ELECTROPLATING SOLUTION FOR ELECTROPLATING LEAD AND LEAD/TIN ALLOYS

    公开(公告)号:CA2296900A1

    公开(公告)日:2000-08-05

    申请号:CA2296900

    申请日:2000-01-25

    Abstract: An electroplating solution for plating bright tin, lead, or tin-lead alloy solder coatings in high speed electroplating applications. The electroplating solution includes an alkane or alkanol sulfonic acid electrolyte, a non-ionic surfactant, a grain refiner and two brightening agents: an aromatic aldehyde and a carboxylic acid. In one embodiment of the electroplating solution, the sulfonic acid electrolyte is methane sulfonic acid, the non-ionic surfactant is octylphenoxy(10)polyethoxy ethanol, the grain refiner is phenolphthalein, the aromatic aldehyde is chlorobenzaldehyde, and the carboxylic acid is methacrylic acid.

    15.
    发明专利
    未知

    公开(公告)号:DE60015686T2

    公开(公告)日:2005-12-01

    申请号:DE60015686

    申请日:2000-09-11

    Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer surface finish (11) comprising, in succession, an amorphous metal underlayer (12) a corrosion-resistent metal middle layer (13) and one or more outer layers of precious metal (14). In an exemplary embodiment the metal substrate comprises copper alloy, the amorphous metal underlayer is Ni-P, the middle layer is nickel and the outer layer is palladium. The resulting structure is particularly useful as an electrical connector.

    16.
    发明专利
    未知

    公开(公告)号:DE60200154T2

    公开(公告)日:2004-11-25

    申请号:DE60200154

    申请日:2002-04-10

    Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer finish (11) comprising a layer (13) of tin or tin alloy and one or more outer metal layers (14). An optional metal underlayer (12) may be disposed between the substrate and the tin (13). In an exemplary embodiment the metal substrate comprises copper alloy coated with a nickel underlayer, a layer of tin and an outer metal layer of palladium. The resulting structure is particularly useful as an electrical connector or lead frame.

    19.
    发明专利
    未知

    公开(公告)号:DE60200154D1

    公开(公告)日:2004-02-05

    申请号:DE60200154

    申请日:2002-04-10

    Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer finish (11) comprising a layer (13) of tin or tin alloy and one or more outer metal layers (14). An optional metal underlayer (12) may be disposed between the substrate and the tin (13). In an exemplary embodiment the metal substrate comprises copper alloy coated with a nickel underlayer, a layer of tin and an outer metal layer of palladium. The resulting structure is particularly useful as an electrical connector or lead frame.

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