公开(公告)号：CA2029090C

公开(公告)日：1998-04-14

申请号：CA2029090

申请日：1990-10-31

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42 ,  C23C18/30

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, and an electroless metal depositing apparatus for carrying out the process.

公开(公告)号：ES2057445T3

公开(公告)日：1994-10-16

申请号：ES90313187

申请日：1990-12-05

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, (14) and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, (12) and an electroless metal depositing apparatus for carrying out the process.

公开(公告)号：DE69009978D1

公开(公告)日：1994-07-21

申请号：DE69009978

申请日：1990-12-05

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, (14) and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, (12) and an electroless metal depositing apparatus for carrying out the process.

公开(公告)号：CA2009131A1

公开(公告)日：1990-11-10

申请号：CA2009131

申请日：1990-02-01

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  RETALLICK RICHARD C

IPC: C23C18/38 ,  C23C18/31 ,  C23C18/40 ,  C25D3/38 ,  C23C18/54

Abstract: Non-adherent copper metal particles ("fines") formed in a plating bath during the course of autocatalytic electroless copper deposition onto activated substrate surfaces are oxidized and redissolved in the bath by brief application of current between an anode element and a cathode element immersed in the bath, the anode element being comprised of an anode surface substantially parallel and proximate to the bottom surface of the vessel containing the bath.

公开(公告)号：AU7641287A

公开(公告)日：1988-01-12

申请号：AU7641287

申请日：1987-06-17

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  COBB CHARLES T ,  LETIZE RAYMOND A ,  WILLIAMS ANN S ,  MONTFORT ANNE ,  SLOMINSKI LEO J

IPC: H05K3/28 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/34 ,  H05K3/38 ,  H05K3/42 ,  H01L21/306

公开(公告)号：CA1177773A

公开(公告)日：1984-11-13

申请号：CA383621

申请日：1981-08-11

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E

IPC: H05K3/42 ,  C23C18/40 ,  C23C18/52 ,  C25D3/38 ,  C25D5/00 ,  C25D5/54 ,  H05K3/18 ,  H05K3/24

Abstract: A method of continuously depositing a metallic plating to any desired thickness on the surface of a workpiece from a non-autocatalytic electroless plating bath that is normally inherently self-limiting as to the thickness of metal which can be deposited by electrolessly plating, the novel method comprising applying an electric potential on the workpiece in the electroless bath. The method provides non-autocatalytic baths, such as hypophosphite-reduced electroless copper baths, with the ability to plate on nonconductors to a thickness which increases with time at a rate dependent on the amount of current applied. A more uniform thickness of deposit over the workpiece being plated and greater deposit penetration into blind holes, deep recesses and tubular portions of complex-shaped parts are obtainable by the method.

公开(公告)号：AU535517B2

公开(公告)日：1984-03-29

申请号：AU5227779

申请日：1979-10-29

Applicant: MACDERMID INC

Inventor： BASKER RACHEL ,  KUKANSKIS PETER E ,  GRUNWALD JOHN J

IPC: C23C18/40 ,  C23C18/48 ,  C23C3/02

公开(公告)号：DE3887989D1

公开(公告)日：1994-03-31

申请号：DE3887989

申请日：1988-12-09

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  D AMBRISI JOSEPH J ,  KUZMIK JOHN J

IPC: C11D7/60 ,  C23C18/20 ,  C23C18/22 ,  C23C18/28 ,  H05K3/00 ,  H05K3/26 ,  H05K3/42 ,  H05K3/46 ,  C23C18/26 ,  C23C18/30 ,  C23C30/00

公开(公告)号：AT73179T

公开(公告)日：1992-03-15

申请号：AT87906858

申请日：1987-07-31

Applicant: MACDERMID INC

Inventor： BACH WOLF ,  FERRIER DONALD R ,  KUKANSKIS PETER E ,  WILLIAMS ANN S ,  SENECHAL MARY JANE

IPC: H05K3/18 ,  C23C18/16 ,  C23C18/18 ,  C23C18/20 ,  C23C18/26 ,  C23C18/28 ,  C23C18/31 ,  C23C18/38 ,  C23C18/40 ,  C23C18/54 ,  H05K3/38 ,  H05K3/42

公开(公告)号：AU601512B2

公开(公告)日：1990-09-13

申请号：AU8102387

申请日：1987-07-31

Applicant: MACDERMID INC

Inventor： BACH WOLF ,  FERRIER DONALD R ,  KUKANSKIS PETER E ,  WILLIAMS ANN S ,  SENECHAL MARY JANE

IPC: H05K3/18 ,  C23C18/16 ,  C23C18/18 ,  C23C18/20 ,  C23C18/26 ,  C23C18/28 ,  C23C18/31 ,  C23C18/38 ,  C23C18/40 ,  C23C18/54 ,  H05K3/38 ,  H05K3/42