公开(公告)号：MY115355A

公开(公告)日：2003-05-31

申请号：MYPI9501097

申请日：1995-04-26

Applicant: IBM

Inventor： NYE HENRY ATKINSON ,  ROEDER JEFFREY FREDERICK ,  TONG HO-MING ,  TOTTA PAUL ANTHONY

IPC: H01L23/48 ,  B23K1/20 ,  H05K3/34 ,  H01L21/60 ,  H01L23/485

Abstract: AN PROCESS AND A STRUCTURE FOR AN IMPROVED SOLDER TERMINAL IS DISCLOSED. THE IMPROVED SOLDER TERMINAL IS MADE OF A BOTTOM METALLIC ADHESION LAYER (80), A CRCU INTERMEDIATE LAYER (85) ON TOP OF THE ADHESION LAYER, A SOLDER BONDING LAYER (90) ABOVE THE CRCU LAYER AND A SOLDER TOP LAYER (120). THE ADHESION LAYER IS EITHER TIW OR TIN. A PROCESS FOR FABRICATING AN IMPROVED TERMINAL METAL CONSISTS OF DEPOSITING AN ADHESIVE METALLIC LAYER, A LAYER OF CRCU OVER THE ADHESIVE LAYER AND A LAYER OF SOLDER BONDING MATERIAL, OVER WHICH A SOLDER LAYER IS FORMED IN SELECTIVE REGIONS AND THE UNDERLYING LAYERS ARE ETCHED USING SOLDER REGIONS AS A MASK.

公开(公告)号：SG32342A1

公开(公告)日：1996-08-13

申请号：SG1995000346

申请日：1995-04-27

Applicant: IBM

Inventor： NYE HENRY ATKINSON III ,  TONG HO-MING ,  ROEDER JEFFREY FREDERICK ,  TOTTA PAUL ANTHONY

IPC: B23K35/14

公开(公告)号：DE69018806T2

公开(公告)日：1995-11-23

申请号：DE69018806

申请日：1990-12-13

Applicant: IBM

Inventor： MOK LAWRENCE S ,  SCHWALL ROBERT E ,  TONG HO-MING

IPC: H01L23/36 ,  H01L23/14 ,  H01L23/16 ,  H01L23/367 ,  H01L23/42

公开(公告)号：CA2024383C

公开(公告)日：1993-10-12

申请号：CA2024383

申请日：1990-08-31

Applicant: IBM

Inventor： CHANCE DUDLEY A ,  GOLAND DAVID B ,  TONG HO-MING

IPC: H01L23/08 ,  H01L21/48 ,  H01L21/50 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H01L23/28 ,  H01L21/52 ,  H01L21/56

Abstract: HERMETIC PACKAGE FOR AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME A hermetic package for an electronic device is manufactured by providing a green glass ceramic body with a green via to produce a workpiece. The workpiece is sintered at a temperature at or above 500.degree.C, while compressing the workpiece at a pressure at or above 100 pounds per square inch, so as to obtain a hermetic package. The green via comprises a mixture of copper and a glass ceramic material with a sufficient volume of glass to produce a hermetic package, yet with sufficient copper to have a suitable electrical conductivity. The hermetic package thus produced comprises a sintered glass ceramic body having an electrically conductive sintered via which is hermetically bonded to the glass ceramic body and which comprises a mixture of an electrically conductive material and a glass ceramic material. The electrically conductive material forms at most 50 volume percent of the via. The workpiece may be sintered in a sintering fixture having a frame and a compensating insert. The compensating insert and frame bound a sintering chamber for accommodating the workpiece. By providing a frame having a thermal expansion coefficient greater than that of the workpiece, and by providing a compensating insert having a thermal expansion coefficient greater than that of the frame, a close fit can be assured between the workpiece and the sintering fixture over a large range of temperatures.