公开(公告)号：DE10049288A1

公开(公告)日：2002-04-18

申请号：DE10049288

申请日：2000-10-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  WINDERL JOHANN ,  REIS MARTIN

IPC: H01L23/057 ,  H01L23/08 ,  H01L23/31 ,  H01L23/50

公开(公告)号：DE10014304A1

公开(公告)日：2001-10-04

申请号：DE10014304

申请日：2000-03-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  WINDERL JOHANN ,  NEU ACHIM ,  HAUSER CHRISTIAN ,  NEUMAYER MARTIN

IPC: H01L23/31

Abstract: The wire bonding to contact pads (2) in a recess (9) in a semiconductor element (1) is sealed in a two stage filling process in which two separate layers (15,16) are formed. A semiconductor element comprises chip recessed contact pads (2) electrically bonded to neighboring conductor (6) by wiring foil and having a recessed solder connection (17). Each wire bonding is covered with a sealer filler (14), which comprises both first (15) and second (16) layers. An Independent claim also included for a method of production of the above comprising completely covering the wire bonding with the sealant.

公开(公告)号：DE10012882A1

公开(公告)日：2001-09-27

申请号：DE10012882

申请日：2000-03-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WINDERL JOHANN ,  HAUSER CHRISTIAN ,  REISS MARTIN

IPC: H01L21/56 ,  H01L21/60 ,  H01L21/58

Abstract: Process for applying an integrated switching circuit (1) to a support element (6) comprises applying a hardenable compensation layer (5) of pasty consistency either to a lower contact surface of a switching element or on the support element; joining the switching circuit to the support element via the compensation layer; producing an electrical connection between the integrated switching circuit and conducting wires of the support element via electrical lines wound over compensation layer; and hardening the compensation layer with volume enlargement. An Independent claim is also included for a device for applying an integrated switching circuit to a support element. Preferred Features: The electrical lines are fixed between the integrated switching circuit and the support element.

公开(公告)号：DE10110203B4

公开(公告)日：2006-12-14

申请号：DE10110203

申请日：2001-03-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WINDERL JOHANN

IPC: H01L23/50 ,  H01L21/50 ,  H01L21/60 ,  H01L23/498 ,  H01L25/065 ,  H05K1/14 ,  H05K3/36

Abstract: An electronic component with at least two stacked semiconductor chips is described. The chips are respectively mounted on a wiring board. The wiring boards are stacked one on top of the other and interconnected mechanically and electrically by soldered connections. The soldered connections extend through apertures in the wiring boards and over one or more levels of wiring boards stacked one on top of the other, with semiconductor chips mounted on these boards. A method for producing the electronic component is also described.

公开(公告)号：DE10152694A1

公开(公告)日：2003-01-02

申请号：DE10152694

申请日：2001-10-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  WINDERL JOHANN

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/32 ,  H01L23/50 ,  H01L23/28

Abstract: Electronic component comprises a semiconductor chip (4) mounted on a wiring plate (6) and electrically connected to it; and a plastic housing (14) partially surrounding the plate. At least the chip is partially surrounded on all sides by a pressing composition of the plastic housing. An Independent claim is also included for a process for the production of the electronic component.

公开(公告)号：DE10206661A1

公开(公告)日：2002-09-26

申请号：DE10206661

申请日：2002-02-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WINDERL JOHANN ,  NEUMAYER MARTIN

IPC: H01L21/68 ,  H01L23/31 ,  H01L29/06 ,  H01L23/04

Abstract: Electronic component (1) comprises a semiconductor chip (2) having an active upper side (3) and a passive rear side (4) and surrounded by a sawn edge (5). The edge has contours (6) profile-sawn from semiconductor material and surrounded by a plastic composition (8) forming a plastic edge (7). The plastic composition engages in a form-locking manner with the profile-sawn contours. An Independent claim is also included for a process for manufacturing the above electronic component.

公开(公告)号：DE10014304B4

公开(公告)日：2007-08-02

申请号：DE10014304

申请日：2000-03-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  WINDERL JOHANN ,  NEU ACHIM ,  HAUSER CHRISTIAN ,  NEUMAYER MARTIN

IPC: H01L23/31 ,  H01L23/50

Abstract: A semiconductor component includes a semiconductor chip having contact pads on its main face, and a wiring foil, in which are recesses for the contact pads, applied to the main face. The foil has conductor tracks on a side facing away from the main side. The conductor tracks connect the contact pads to solder contacts. The contact pads located in the recess are electrically connected via wire connections to adjacent conductor track ends. Each wire connection is surrounded with a sealing compound of a first and a second layer. A method for manufacturing a semiconductor component includes applying wiring foil to a main side of the chip, producing the wire connection between contact pads and adjacent conductor track ends, applying sealing compound to locations on the recess to completely cover the wire connection with the sealing compound, and only curing the surface of the sealing compound.

公开(公告)号：DE19924212B4

公开(公告)日：2007-03-08

申请号：DE19924212

申请日：1999-05-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MONIKA ,  FERSTL KLEMENS ,  POHL JENS ,  WINDERL JOHANN

IPC: H01L21/60 ,  H01L21/603

Abstract: A method for bonding conductors onto semiconductor components is disclosed, where an opening is provided in an insulation layer on a semiconductor component. At least one conductor extends across the opening, where the conductor is bonded onto the semiconductor component by a bonding tool, which bends the conductor in the region of the opening toward the semiconductor component. Prior to the bonding, the conductor is severed in the region of the opening.

公开(公告)号：DE10106346B4

公开(公告)日：2007-03-01

申请号：DE10106346

申请日：2001-02-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERZ ANDREAS ,  WINDERL JOHANN

IPC: H01L23/36 ,  H01L21/56 ,  H01L23/04 ,  H01L23/31 ,  H01L23/367

公开(公告)号：DE10049288B4

公开(公告)日：2004-07-15

申请号：DE10049288

申请日：2000-10-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  WINDERL JOHANN ,  REIS MARTIN

IPC: H01L23/057 ,  H01L23/08 ,  H01L23/31 ,  H01L23/50