公开(公告)号：DE112011103570B4

公开(公告)日：2022-12-22

申请号：DE112011103570

申请日：2011-10-27

Applicant: IBM

Inventor： IYENGAR MADHUSUDAN ,  SCHMIDT ROGER

IPC: H05K7/20 ,  G06F1/20

Abstract: Rechenzentrum (100), das aufweist:eine Mehrzahl von Schränken (102), die so eingerichtet sind, dass sie Computereinheiten aufnehmen; undmindestens zwei Kühlmittelzuleitungen (104), von denen die Mehrzahl von Schränken (102) mit Kühlmittel versorgt werden;wobei die Mehrzahl von Schränken (102) derart in mindestens einer Reihe (105) benachbarter Schränke (102) angeordnet ist, dass jede Reihe (105) benachbarter Schränke (102) von sich abwechselnden Kühlmittelzuleitungen (104) mit Kühlmittel versorgt wird,wobei die Mehrzahl von Schränken (102) von den sich abwechselnden Kühlmittelzuleitungen (104) in einem Schachbrettmuster mit Kühlmittel versorgt wird, undwobei keine benachbarten Schränke (102) von der Mehrzahl von Schränken (102) mit derselben Kühlmittelzuleitung (104) verbunden sind und zueinander diagonale Schränke (102) mit derselben Kühlmittelzuleitung (104) verbunden sind.

公开(公告)号：AT408981T

公开(公告)日：2008-10-15

申请号：AT03811737

申请日：2003-10-10

Applicant: IBM

Inventor： CHU RICHARD ,  ELLSWORTH MICHAEL ,  FUREY EDWARD ,  SCHMIDT ROGER ,  SIMONS ROBERT

IPC: H05K7/20

Abstract: An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow. The enclosure also may be provided with automatically opening vent panels to allow room air to circulate and cool in the event of an over-temperature condition. The design of the enclosure permits it to be constructed apart from the rack-mounted apparatus and subsequently attached to the rack, if desired, at the facility at which the rack had been previously operating.

公开(公告)号：AT391406T

公开(公告)日：2008-04-15

申请号：AT05817223

申请日：2005-12-07

Applicant: IBM

Inventor： CAMPBELL LEVI ,  CHU RICHARD ,  ELLSWORTH MICHAEL ,  IYENGAR MADHUSUDAN ,  SCHMIDT ROGER ,  SIMONS ROBERT

IPC: H05K7/20 ,  F25D23/12 ,  H01L23/473

Abstract: A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop passes facility coolant through the first heat exchanger, and the second cooling loop provides system coolant to an electronics subsystem, and expels heat in the first heat exchanger from the subsystem to the facility coolant. The thermal dissipation unit is associated with the electronics subsystem and includes a second heat exchanger, the second cooling loop, and a third cooling loop. The second cooling loop provides system coolant to the second heat exchanger, and the third cooling loop circulates conditioned coolant within the electronics subsystem and expels heat in the second heat exchanger from the electronics subsystem to the system coolant.

公开(公告)号：GB2496020B

公开(公告)日：2014-07-23

申请号：GB201216684

申请日：2012-09-19

Applicant: IBM

Inventor： SCHMIDT ROGER ,  LYENGAR MADHUSUDAN ,  GRAYBILL DAVID ,  COICO PATRICK ANTHONY ,  KOCHUPARAMBIL JOSE BEJOY ,  CHAINER TIMOTHY JOSEPH ,  STEINKE MARK EDWARD ,  KAMATH VINOD

IPC: H05K7/20

公开(公告)号：DE602005005859T2

公开(公告)日：2009-05-20

申请号：DE602005005859

申请日：2005-12-07

Applicant: IBM

Inventor： CAMPBELL LEVI ,  CHU RICHARD ,  ELLSWORTH MICHAEL ,  IYENGAR MADHUSUDAN ,  SCHMIDT ROGER ,  SIMONS ROBERT

IPC: H05K7/20 ,  F25D23/12 ,  H01L23/473

Abstract: A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop passes facility coolant through the first heat exchanger, and the second cooling loop provides system coolant to an electronics subsystem, and expels heat in the first heat exchanger from the subsystem to the facility coolant. The thermal dissipation unit is associated with the electronics subsystem and includes a second heat exchanger, the second cooling loop, and a third cooling loop. The second cooling loop provides system coolant to the second heat exchanger, and the third cooling loop circulates conditioned coolant within the electronics subsystem and expels heat in the second heat exchanger from the electronics subsystem to the system coolant.