Abstract:
PURPOSE: To reduce the swing of a bit line by limiting the swing of a rise bit line to prescribed voltage higher than power voltage. CONSTITUTION: External voltages VCC and VSS are used for a word line driver 20, PMOS cell array 16 in an n-type well, a COMS AC connection sense amplifier 18 and a bit line monitor circuit 22. Since an initial bit line is precharged by VEQ which is larger than the threshold of QPCELL of VTP, a signal can be generated at high speed. A signal charge appearing on the bit line BL30 from an access cell is speedily detected in the sense amplifier at sense clocks ϕSR and ϕSP. Here, voltages VCC and VSS charge rise BL and discharge fall BL. Thus, sense speed improves. At that time, a reference bit is monitored in the monitor circuit 22, non-activates clocks ϕ1 and ϕ2 and limits voltage when it reaches setting voltage. Then, the swing of boosting voltage is limited between a power source and setting voltage and the swing of the bit line can be reduced.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for determining an optimum write bit line current and an optimum write word line current in an MRAM. SOLUTION: In an asteroid curve represented by a bit line magnetic field H x generated by a write bit line current I B and a word line magnetic field H y generated by a write word line current I W , manufacturing variations and a design margin are taken into consideration to assume an asteroid curve AC out outside all memory cell asteroid curves (located with a hatched area of Figure). The write bit line current and write word line current are selected so as to minimize write electric power consumed by a write current obtained by totalizing the write bit line current and the write word line current or a bit line and a write word line. In addition, a write bit line current and a write word line current are selected so as to form a synthetic magnetic field on a curve between a point H1 and a point H2 on the asteroid curve AC out in order to prevent multi-selection. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a field programmable gate array (FPGA) which can shorten a configuration time and a time for rewriting wiring information and logic arrangement information, and can reduce its occupation area. SOLUTION: For storing FPGA wiring information, magnetic memory elements MTJ1 to MTJn are provided as MRAM memory cells. A shift register 71 is used to input the wiring information to the magnetic memory elements MTJ1 to MTJn. The register 71 includes register elements SR1 to SRn corresponding to the magnetic memory elements MTJ1 to MTJn. The wiring information are serially input to the register elements SR1 to SRn and stored therein. When the power is turned on, the wiring information of the magnetic memory elements MTJ1 to MTJn are latched by latch elements LT1 to LTn and output to a switch circuit 6 for interconnecting logic blocks. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To retain a latch status in a logic circuit which is on stand by status without losing original features in the logic circuit which achieves low electric power consumption and high speed performance using a MTCMOS circuit. SOLUTION: Power source lines Vdd and Vss, and virtual power source lines v-Vdd and v-Vss are connected with MOSFETHvt-Tr1 and Hvt-Tr2 which have high threshold voltage. Power source is supplied from v-Vdd and v-Vss to the combinational logic circuit 1 and nonvolatile latch circuits NVL1 to n. NVL1 to n are connected to arbitrary nodes which require status report on the stand by status in the combinational logic circuit 1. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a nonvolatile latch circuit in which nonvolatile memory elements are individually arranged within a logic circuit. SOLUTION: Tunnel magneto resistive elements MTJ0 and MTJ1 are connected to the respective sources of inverters INV1 and INV2 having a C-MOS structure and output and input of the inverters INV1 and INV2 are mutually cross connected. Transistors Tr5 and Tr6 which are used for precharging are connected to the output of the inverters and a transistor Tr7 is arranged between the elements MTJ0 and MTJ1 and the ground. Data are written into the elements MTJ0 and MTJ1 by the current that is flowing in a data writing line DWL and the states recorded in the elements MTJ0 and MTJ1 are taken out to an output OUT and an output OUT bar by REFRESHN signals.
Abstract:
PROBLEM TO BE SOLVED: To reduce a test cost by omitting a shifting process in which a chip on a wafer is shifted from a test device to a cutting device once to cut a fuse of a fuse circuit block in a conventional fuse circuit block. SOLUTION: This device is provided with two non-volatile storage elements 16, 18 storing data of connection or cut off of a fuse circuit, a circuit changing the direction of magnetization of this non-volatile storage elements 16, 18, and a current mirror circuit reading data stored in the non-volatile storage elements 16, 18.
Abstract:
PROBLEM TO BE SOLVED: To provide a nonvolatile magnetic memory cell and a storage circuit block employing the same. SOLUTION: A nonvolatile memory cell 32 includes a bit line 14; a storage element 10, including a ferromagnetic layer in which its magnetizing direction varies, depending on the direction of the magnetic field generated by a current flowing through the bit line 14; a conductor 12 for connecting the bit line 14 to the element 10, a switching element 28; a first wiring structure 24 sandwiching the element 10 between the conductors 12 and itself, and connecting the element 10 to one end of the element 28; a write work line 16 intersecting with the bit line 14 in a no-contact manner therewith; and an insulation film 20 for insulating the work line 16 from the element 10.
Abstract:
PROBLEM TO BE SOLVED: To improve the reliability of recording of a MRAM. SOLUTION: This device has read-out word lines WLR and write-in word lines WLW extending in the direction of (y), and write-in read-out bit lines BLW/R and write-in bit lines BLW extending in the direction of (x), and a memory cell MC is arranged at an intersection of a word line and a bit line. The memory cell MC comprises a sub-cell SC1 and a sub-cell SC2, the sub-cell SC1 comprises magnetic resistance elements MTJ1, MTJ2, and a selection transistor Tr1, and the sub-cell SC2 comprises magnetic resistance elements MTJ3, MTJ4, and a selection transistor Tr2, and the sub-cell SC2, The magnetic resistance elements MTJ1 and MTJ2 are connected in parallel, also, the magnetic resistance elements MTJ3 and MTJ2 are connected in parallel. The sub- cells SC1 and SC2 are connected in series between the write-in read-out bit lines BLW/R and ground.
Abstract:
PURPOSE: To provide a reliable high-density semiconductor integrated circuit device with high-speed operation by forming a DRAM macrocell and a logical cell in a common chip. CONSTITUTION: A DRAM macroscopic cell 14 is formed on the same cell as a logical cell. The DRAM macroscopic cell 14 includes a guard ring 26 of a conductive type opposite to that of a semiconductor substrate, a memory cell alley 42 formed in a well in the guard ring 26, a power line 34, a grounding line 36, and a bypass capacitor 70 joined between the power line 34 and the grounding line 36. The power line 36 and a logical-cell power line are connected to different power pads, while the grounding line 36 and a logic-cell grounding line are connected to a common grounding line or to grounding lines provided near to each other and connected with a low impedance line.