12.
    发明专利
    未知

    公开(公告)号:DE69221956D1

    公开(公告)日:1997-10-09

    申请号:DE69221956

    申请日:1992-06-09

    Abstract: Amorphous polyimide powder which has recurring structural units of the formula ( I ): as a fundamental skeleton, is blocked at the polymer chain end with dicarboxylic anhydride represented by the formula ( II ) wherein Z is a divalent radical having from 6 to 27 carbon atoms and selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected each other with a direct bond or a bridge member, and essentially has no reactive radical at the polymer chain end, preparation process of the amorphous polyimide powder, heat-resistant adhesive comprising the polyimide, and bonding method using the adhesive, are disclosed.

    13.
    发明专利
    未知

    公开(公告)号:DE69312549D1

    公开(公告)日:1997-09-04

    申请号:DE69312549

    申请日:1993-04-07

    Abstract: This invention relates to fluorine containing polyimide, a novel aromatic diamine which has a perfluoroalkyl radical and can be used as a raw material monomer of the polyimide, and a process for preparing the same. The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: such as the structural units of the formula Further, the present invention relates to a novel aromatic diamine which has a perfluoro radical and can be used as a raw material monomer of the polyimide, and a process for preparing the same. The present invention can provide polyimide which has an extremely low dielectric constant and is colorless, transparent and excellent in processability and heat resistance, and also provides an aromatic diamine which is useful as a raw material monomer of the polyimide or a raw material of other various engineering plastics.

    POLYIMIDE RESIN COMPOSITION
    15.
    发明专利

    公开(公告)号:JPH0987516A

    公开(公告)日:1997-03-31

    申请号:JP34007895

    申请日:1995-12-27

    Abstract: PROBLEM TO BE SOLVED: To provide a polyimide resin compsn. which has a high rate of crystallization by comprising a polyimide having a repeating unit represented by a particular formula and a crystallization accelerator of a bismaleimide compd., an imide oligomer, or a bismaleimide mixture. SOLUTION: 4,4'-Bis(3-aminophenoxy)biphenyl is reacted with pyromellitic acid dianhydride to prepare a crystalline polyimide comprising a repeating unit represented by formula I. A crystalline polyimide in an amt. of 100 pts.wt. (hereinafter referred to as 'pts.') is mixed with at least one crystallization accelerator, in an amt. of l to 50 pts.wt., selected from among a bisimide compd. and the like represented by formula II (wherein X represents formula III; and Y1 represents formula IV), an imide oligomer represented by formula V (wherein (n) is 1 to 3), and a mixture of bisimide compds. represented by formulae VI and VII (wherein Z2 represents H, CH3 , C2 H5 or the like). This mixture is melt- kneaded by means of a melt mixer or the like at about 390 to 420 deg.C to prepare a polyimide resin compsn. for molding which can markedly shorten the cooling time for melt molding.

    POLYIMIDE RESIN COMPOSITION
    16.
    发明专利

    公开(公告)号:JPH07179757A

    公开(公告)日:1995-07-18

    申请号:JP17718294

    申请日:1994-07-28

    Abstract: PURPOSE:To obtain a polyimide resin composition containing, e.g. a polyimide having a specified structure and a polyether pyridine having a specified structure and excellent in melt molding properties, heat resistance, chemical resistance, mechanical strength and cumulative fatigue properties. CONSTITUTION:This resin composition contains (A) 99.9 to 50 pts.wt. polyimide having a repeating a structural unit of formula I (X is direct bond, isopropylidene, thio, etc.; R is a 2 to 27C aliphatic, an alicyclic, a condensed aromatic polycycle, etc.) and (B) 0.1 to 50 pts.wt. polyimide having a structural unit of formula II (R1 is a tetravalent group of formula III or IV), a polyimide having a structural unit of formula V and/or a polyether pyridine having a repeating structural unit of formula VI (Y is a bivalent group such as p-phenyl, biphenyl, etc.).

    POLYIMIDE HAVING EXCELLENT THERMAL-OXIDATIVE STABILITY AND ITS PRODUCTION

    公开(公告)号:JPH07165913A

    公开(公告)日:1995-06-27

    申请号:JP31779793

    申请日:1993-12-17

    Abstract: PURPOSE:To obtain the polyimide useful for electric.electronic devices, devices for space navigation, having a specific iron content by reacting a diamine compound with a tetracarboxylic aid anhydride. CONSTITUTION:This polyimide is obtained by heating and melting (A) a diamine compound of formula I (R1 is one or more bifunctional groups selected from a 2-45C aliphatic group, cyclocaliphatic, monocyclic bifunctional group) (e.g. ethylenediamine, 1,4-diaminobutane, 1,4-diaminocyclohexane or m- phenylenediamine) and (B) a tetracarboxylic acid dianhydride of formula II (R2 is a 4-27C aliphatic, cycloaliphatic or monocyclic aliphatic tetrafunctional group) (e.g. butanetetracarboxylic acid dianhydride or cyclopentanetetracarboxylic acid dianhydride) preferably in the presence of an organic solvent. The resultant polyimide has

    CRYSTALLIZATION ACCELERATOR AND ITS PRODUCTION

    公开(公告)号:JPH0931327A

    公开(公告)日:1997-02-04

    申请号:JP18154095

    申请日:1995-07-18

    Abstract: PROBLEM TO BE SOLVED: To obtain a crystallization accelerator which accelerates the crystallization of a crystalline polyimide by thermally or chemically imidating 4,4'-(4- aminophenoxy)biphenyl with phthalic anhydride. SOLUTION: A compound, 4,4'-(4-Aminophenoxy)biphenyl represented by formula I is thermally or chemically imidated with phthalic anhydride represented by formula II to obtain a bisimide represented by formula III. Although a crystallization accelerator comprising this bisimide is applicable to any crystalline polyimides, it is effective as a crystallization accelerator for especially a crystalline polyimide represented by formula IV. This accelerator can markedly accelerate the crystallization of a crystalline polyimide without detriment to its properties. When the accelerator is added to a crystalline polyimide and the obtained mixture is molten and injection-molded, the polyamide can crystallize in the mold during cooling.

    HEAT-RESISTANT ADHESIVE
    19.
    发明专利

    公开(公告)号:JPH08259924A

    公开(公告)日:1996-10-08

    申请号:JP6412195

    申请日:1995-03-23

    Abstract: PURPOSE: To obtain an adhesive which is highly heat resistant, enables bonding at a low temperature and low pressure, and also gives good bonding strength, by using a polyimide produced by a specified process and its precursor comprising a polyamic acid. CONSTITUTION: A heat-resistant adhesive comprising a polyimide obtained by reacting a diamine compound containing 0.10-0.005 mol of diaminosiloxane represented by formula II (wherein n is 0 to 7) for 1mol of an aromatic diamine represented by formula I [wherein X1 and X2 are each a direct bond O, S, CO, CH, C(CH2 )2 , C(CF3 )2 or SO2 ; and R1-4 , R'1-4 and R"1-4 are each H, halogen 1-3C alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, phenyl, biphenyl, phenoxy, biphenoxy or nitrile] with an aromatic tetracarboxylic acid dianhydride represented by formula III (wherein Ar is a group selected from those of formula IV). A heat-resistant adhesive solution containing a polyamic acid, the precursor of the polyimide.

    POLYIMIDE RESIN COMPOSITION
    20.
    发明专利

    公开(公告)号:JPH0853620A

    公开(公告)日:1996-02-27

    申请号:JP17780394

    申请日:1994-07-29

    Abstract: PURPOSE:To obtain a polyimide resin composition excellent in mechanical properties, capable of retaining high mechanical properties even under high- temperature and high-humidity conditions and reduced in hygroscopicity and water absorption by mixing a polyimide of a specified composition with a fibrous reinforcement. CONSTITUTION:This composition is obtained by mixing a fibrous reinforcement (e.g. glass fiber) with a polyimide essentially consisting of at least one kind of repeating units each represented by formula I (wherein m and n are each 0 or 1; R is a group of any one of formulas II to V; R1 to R4 are each H, halogen, 1-8 C alkyl, aryl, alkenyl, aralkyl or 1-5 C alkoxy; R,5 to R7 are each H, 1-8C alkyl, aryl, alkenyl, aralkyl or the like; and Ar is a tetravalent group selected from among a 6-27C monocyclic aromatic group, a fused polycyclic aromatic group or a nonfused polycyclic aromatic group consisting of aromatic groups bonded with each other directly or through bridging members).

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