公开(公告)号：WO2004040661A3

公开(公告)日：2004-09-10

申请号：PCT/DE0303493

申请日：2003-10-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BRAUNE BERT ,  BRUNNER HERBERT

Inventor： BRAUNE BERT ,  BRUNNER HERBERT

IPC: H01L33/38 ,  H01L33/50 ,  H01L33/00

CPC classification number: H01L33/505 ,  H01L33/38 ,  H01L2224/11 ,  H01L2933/0016 ,  H01L2933/0041

Abstract: The invention relates to a method for producing a light source provided with electroluminescent diodes, in particular mixed colour diodes. The inventive method consists in transforming at least one part of primary radiation emitted a chip by means of luminescence conversion. The inventive chip comprises a front electric contact (in terms of a surface oriented towards a radiation emission) and a luminescence conversion material applied thereto in the form of a thin film. Prior to coating, the front electric contact is made higher by the application of a conductive material to the surface thereof. The inventive method makes it possible to adjust in a target manner a defined chromatic localisation controlling said chromatic localisation (IEC chromaticity diagram) and reducing the layer of the luminescence conversion material. Said method is convenient, in particular for simultaneously producing several light sources provided with electrolumeniscent diodes from the plurality of similar chips in a section composite substrate.

Abstract translation: 本发明描述了一种生产特定混合色LED光源的方法，至少从一个芯片初级辐射发射的光的一部分通过在发光装置转换。 这是具有前侧（即，被hingewandt于辐射的侧）的发光转换材料的表面上的电接触被施加为薄层的芯片。 为了这个目的，在涂覆之前的前侧电触点被增加在所述的电接触表面施加导电材料。 该方法允许由色彩映射（IEC色度图）和发光转换材料的层变薄的控制是一个特定的颜色映射的一个特定的调整。 此外，该方法是特别适合用于同时生产的在晶片组件的多个相同的码片的数的发光二极管光源。

公开(公告)号：WO02084749A3

公开(公告)日：2003-03-13

申请号：PCT/DE0201306

申请日：2002-04-09

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BOGNER GEORG ,  BRUNNER HERBERT ,  HIEGLER MICHAEL ,  WAITL GUENTER

Inventor： BOGNER GEORG ,  BRUNNER HERBERT ,  HIEGLER MICHAEL ,  WAITL GUENTER

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a conductor frame (2) and a housing, in addition to a radiation-emitting component formed therewith and a method for the production thereof. The conductor frame has a support part with at least one binding wire connecting area (10) and at least one electric soldered connecting strip (3a,b), in which a separately built thermal connecting part (4) having a chip assembly area (11) is attached. In order to form the housing, the conductor frame (2) is enveloped with a molded material, wherein the thermal connecting part is embedded in such a way that it can be thermally connected from the outside.

Abstract translation: 本发明涉及一种引线框架（2）和一个壳体，和一个这样形成的发射辐射的装置和用于其生产的方法。 在这种情况下，引线框架具有承载部分与至少一个键合线的连接区域（10）和至少一个电Lötanschlussstreifen部（3a，b）转化为其中一个单独制造的热连接部分（4）连接，其包括芯片安装区域（11）。 为了形成所述引线框架的一个壳体（2）优选地覆盖有模制材料，其特征在于，所述热连接器被嵌入，以便它是从外部热连接。

公开(公告)号：WO2006089540A3

公开(公告)日：2006-11-02

申请号：PCT/DE2006000361

申请日：2006-02-28

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BRAUNE BERT ,  BRUNNER HERBERT ,  JAEGER HARALD ,  SORG JOERG

Inventor： BRAUNE BERT ,  BRUNNER HERBERT ,  JAEGER HARALD ,  SORG JOERG

IPC: G02B1/04 ,  B29C45/00 ,  H01L33/54

CPC classification number: C08G59/4215 ,  B29C45/0001 ,  B29C45/02 ,  B29K2083/00 ,  B29K2105/0005 ,  B29L2011/00 ,  C08G59/3245 ,  C08G77/06 ,  C08G77/42 ,  C08G77/455 ,  C08L63/00 ,  C08L83/00 ,  C08L83/04 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/12044 ,  C08L2666/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a method for producing an optical, radiation-emitting component by means of a moulding process and to an optical, radiation-emitting component with a defined viscosity.

Abstract translation: 本发明涉及一种通过模制工艺制造光学和辐射发射部件的方法以及具有确定粘度的光学和辐射发射部件。

公开(公告)号：WO02091478A3

公开(公告)日：2003-02-20

申请号：PCT/DE0201645

申请日：2002-05-07

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BRUNNER HERBERT ,  HARTL ALFRED ,  MARCHL WERNER

Inventor： BRUNNER HERBERT ,  HARTL ALFRED ,  MARCHL WERNER

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10158 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: The invention relates to a housing for a component which emits and/or absorbs a radiation, comprising a housing base body (1) with a recess. An annular body (5) is fixed in the recess, surrounding a mounting surface for an element which emits and/or absorbs a radiation, which is embodied such that an inner surface of the annular aperture serves, at least partly, as a reflector for said radiation. The invention further relates to a component provided with such a housing.

Abstract translation: 本发明描述了一种用于具有壳体基体（1）用的凹部，其中所述凹部为环状体（5）是固定的，发光的安装面用于辐射和/或接收发射辐射的和/或接收设备的壳体 部件包围并且被形成为使得所述环孔的内表面至少部分地用作反射器的辐射。 此外，本发明描述了配备有这样的外壳的装置。

公开(公告)号：WO2008125096A2

公开(公告)日：2008-10-23

申请号：PCT/DE2008000626

申请日：2008-04-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  JAEGER HARALD ,  BRUNNER HERBERT ,  SCHNEIDER ALBERT ,  ZEILER THOMAS

Inventor： JAEGER HARALD ,  BRUNNER HERBERT ,  SCHNEIDER ALBERT ,  ZEILER THOMAS

IPC: B29C45/14 ,  H01L33/52

CPC classification number: B29C45/14655 ,  B29C33/0038 ,  B29C33/10 ,  B29C43/18 ,  B29C2045/14098 ,  B29C2045/14663 ,  B29C2045/14934 ,  B29K2083/00 ,  H01L21/565 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a method for producing an opto-electronic component, comprising the following steps: - Providing a substrate (1) having a first main surface (2) and a second main surface (3) opposite the first main surface (1), - fastening to the first main surface (2) of the substrate (1) a semiconductor body (4) that is suitable for emitting electromagnetic radiation from a front side (5), and - applying a cladding that is permeable to the radiation of the optoelectronic semiconductor body (4), at least over the front side (5) of the semiconductor body (4), the cladding being designed as an optical element (19) using a closed cavity (18) having the contour of the optical element (19). The invention further relates to an optoelectronic component.

Abstract translation: 它公开了一种用于通过以下步骤制造光电子器件的方法包括： - 提供衬底（1），具有第一主面（2）和第二主面（3），相对的第一主表面（1）， - 附接的半导体本体 （4），其适合于从一前侧（5）发射电磁辐射，所述第一主表面（2）上的基板（1），和 - 将鞘，其是可渗透的光电子半导体主体（4）的辐射， 至少在半导体本体（4），其中所述外壳形成为使用具有所述光学元件（19）的轮廓的封闭的腔（18）的光学元件（19）的前侧（5）。 此外，光电子器件进行说明。

公开(公告)号：WO2005031797A2

公开(公告)日：2005-04-07

申请号：PCT/DE2004002138

申请日：2004-09-24

Applicant: PATENT TREUHAND GES FUER ELEKTRISCHE GLUEHLAMPEN MBH ,  OSRAM OPTO SEMICONDUCTORS GMBH ,  BRUNNER HERBERT ,  FIEDLER TIM ,  JERMANN FRANK ,  STRAUSS JOERG ,  ZACHAU MARTIN

Inventor： BRUNNER HERBERT ,  FIEDLER TIM ,  JERMANN FRANK ,  STRAUSS JOERG ,  ZACHAU MARTIN

IPC: C09K11/77 ,  H01L

CPC classification number: C09K11/7734 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: Disclosed is an LED that has a low color temperature of up to 3500 K and comprises a blue-emitting LED as well as two luminous substances which are mounted upstream thereof. A first luminous substance belongs to the class of oxinitridosilicates, contains a cation M which is doped with divalent europium, and is of general formula M(1-c)Si2O2N2:Dc, wherein M = Sr or M = Sr(1-x-y)BayCax with the stipulation x+y

Abstract translation: LED具有低色温至3500 K，由发射LED蓝色和两个前的它的磷光体与类oxynitridosilicates中的第一荧光体，具有掺杂有二价铕的阳离子M和具有经验式M（1 c）中Si2O2N2：DC，其中M = Sr或与X + Y M =锶（1-XY）BayCax使用<0.5，其中，所述oxynitridosilicate完全或主要的高温稳定变HT和第二荧光体的组成 类具有式（钙，锶）2Si5N8 nitridosilicates的：Eu等。

公开(公告)号：WO2004081972A2

公开(公告)日：2004-09-23

申请号：PCT/DE2004000271

申请日：2004-02-13

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BRUNNER HERBERT ,  HOEFER THOMAS ,  KRAEUTER GERTRUD ,  ZEILER MARKUS

Inventor： BRUNNER HERBERT ,  HOEFER THOMAS ,  KRAEUTER GERTRUD

IPC: H01L23/00 ,  H01L23/057 ,  H01L

CPC classification number: H01L23/564 ,  H01L23/057 ,  H01L24/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to a housing body (2) for an electronic component (1), which is manufactured, at least in part, from plastic material, and on or in which at least one first and at least one second electric supply conductor are arranged, between which an electric field (12) exists when the associated electronic component is in operation. According to the invention, the plastic material is mixed with filler particles (6), which prevent or at least highly impede a migration of metal and/or metal ions in the plastic material.

Abstract translation: 在壳体本体（2）的电子部件（1），其至少部分地由塑料材料制成的，并在相关联的电子组件的操作设置在或在所述至少一个第一和至少一个第二电连接导体之间（电场 12）存在时，将塑料材料与填充材料（6），其防止金属和/或金属离子的迁移在塑料材料，或至少妨碍强混合。

公开(公告)号：WO03038912A2

公开(公告)日：2003-05-08

申请号：PCT/DE0204025

申请日：2002-10-28

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BOGNER GEORG ,  BRUNNER HERBERT ,  KRAEUTER GERTRUD ,  WAITL GUENTER

Inventor： BOGNER GEORG ,  BRUNNER HERBERT ,  KRAEUTER GERTRUD ,  WAITL GUENTER

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: The invention concerns an optoelectronic component, in particular an optoelectronic component adapted to be surface-mounted, comprising a housing body (2), an optoelectronic semiconductor chip (3) arranged in particular in a recess (6) of the housing body, and electrical connections (1A, 1B), the semiconductor chip being in electroconductive connection with the electrical connections of the conductor network. The housing body (2) is made of a sheathing material, in particular a plastic material, filled with a filler material having a high degree of reflection in a wavelength range less than about 500 nm.

Abstract translation: 光电子器件，特别是表面安装的光电器件具有一个壳体（2），特别是在凹部（6）的外壳主体设置光电子半导体芯片（3）和具有电端子（1A，1B），其中，半导体芯片与引线框架的电端子 导电连接。 壳体（2）由一包装材料，与具有高反射率的填料的波长区域低于约500nm形成特别是塑料材料制成。

公开(公告)号：WO2014060355A3

公开(公告)日：2014-06-26

申请号：PCT/EP2013071428

申请日：2013-10-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BRANDL MARTIN ,  BOSS MARKUS ,  PINDL MARKUS ,  JEREBIC SIMON ,  BRUNNER HERBERT ,  GEBUHR TOBIAS

IPC: H01L33/00 ,  H01L33/48

CPC classification number: H01L21/563 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A method for producing a multiplicity of optoelectronic semiconductor components is specified, comprising the following steps: - providing an auxiliary carrier (1), - applying a multiplicity of arrangements (20) of electrically conductive first contact elements (21) and second contact elements (22) on the auxiliary carrier (1), - applying an optoelectronic semiconductor chip (3) in each case on the second contact element (22) of each arrangement (20), - electrically conductively connecting the optoelectronic semiconductor chips (3) to the first contact elements (21) of the relevant arrangement (20), - encapsulating the first contact elements (21) and the second contact elements (22) with an encapsulation material (4), and - singulating into a multiplicity of optoelectronic semiconductor components, wherein - the encapsulation material (4) terminates flush with the underside (21b) of each first contact element (21), said underside facing the auxiliary carrier (1), and - the encapsulation material (4) terminates flush with the underside (22b) of each second contact element (22), said underside facing the auxiliary carrier (1).

Abstract translation: 提供了一种方法，用于生产包括以下步骤光电子半导体器件的多重性：• - 提供辅助载体（1），• - 将导电的第一接触元件（21）和第二接触元件的多个阵列的（20）（22） 在辅助支架（1），• - 将在每种情况下一个光电半导体的每个组件（20）的第二接触元件（22）上芯片（3），• - 光电子半导体芯片的导电连接（3）与相应的第一接触元件（21） 组件（20），• - 涂覆第一接触元件（21）和所述第二接触元件（22）的包装材料（4），以及• - 分离成多个光电半导体部件的方法，其中• - 所述包装材料（4）与冲洗 面向底部的辅助载体（1）（21B）的每个第一接触元件（21）关闭，并且• - 订单 hüllungsmaterial（4）与所述辅助载体（1）齐平面对底部（22b）的每一个第二接触元件（22）关闭。

公开(公告)号：WO2011009677A3

公开(公告)日：2013-06-13

申请号：PCT/EP2010058084

申请日：2010-06-09

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  JAEGER HARALD ,  BRUNNER HERBERT ,  PREUSS STEPHAN

Inventor： JAEGER HARALD ,  BRUNNER HERBERT ,  PREUSS STEPHAN

IPC: B29C45/14 ,  H01L33/52 ,  H01L33/58

CPC classification number: H01L33/54 ,  B29C43/021 ,  B29C43/18 ,  B29C43/40 ,  B29C45/14639 ,  B29C45/14827 ,  B29L2011/00 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

Abstract: In at least one design form of the organic optoelectronic component (1) according to the invention, said component comprises a carrier (3) and at least one optoelectronic semiconductor chip (2) that is attached to the carrier (3). Furthermore, the optoelectronic component (1) comprises at least one optical element (45) that is likewise attached to the carrier (3). The optical element (45) has a base body (5) having a radiation-permeable form material. Said form material is a silicone, an epoxide or a silicone-epoxide hybrid material. Furthermore, the base body (5) is form-pressed, form-injected or form-cast. In addition, the optical element (45) comprises a film (4) that forms a bordering surface (7) of the optical element (45) that is turned away from the semiconductor chip (2). The film (4) is free of joining means and directly connected to the base body (5).

Abstract translation: 在光电子器件中的至少一个实施例中（1）包括所述安装在所述支撑件（3）一种载体（3）和至少一个光电子半导体芯片（2）。 此外，光电子器件（1）包括也安装在所述支撑件（3）至少一个光学元件（45）。 在这种情况下，光学元件（45）具有基体（5）与辐射可透过的模具材料。 在模制材料为硅树脂，环氧树脂或有机硅环氧树脂混合材料。 此外，基体（5）是压塑，注塑或模制。 此外，所述光学元件（45）包括膜（4），其形成面对从半导体芯片（2）中的边界表面（7）的光学元件（45）的。 所述膜（4）是与直接连接到所述基体（5）自由连接。