Abstract:
A bipolar transistor with raised extrinsic base and selectable self-alignment between the extrinsic base and the emitter (106) is disclosed. The fabrication method may include the formation of a predefined thickness of a first extrinsic base layer (102) of polysilicon or silicon on an intrinsic base (108). A dielectric landing pad (128) is then formed by lithography on the first extrinsic base layer (102). Next, a second extrinsic base layer (104) of polysilicon or silicon is formed on top of the dielectric landing pad (128) to finalize the raised extrinsic base total thickness. An emitter (106) opening is formed using lithography and RIE, where the second extrinsic base layer (104) is etched stopping on the dielectric landing pad (128). The degree of self-alignment between the emitter (106) and the raised extrinsic base is achieved by selecting the first extrinsic base layer (102) thickness, the dielectric landing pad (128) width, and the spacer width.
Abstract:
A high fT and fmax bipolar transistor (100) includes an emitter (104), a base (120), and a collector (116). The emitter has a lower portion (108) and an upper portion (1.12) that extends beyond the lower portion. The base includes an intrinsic base (140) and an extrinsic base (144). The intrinsic base is located between the lower portion of the emitter and the collector. The extrinsic base extends from the lower portion of the emitter beyond the upper portion of the emitter and includes a continuous conductor (148) that extends from underneath the upper portion of the emitter and out from underneath the upper portion of the emitter. The continuous conductor provides a low electrical resistance path from a base contact (not shown) to the intrinsic base. The transistor may include a second conductor (152) that does not extend underneath the upper portion of the emitter, but which further reduces the electrical resistance through the extrinsic base.
Abstract:
Methods for fabricating bipolar junction transistors, bipolar junction transistors made by the methods, and design structures for a bipolar junction transistor. The bipolar junction transistor (80) includes a dielectric layer (32) on an intrinsic base (84) and an extrinsic base (82) at least partially separated from the intrinsic base by the dielectric layer. An emitter opening (52) extends through the extrinsic base and the dielectric layer. The dielectric layer is recessed laterally relative to the emitter opening to define a cavity (60a, 60b) between the intrinsic base and the extrinsic base. The cavity is filled with a semiconductor layer (64) that physically links the extrinsic base and the intrinsic base together.
Abstract:
Verfahren zum Herstellen von Bipolartransistoren, Bipolartransistoren, die mittels der Verfahren hergestellt werden, sowie Entwurfsstrukturen für einen Bipolartransistor. Der Bipolartransistor (80) beinhaltet eine dielektrische Schicht (32) auf einer intrinsischen Basis (84) und eine extrinsische Basis (82), die durch die dielektrische Schicht wenigstens teilweise von der intrinsischen Basis getrennt ist. Eine Emitter-Öffnung (52) erstreckt sich durch die extrinsische Basis und die dielektrische Schicht hindurch. Die dielektrische Schicht ist lateral relativ zu der Emitter-Öffnung vertieft, um einen Hohlraum (60a, 60b) zwischen der intrinsischen Basis und der extrinsischen Basis zu definieren. Der Hohlraum ist mit einer Halbleiterschicht (64) gefüllt, welche die extrinsische Basis und die intrinsische Basis physisch miteinander verbindet.
Abstract:
A heterojunction bipolar transistor 100 and a method of forming the heterojunction bipolar transistor with a raised collector pedestal 125 in reduced dimension for reduced base-collector junction capacitance. The raised collector pedestal 125 is on the top surface of a substrate 121, 120, 101 and extends vertically through dielectric layer(s) 103, 104. The raised collector pedestal is un-doped or low-doped and is aligned above a sub-collector region 120, 121 contained within the substrate 101 and is narrower than that sub-collector region 120. An intrinsic base layer 105,132/131 is above the raised collector pedestal and the dielectric layer(s) 103, 104. An extrinsic base layer 141 is above the intrinsic base layer 132, 131. Thus, the space between the extrinsic base layer and the sub-collector region is increased. This increased space is filled by dielectric material and the electrical connection between the intrinsic base layer and the sub-collector region is provided by the relatively narrow, un-doped or low-doped, raised collector pedestal. Consequently the base-collector junction capacitance is reduced and the maximum oscillation frequency (fmax) is increased.
Abstract:
Methods for fabricating bipolar junction transistors, bipolar junction transistors made by the methods, and design structures for a bipolar junction transistor. The bipolar junction transistor includes a dielectric layer on an intrinsic base and an extrinsic base at least partially separated from the intrinsic base by the dielectric layer. An emitter opening extends through the extrinsic base and the dielectric layer. The dielectric layer is recessed laterally relative to the emitter opening to define a cavity between the intrinsic base and the extrinsic base. The cavity is filled with a semiconductor layer that physically links the extrinsic base and the intrinsic base together.