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    VIBRATION SENSOR AND METHOD FOR MANUFACTURING THE VIBRATION SENSOR
    12.
    发明公开
    VIBRATION SENSOR AND METHOD FOR MANUFACTURING THE VIBRATION SENSOR 有权
    振动传感器及其制造方法振动传感器

    公开(公告)号：EP2073272A4

    公开(公告)日：2013-08-14

    申请号：EP07791105

    申请日：2007-07-20

    Applicant: OMRON TATEISI ELECTRONICS CO

    Inventor： KASAI TAKASHI ,  HORIMOTO YASUHIRO ,  KATO FUMIHITO ,  MUNECHIKA MASAKI ,  WAKABAYASHI SHUICHI ,  TAKAHASHI TOSHIYUKI ,  INUGA MASAYUKI

    IPC: B81C1/00 ,  H04R19/04

    CPC classification number: B81C1/00182 ,  B81B2201/0257 ,  B81B2201/0285 ,  B81B2203/0127 ,  B81B2203/0353 ,  H04R19/005 ,  H04R19/04

    Abstract: A protective film (20) of an SiO2 thin film is formed on a front surface of an Si substrate (12), and a part of the protective film (20) is removed to form an etching window (22). A sacrifice layer (23) of polycrystalline Si is formed in the etching window (22). A protective film (24) of SiO2 is formed on the front surface of the Si substrate (12) from the top of the sacrifice layer (23), and a thin film (13) as an element formed of polycrystalline Si is further formed on the protective film (24). A backside etching window (26) is opened in a protective film (21) on the back side of the Si substrate (12). The Si substrate (12) is soaked in TMAH to perform crystal anisotropic etching in the Si substrate (12) through the backside etching window (26) to provide a through-hole (14) in the Si substrate (12).; When the sacrifice layer (23) is exposed to the interior of the through-hole (14), the sacrifice layer (23) is etching-removed to provide a gap (19) between the protective film (24) and the Si substrate (12) and crystal anisotropic etching of the Si substrate (12) is carried out from its front side and backside.

    ACOUSTIC SENSOR AND MICROPHONE
    14.
    发明公开
    ACOUSTIC SENSOR AND MICROPHONE 有权
    声学传感器和麦克风

    公开(公告)号：EP2519030A4

    公开(公告)日：2013-05-08

    申请号：EP11770990

    申请日：2011-03-16

    Applicant: OMRON TATEISI ELECTRONICS CO

    Inventor： KASAI TAKASHI

    IPC: H04R19/04 ,  H04R19/00

    CPC classification number: H04R19/005 ,  H01L2224/48137 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R7/06 ,  H04R19/04 ,  H04R2410/03

    Abstract: Provided is an acoustic sensor capable of improving an S/N ratio of a sensor without preventing reduction in size of the sensor. A back chamber 45 is vertically opened in a silicon substrate 42. A thin film-like diaphragm 43 to serve as a movable electrode plate is formed on the top surface of the substrate 42 so as to cover the back chamber 45. The back plate 48 is fixed to the top surface of the substrate 42 so as to cover the diaphragm 43, and a fixed electrode plate 49 is provided on the under surface of the back plate 48. Further, the diaphragm 43 is divided into a plurality of areas by the slit 47, and the respective plurally divided diaphragms 43a, 43b and the fixed electrode plate 49 constitute a plurality of parallelly connected capacitors (acoustic sensing sections 60a, 60b).

    CONNECTED SENSOR SYSTEM
    19.
    发明专利
    CONNECTED SENSOR SYSTEM 失效

    公开(公告)号：JP2002333936A

    公开(公告)日：2002-11-22

    申请号：JP2001139374

    申请日：2001-05-09

    Applicant: OMRON TATEISI ELECTRONICS CO

    Inventor： KOJIMA TOSHIYUKI ,  KASAI TAKASHI

    IPC: G06F3/00 ,  H04B10/11 ,  H04B10/80 ,  H04B10/10 ,  H04B10/105 ,  H04B10/22

    Abstract: PROBLEM TO BE SOLVED: To provide a connected sensor system capable of properly operating communication with a node (for example, a host personal computer, a PLC, and the other sensors) on a mobile console or a network. SOLUTION: This system is provided with a plurality of sensor units arranged so as to be made closely adjacent to each other, and connected through a connector means so that a signal can be transmitted to each other, and constituted so that data can be transferred in two ways in a bucket relay system, a network communicating with a node such as a host personal computer or a programmable controller, a mobile console unit for transferring data with the sensor units in two ways, and a bus unit interposed among one of those sensor units, the network, and the mobile console for performing a communication arbitrating function.

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