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公开(公告)号:DE60006335T2
公开(公告)日:2004-09-09
申请号:DE60006335
申请日:2000-08-14
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , DULLAGHAN CONOR ANTHONY , FAN CHONGLUN , SMITH BRIAN THOMAS
IPC: C25D3/12 , C25D3/56 , C25D3/62 , C25D5/12 , C25D15/00 , C25D15/02 , H01R13/00 , H01R13/03 , H05K3/24
Abstract: An electrical connector comprises connector contacts having a metal base and a surface finish layer over the base, the surface finish layer being a composite of an electroplated precious metal composition and wear resistant particles dispersed therein. In the preferred embodiment, the precious metal layer is a PdCo alloy and the wear resistant particles are sub-micron sized lubricating particles, e.g. polytetrafluoroethylene particles and a flash coat of gold is provided over the composite layer.
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公开(公告)号:CA2336977A1
公开(公告)日:2000-11-16
申请号:CA2336977
申请日:2000-05-03
Applicant: LUCENT TECHNOLOGIES INC
Abstract: The specification describes novel rhodium sulfate complex solutions which ha ve a minimum of metal to metal complexing and are mostly complexed through the sulfate groups. Use of these solutions as electrolytes for plating rhodium results in electroplated layers with improved brightness and reduced stress.
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公开(公告)号:CA2296900A1
公开(公告)日:2000-08-05
申请号:CA2296900
申请日:2000-01-25
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ZHANG YUN , MURSKI KENNETH J , ABYS JOSEPH ANTHONY
Abstract: An electroplating solution for plating bright tin, lead, or tin-lead alloy solder coatings in high speed electroplating applications. The electroplating solution includes an alkane or alkanol sulfonic acid electrolyte, a non-ionic surfactant, a grain refiner and two brightening agents: an aromatic aldehyde and a carboxylic acid. In one embodiment of the electroplating solution, the sulfonic acid electrolyte is methane sulfonic acid, the non-ionic surfactant is octylphenoxy(10)polyethoxy ethanol, the grain refiner is phenolphthalein, the aromatic aldehyde is chlorobenzaldehyde, and the carboxylic acid is methacrylic acid.
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14.
公开(公告)号:MY133609A
公开(公告)日:2007-11-30
申请号:MYPI9702455
申请日:1997-06-03
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , FAN CHONGLUN , KADIJA IGOR VELJKO
Abstract: THE PRESENT INVENTION IS DIRECTED TO A LEAD FRAME IN WHICH THE METAL LEAD FRAME SUBSTRATE IS COPPER, COPPER ALLOY, OR NICKLE ALLOY. THE LEAD FRAME SUBSTRATE IS COATED WITH A CONFORMABLE NICKLE COATING THAT IS CRACK-RESISTANT WHEN THE LEAD FRAME IS BENT TO AN ANGLE OF AT LEAST 82 DEGREES WITH A BEND RADIUS OF ABOUT 150 µM TO ABOUT 300 µM. BENDING THE LEAD FRAME IN THIS MANNER CAUSES SURFACE DEFORMATIONS IN THE LEAD FRAME SUBSTRATE. CRACKS DO NOT APPEAR THROUGH THE THICKNESS OF THE CONFORMABLE NICKLE COATING OF THE PRESENT INVENTION WHEN THE DEPTH OF THE DEFORMATIONS THAT RESULT FROM THIS BENDING DO NOT EXCEED ABOUT 5 µM.
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公开(公告)号:DE60015686T2
公开(公告)日:2005-12-01
申请号:DE60015686
申请日:2000-09-11
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , FAN CHONGLUN
IPC: C25D5/12 , B32B15/01 , C23C18/08 , C25D5/10 , C25D7/00 , H01L23/495 , H01L23/50 , H01R13/03 , B29C70/00 , G11B23/00
Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer surface finish (11) comprising, in succession, an amorphous metal underlayer (12) a corrosion-resistent metal middle layer (13) and one or more outer layers of precious metal (14). In an exemplary embodiment the metal substrate comprises copper alloy, the amorphous metal underlayer is Ni-P, the middle layer is nickel and the outer layer is palladium. The resulting structure is particularly useful as an electrical connector.
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公开(公告)号:DE60200154T2
公开(公告)日:2004-11-25
申请号:DE60200154
申请日:2002-04-10
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , FAN CHONGLUN , XU CHEN , ZHANG YUN
Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer finish (11) comprising a layer (13) of tin or tin alloy and one or more outer metal layers (14). An optional metal underlayer (12) may be disposed between the substrate and the tin (13). In an exemplary embodiment the metal substrate comprises copper alloy coated with a nickel underlayer, a layer of tin and an outer metal layer of palladium. The resulting structure is particularly useful as an electrical connector or lead frame.
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17.
公开(公告)号:SG55327A1
公开(公告)日:1998-12-21
申请号:SG1997001931
申请日:1997-06-05
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , FAN CHONGLUN , KADIJA IGOR VELJKO
Abstract: The present invention is directed to a lead frame in which the metal lead frame substrate is copper, copper alloy, or nickel alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least 82 degrees with a bend radius of about 150 mu m to about 300 mu m. Bending the lead frame in this manner causes surface deformations in the lead frame substrate. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 mu m.
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公开(公告)号:DE60003363T2
公开(公告)日:2004-04-29
申请号:DE60003363
申请日:2000-04-25
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , MAISANO JOSEPH JOHN
Abstract: A process for producing sodium gold sulfite in solution is described. The sodium gold sulfite solution is useful in gold electroplating baths, and can be used in applications which require pure, soft gold deposits. A process is also described whereby the sodium gold sulfite solution can be solidified by a freeze-drying process.
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公开(公告)号:DE60200154D1
公开(公告)日:2004-02-05
申请号:DE60200154
申请日:2002-04-10
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , FAN CHONGLUN , XU CHEN , ZHANG YUN
Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer finish (11) comprising a layer (13) of tin or tin alloy and one or more outer metal layers (14). An optional metal underlayer (12) may be disposed between the substrate and the tin (13). In an exemplary embodiment the metal substrate comprises copper alloy coated with a nickel underlayer, a layer of tin and an outer metal layer of palladium. The resulting structure is particularly useful as an electrical connector or lead frame.
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公开(公告)号:DE60003363D1
公开(公告)日:2003-07-24
申请号:DE60003363
申请日:2000-04-25
Applicant: LUCENT TECHNOLOGIES INC
Inventor: ABYS JOSEPH ANTHONY , MAISANO JOSEPH JOHN
Abstract: A process for producing sodium gold sulfite in solution is described. The sodium gold sulfite solution is useful in gold electroplating baths, and can be used in applications which require pure, soft gold deposits. A process is also described whereby the sodium gold sulfite solution can be solidified by a freeze-drying process.
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