公开(公告)号：EP2342372A4

公开(公告)日：2013-01-23

申请号：EP09818156

申请日：2009-07-17

Applicant: MACDERMID INC

Inventor： LONG ERNEST ,  TOSCANO LENORA M ,  MCKIRRYHER COLLEEN ,  ROMAINE PAUL ,  KOLOGE DONNA ,  CASTALDI STEVEN A ,  STEINECKER CARL P

IPC: C25D5/54 ,  C23C18/16 ,  C23C18/42 ,  H05K3/24 ,  H05K3/28

CPC classification number: H05K3/282 ,  B23K35/3006 ,  B23K35/3612 ,  C23C18/1204 ,  C23C18/1601 ,  C23C18/1689 ,  C23C18/1824 ,  C23C18/42 ,  C23C18/54 ,  H05K3/244

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted silane compound. Preferred post treatments comprise 3-mercapto propyl trimethoxysilane and/or 3-oxtanoylthio-1-propyltriethoxy silane.

公开(公告)号：EP1766106A4

公开(公告)日：2007-09-05

申请号：EP05725574

申请日：2005-03-15

Applicant: MACDERMID INC

Inventor： HERDMAN RODERICK D ,  PEARSON TREVOR ,  LONG ERNEST ,  GARDNER ALAN

IPC: C25D7/04 ,  C25D3/38 ,  C25D5/18

CPC classification number: C25D5/18 ,  C25D3/38

Abstract: Pulse reverse electrolysis of acid copper solutions is used for applying copper to printing cylinders, especially gravure printing cylinders. The plating composition generally comprising copper ions, counter ions, chloride ions, a polyalkylene glycol, and a bath-soluble divalent sulfur compound. The benefits include an improved thickness distribution of the copper electrodeposited on the plated article, reduced metal waste, reduced plating times and increased production capacity.

Abstract translation: 酸性铜溶液的脉冲反向电解用于将铜应用于印刷滚筒，尤其是凹版印刷滚筒。 电镀组合物通常包含铜离子，抗衡离子，氯离子，聚亚烷基二醇和可溶于水的二价硫化合物。 其优点包括电镀制品上电沉积的铜的厚度分布改善，金属废物减少，电镀时间缩短以及生产能力增加。