公开(公告)号：DE19627442A1

公开(公告)日：1998-01-22

申请号：DE19627442

申请日：1996-07-08

Applicant: IBM

Inventor： DRUSCHKE FRANK DR ,  ELSNER GERHARD DR ,  GRESCHNER JOHANN DR ,  STOEHR ROLAND

IPC: G01R1/073 ,  F16B11/00 ,  G01R1/067

Abstract: The adhesive joints (1) are made at the surface (2), or within the guide holes (5) of a board, and are at an arbitrary angle in a stack of boards (3) made of silicon, to fit wires, glass fibres or micro-mechanical components permanently. The upper part, or upper layers, of the boards can have elongated holes (5a) to provide an adhesive reservoir, allowing a high viscosity, thixotropic adhesive to be used. The remainder of the holes (5b) are cylindrical, and of smaller size. Hundreds of closely spaced wire contacts, of 25 to 100 micron diameter, can be glued into the boards as test probes for the buckling beam tests.

公开(公告)号：DE19538792A1

公开(公告)日：1997-04-24

申请号：DE19538792

申请日：1995-10-18

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN DR ,  MEISSNER KLAUS ,  STEINER WERNER ,  STOEHR ROLAND

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement 1 for electrically connecting a test system with the circular contact pads 2 of a device to be tested 3. In order to achieve a low contact resistance the contact probes 4 are orthogonally pressed onto the contact pads 2, and for adjusting height differences in the contact pads 2 caused by an uneven surface of the device to be tested 3 they may bend out laterally into the provided areas 6a, 6b. The contact probes 4 are located in guide grooves 5. The guide grooves 5 as well as the areas 6a, 6b are provided in a plane parallel to the surface of a guide plate 7 and are covered by a protective plate. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in electrical circuit arrays of microelectronic compounds.

公开(公告)号：DE19538792C2

公开(公告)日：2000-08-03

申请号：DE19538792

申请日：1995-10-18

Applicant: IBM

Inventor： BAYER THOMAS ,  GRESCHNER JOHANN ,  MEISSNER KLAUS ,  STEINER WERNER ,  STOEHR ROLAND

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66 ,  H01R11/18

Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.