DEVICE, SYSTEM AND METHOD FOR PROVIDING MEMS STRUCTURES OF A SEMICONDUCTOR PACKAGE
    13.
    发明申请
    DEVICE, SYSTEM AND METHOD FOR PROVIDING MEMS STRUCTURES OF A SEMICONDUCTOR PACKAGE 审中-公开
    用于提供半导体封装的MEMS结构的器件,系统和方法

    公开(公告)号:WO2015047257A1

    公开(公告)日:2015-04-02

    申请号:PCT/US2013/061762

    申请日:2013-09-25

    Abstract: Techniques and mechanisms for providing precisely fabricated structures of a semiconductor package. In an embodiment, a build-up carrier of the semiconductor package includes a layer of porous dielectric material. Seed copper and plated copper is disposed on the layer of porous dielectric material. Subsequent etching is performed to remove copper adjacent to the layer of porous dielectric material, forming a gap separating a suspended portion of a MEMS structure from the layer of porous dielectric material. In another embodiment, the semiconductor package includes a copper structure disposed between portions of an insulating layer or portions of a layer of silicon nitride material. The layer of silicon nitride material couples the insulating layer to another insulating layer. One or both of the insulating layers are each protected from desmear processing with a respective release layer structure.

    Abstract translation: 用于提供半导体封装的精确制造结构的技术和机构。 在一个实施例中,半导体封装的积聚载体包括多孔介电材料层。 种子铜和电镀铜设置在多孔电介质材料层上。 进行随后的蚀刻以去除邻近多孔介电材料层的铜,形成将MEMS结构的悬置部分与多孔介电材料层分开的间隙。 在另一个实施例中,半导体封装包括设置在绝缘层的一部分之间或者氮化硅材料层的一部分的铜结构。 氮化硅材料层将绝缘层耦合到另一绝缘层。 每个绝缘层中的一个或两个保护层不受去离子处理的剥离层结构的剥离。

    INTEGRATION OF MILLIMETER WAVE ANTENNAS ON MICROELECTRONIC SUBSTRATES
    14.
    发明申请
    INTEGRATION OF MILLIMETER WAVE ANTENNAS ON MICROELECTRONIC SUBSTRATES 审中-公开
    微电子基板上的微波天线的集成

    公开(公告)号:WO2013147744A1

    公开(公告)日:2013-10-03

    申请号:PCT/US2012/030634

    申请日:2012-03-26

    CPC classification number: H01Q1/2283 H01Q21/0025 H01Q21/0087 Y10T29/49016

    Abstract: A high performance antenna incorporated on a microelectronic substrate by forming low-loss dielectric material structures in the microelectronic substrates and forming the antenna on the low-loss dielectric material structures. The low-loss dielectric material structures may be fabricated by forming a cavity in a build-up layer of the microelectronic substrate and filling the cavity with a low-loss dielectric material.

    Abstract translation: 通过在微电子衬底中形成低损耗介电材料结构并在低损耗介电材料结构上形成天线,将高性能天线结合在微电子衬底上。 低损耗介电材料结构可以通过在微电子衬底的堆积层中形成空腔并用低损耗介电材料填充空腔来制造。

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