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    POLYIMIDE
    11.
    发明专利
    POLYIMIDE 失效

    公开(公告)号：JPH07300526A

    公开(公告)日：1995-11-14

    申请号：JP31049094

    申请日：1994-12-14

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMASHITA WATARU ,  OKAWA YUICHI ,  TAMAI MASAJI ,  MATSUO MITSUKI ,  ISHIDA TSUTOMU ,  YAMAGUCHI KEISABURO ,  YAMAGUCHI TERUHIRO

    IPC: C07C221/00 ,  C07C225/22 ,  C07C319/20 ,  C07C323/31 ,  C08G73/10 ,  C08J5/06 ,  C08J5/08 ,  C08J5/18

    Abstract: PURPOSE:To obtain an amorphous polyimide not only excellent in heat resistance but also having a good moldability by reacting a specific arom. diamine with a tetracarboxylic dianhydride and imidizing the resulting polyamic acid. CONSTITUTION:An arom. diamine of formula I (wherein X is a direct bond, 0, or S; and R1, R2, R3, and R4 each is or CH3) is reacted with a tetrcarboxylic dianhydride component mainly comprising a dianhydride of formula II (wherein Ar is a tetravalent noncondensed polycyclic arom. group formed by linking 6-27C monocyclic arom. groups to each other directly or through linking members) to give a polyamic acid, which is imidized thermally or chemically to give an amorphous polyimide having, as the essential structural units, at least one kind of repeating structural units of formula III (wherein R1, R2, R3, R4, and Ar each is the same as described above). Thus obtd. polyimide has an excellent melt flow stability and a greatly improved moldability in addition to the high heat resistance inherent in a polyimide.

    POLYIMIDE RESIN EXCELLENT IN FATIGUE CHARACTERISTIC, ITS COMPOSITION AND INJECTION-MOLDED PRODUCT
    12.
    发明专利
    POLYIMIDE RESIN EXCELLENT IN FATIGUE CHARACTERISTIC, ITS COMPOSITION AND INJECTION-MOLDED PRODUCT 失效

    公开(公告)号：JPH07247357A

    公开(公告)日：1995-09-26

    申请号：JP4207394

    申请日：1994-03-14

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI MASAJI ,  OKAWA YUICHI ,  YAMASHITA WATARU ,  SAKATA YOSHIHIRO ,  YAMAGUCHI TERUHIRO

    IPC: B29C45/00 ,  B29K79/00 ,  C08G73/06 ,  C08G73/10 ,  C08K7/06 ,  C08L79/08

    Abstract: PURPOSE:To obtain a polyimide resin composition markedly excellent in fatigue characteristics by reacting a specified amine compound with a specified tetracarboxylic acid dianhydride optionally in the presence of a specified com pound. CONSTITUTION:An amino compound component comprising 1 mol of a diamine compound of formula I (wherein X is a direct bond, -SO2-, >C=O, -S- or the like) and 0.005-0.11mol in total of a tetraamino compound of formula II (wherein R1 is a group of formula III or IV or a like group) and a triamino compound of formula V (wherein R2 is a group of formula VI or VII or a like group) is reacted with a tetracarboxylic acid dianhydride component of formula VIII (wherein R2 is a group of formula IX or a like group) in the presence or absence of a dicarboxylic acid anhydride or a monoamino compound to obtain a melt-moldable polyimide resin excellent in fatigue characteristics. A polyimide resin composition comprising this resin and carbon fibers can give an injection-molded product excellent in fatigue resistance.

    HEAT-RESISTANT ADHESIVE
    13.
    发明专利
    HEAT-RESISTANT ADHESIVE 失效

    公开(公告)号：JPH0741752A

    公开(公告)日：1995-02-10

    申请号：JP1099994

    申请日：1994-02-02

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI MASAJI ,  KAWASHIMA SABURO ,  SONOBE YOSHIO ,  OTA MASAHIRO ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10 ,  C09J179/08

    Abstract: PURPOSE:To obtain a heat-resistant adhesive which does not deteriorate in heat resistance and adhesiveness even when used at high temperatures by forming it from a specified polymer. CONSTITUTION:The adhesive is formed from a polymer terminated with a group of formula VI (wherein R' is the below-mentioned R or the like) or a group of formula VII and comprising repeating units of formula I [wherein Y1 is a bivalent group of formula II (wherein R is a tetravalent group of formula III or the like)] and repeating unit of formula IV (wherein Y2 is a group of formula V).

    NEW POLYIMIDE AND ITS PRODUCTION
    18.
    发明专利
    NEW POLYIMIDE AND ITS PRODUCTION 失效

    公开(公告)号：JPH05186591A

    公开(公告)日：1993-07-27

    申请号：JP22393091

    申请日：1991-09-04

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI MASAJI ,  KAWASHIMA SABURO ,  OIKAWA HIDEAKI ,  KATAOKA TOSHIYUKI ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10 ,  C08L79/08

    Abstract: PURPOSE:To improve moldability by imidizing a polyamic acid prepd. by reacting a specific diamine component with a tetracarboxylic acid dianhydride. CONSTITUTION:1mol of a diamine component mainly comprising an arom. diamine of formula I (wherein X is a divalent group of formula II or III) is reacted with 0.001-1.0mol of a tetracarboxylic acid dianhydride of formula IV (wherein R is a tetravalent group selected from the group consisting of noncondensed polycyclic arom. groups formed by linking a 2-27C aliph. group, a cycloaliph. group, a monocyclic aliph. group, a condensed polycyclic arom. group, and an arom. group to each other directly or through a linking member) at 250 deg.C or lower for 4-24hr to give a polyamic acid, which is imidized by heating to 100-400 deg.C to give a polyimide having repeating structural units of formula V.

    LOWLY DIELECTRIC POLYIMIDE AND ITS PRODUCTION
    19.
    发明专利
    LOWLY DIELECTRIC POLYIMIDE AND ITS PRODUCTION 失效

    公开(公告)号：JPH0598002A

    公开(公告)日：1993-04-20

    申请号：JP26007791

    申请日：1991-10-08

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMASHITA WATARU ,  OIKAWA HIDEAKI ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10

    Abstract: PURPOSE:To obtain a polyimide having excellent properties, low dielectric properties and good moldability by imidating a polyamic acid which is a reaction product of an aromatic diamine compound with a tetracarboxylic acid dianhydride. CONSTITUTION:An aromatic diamine compound of the formula H2N-X-NH2 is reacted with a tetracarboxylic acid dianhydride mainly represented by formula I in an organic solvent. The obtained polyamic acid is thermally or chemically imidated to obtain the purpose polyimide. This is a lowly dielectric polyimide comprising structural units of formula II (wherein X is a bivalent group selected between a 12-27 C condensed polycyclic aromatic group containing at least one ether or thioether bond and a noncondensed polycyclic aromatic group composed of aromatic groups bonded together directly or through bridging members; R is a tetravalent group selected from among a 2-27 C aliphatic group, a cycloaliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, etc.).

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