES ,  ZITZ JEFFREY ALLEN

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.