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21 records (took 0.019 seconds)

    11.
    发明专利
    未知

    公开(公告)号：IT1148807B

    公开(公告)日：1986-12-03

    申请号：IT2040780

    申请日：1980-03-07

    Applicant: IBM

    Inventor： NARKEN BERNT ,  RAO RAMAMAHARA TUMMALA

    IPC: H01L21/48 ,  H01L23/08 ,  H01L23/12 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H01L

    Abstract: A method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multi-layered glass-ceramic superstructure with a multi-layered distribution of conductors on a preformed multi-layered glass-ceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass-ceramic prior to further additions of conductor patterns and crystallizable glass layers to form a monolithic compatible substrate all through. Semiconductor chips can be electrically connected to expose conductor patterns at the top surface of the resultant glass-ceramic package.

    INTEGRATED CIRCUIT PHOTOMASK
    12.
    发明专利
    INTEGRATED CIRCUIT PHOTOMASK 未知

    公开(公告)号：DE3270169D1

    公开(公告)日：1986-04-30

    申请号：DE3270169

    申请日：1982-12-02

    Applicant: IBM

    Inventor： NARKEN BERNT ,  SCHICK HENRY CARL

    IPC: G03F1/00 ,  H01L21/027 ,  G03F7/26 ,  G03F7/02

    Abstract: The invention relates to an integrated circuit photomask. The photomask is formed of a transparent dielectric substrate (1), such as glass and quartz based substrates, and has a conductive surface adjacent region (3), which is patterned with sequential overcoatings of a composite chrome oxide layer (5) and a chrome film (6). The mask comprises a combination of varied reflectivities to provide proper densities for the opaque areas of the mask.

    INTEGRATED CIRCUIT PHOTOMASK
    14.
    发明专利
    INTEGRATED CIRCUIT PHOTOMASK 未知

    公开(公告)号：CA1187203A

    公开(公告)日：1985-05-14

    申请号：CA417821

    申请日：1982-12-15

    Applicant: IBM

    Inventor： NARKEN BERNT ,  SCHICK HENRY C

    IPC: G03F1/00 ,  H01L21/027 ,  G03F7/26 ,  G03F7/02

    Abstract: Integrated Circuit Photomask A photomask formed of a transparent dielectric substrate, such as glass and quartz based substrates, having a conductive surface adjacent region, which is patterned with sequential overcoatings of a composite chrome oxide layer and a chrome film. The mask comprises a combination of varied reflectivities to provide proper densities for the opaque areas of the mask.

    MULTI-LAYERED GLASS-CERAMIC SUBSTRATE FOR MOUNTING OF SEMICONDUCTOR DEVICE
    15.
    发明专利
    MULTI-LAYERED GLASS-CERAMIC SUBSTRATE FOR MOUNTING OF SEMICONDUCTOR DEVICE 未知

    公开(公告)号：CA1123116A

    公开(公告)日：1982-05-04

    申请号：CA343375

    申请日：1980-01-09

    Applicant: IBM

    Inventor： NARKEN BERNT ,  TUMMALA RAO R

    IPC: H01L23/12 ,  H01L21/48 ,  H01L23/08 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H05K1/14

    Abstract: Multilayered Glass-Ceramic Substrate For Mounting Of Semiconductor Device A method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multilayered glass-ceramic superstructure with a multilayered distribution of-conductors on a preformed multilayered glass-ceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass-ceramic prior to further additions of conductor patterns and crystallizable glass layers to form a monolithic compatible substrate all through. Semiconductor chips can be electrically connected to exposed conductor patterns at the top surface of the resultant glass-ceramic package. FI9-78-039

    19.
    发明专利
    未知

    公开(公告)号：DE1909724A1

    公开(公告)日：1969-09-04

    申请号：DE1909724

    申请日：1969-02-26

    Applicant: IBM

    Inventor： MARIE HOOGENDOORN HELEN ,  EDWIN LIBERMAN HERBERT ,  NARKEN BERNT ,  SUNNERS BRIAN

    IPC: G11B5/105 ,  G11B5/127 ,  G11B5/133 ,  G11B5/23 ,  G11B5/24

    Abstract: 1,251,699. Making magnetic heads. INTERNATIONAL BUSINESS MACHINES CORP. 25 Feb., 1969 [29 Feb., 1968], No. 9888/69. Headings B3A and B3V. [Also in Divisions C1 and G5] In the mounting of a ferrite head 11 in a ceramic housing 14, the head 11 is positioned by clamping jaws 15 in a slot 13 in the housing and the slot filled with a first mass of molten glass, as by melting glass disc 16, to bonding the glass to head 11 and housing 14, creating a gap 18 between the head 11 and the glass 16 as by machining with diamond saw wheels 19, heating a second mass 20 of glass with infra-red radiation 17 to fill the gap 18 without disturbing the bond between the first glass 16 and the housing 14 and to bond the first glass 16 with the head 11. After cooling, the protruding glass 16, 20 and ferrite head 11 are ground and polished so as to be aligned with the ceramic housing 14. Multihead assemblies may be similarly fabricated. Preferably the first mass of glass 16 is also heated by infra-red radiation; the second mass of glass 20 being more infrared absorbent than the first mass. Both may be low temperature glasses with lead oxide in the range 50-80% by weight, Cupric oxide up to 7% by weight is added to improve infra-red absorption, the first glass preferably having 0À05 to 1% and the second 3%. The sealing glasses have coefficients of thermal expansion less than or equal to the coefficients of the head 11 and housing 14, which may be similar or with the ceramic having the greater coefficient. Two glasses suitable for the first mass of glass 16 and a third for both glasses with varying cupric oxide additions are given, in percentages by weight:-

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