公开(公告)号：DE3676458D1

公开(公告)日：1991-02-07

申请号：DE3676458

申请日：1986-07-29

Applicant: IBM

Inventor： BEYER KLAUS DIETRICH ,  GUTHRIE WILLIAM LESLIE ,  MARKAREWICZ STANLEY RICHARD ,  MENDEL ERIC ,  PATRICK WILLIAM JOHN ,  PERRY KATHLEEN ALICE ,  PLISKIN WILLIAM AARON ,  RISEMAN JACOB ,  SCHIABLE PAUL MARTIN ,  STANDLEY CHARLES LAMBER

IPC: H01L21/3205 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/3213 ,  H01L21/768 ,  H01L21/306 ,  H01L21/60

Abstract: A method is disclosed for producing coplanar metal/insulator films on a substrate according to a chem-mech polishing technique. In one example, a substrate (31) having a patterned insulating layer (32) of dielectric material thereon, is coated with a layer of metal (34). The substrate is then placed in a parallel polisher and the metal is removed elsewhere except in the holes (33) where it is left intact (34a). This is made possible through the use of an improved selective slurry which removes the metal much faster than the dielectric material. The insulating layer may then be used as an automatic etch stop barrier.

公开(公告)号：DE3574078D1

公开(公告)日：1989-12-07

申请号：DE3574078

申请日：1985-12-13

Applicant: IBM

Inventor： HAUSE JAMES ROBERT ,  MENDEL ERIC

IPC: H01L21/304 ,  H01L21/306 ,  H01L29/06 ,  H01L21/66 ,  C30B33/00 ,  C30B29/60

Abstract: A semiconductor blank wafer to be used in a final simultaneous polishing step of both wafer surfaces for getting a wafer of superior flatness and surface finish, the wafer having a diametral cross-sectional shape like that of a "dogbone" wherein the wafer is thinner in its medial region than it is in the peripheral region and has rounded edges, this shape resulting from a chemical thinning operation.

公开(公告)号：DE3473846D1

公开(公告)日：1988-10-13

申请号：DE3473846

申请日：1984-02-22

Applicant: IBM

Inventor： BASI JAGTAR SINGH ,  MENDEL ERIC

IPC: C09K3/14 ,  B24B37/04 ,  C01F7/02

公开(公告)号：DE3367042D1

公开(公告)日：1986-11-20

申请号：DE3367042

申请日：1983-06-23

Applicant: IBM

Inventor： BASI JAGTAR SINGH ,  MENDEL ERIC

IPC: H01L21/304 ,  C09G1/02 ,  H01L21/306 ,  H01L21/302

公开(公告)号：DE2961004D1

公开(公告)日：1981-12-24

申请号：DE2961004

申请日：1979-07-16

Applicant: IBM

Inventor： BASI JAGTAR SINGH ,  LYONS VINCENT JAMES ,  MENDEL ERIC

IPC: B24B37/00 ,  B24D13/14 ,  B24B37/04

公开(公告)号：DE2438877A1

公开(公告)日：1975-07-03

申请号：DE2438877

申请日：1974-08-13

Applicant: IBM

Inventor： BASI JAGTAR SINGH ,  MENDEL ERIC

IPC: B24B37/00 ,  C23F1/00 ,  H01L21/304 ,  H01L21/461