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公开(公告)号：US20120178260A1
公开(公告)日：2012-07-12
申请号：US13427184
申请日：2012-03-22
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rejendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rejendran , George Elias Zahr
IPC: H01L21/31
CPC classification number: H01L23/49894 , H01L2924/0002 , H01L2924/3011 , H05K1/0271 , H05K3/108 , H05K3/4661 , H05K2201/0209 , H05K2201/0269 , H05K2201/068 , Y10T29/49126 , Y10T29/49156 , Y10T29/49165 , Y10T428/24917 , Y10T428/25 , Y10T428/2998 , Y10T428/31515 , Y10T428/31518 , Y10T428/31529 , H01L2924/00
Abstract: Provided are processes for making multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film.
Abstract translation: 提供了制造包含不对称交联聚合物电介质膜的多层芯片载体的方法。
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公开(公告)号：US07658988B2
公开(公告)日：2010-02-09
申请号：US11732344
申请日：2007-04-03
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
IPC: B32B9/00
CPC classification number: H05K1/0373 , H01L23/145 , H01L23/49894 , H01L2224/16225 , H01L2224/16227 , H01L2924/10253 , H05K3/4661 , H05K2201/0209 , H05K2201/0257 , H05K2201/0266 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/252 , H01L2924/00
Abstract: Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compositions of the invention are well-suited for use in multi-layer printed circuit boards.
Abstract translation: 提供了由环氧组合物制备印刷电路的组合物和方法。 环氧组合物在未固化状态下表现出低粘度，并且在固化状态下表现出低的热膨胀系数。 本发明的低介电常数组合物非常适用于多层印刷电路板。
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公开(公告)号：US20070231469A1
公开(公告)日：2007-10-04
申请号：US11732344
申请日：2007-04-03
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
CPC classification number: H05K1/0373 , H01L23/145 , H01L23/49894 , H01L2224/16225 , H01L2224/16227 , H01L2924/10253 , H05K3/4661 , H05K2201/0209 , H05K2201/0257 , H05K2201/0266 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/252 , H01L2924/00
Abstract: Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compositions of the invention are well-suited for use in multi-layer printed circuit boards.
Abstract translation: 提供了由环氧组合物制备印刷电路的组合物和方法。 环氧组合物在未固化状态下表现出低粘度，并且在固化状态下表现出低的热膨胀系数。 本发明的低介电常数组合物非常适用于多层印刷电路板。
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14.发明授权Apparatus and process for stacking sheets of half-cell structure to make a honeycomb core 失效用于堆叠半电池结构的片材以制造蜂窝芯的装置和方法
公开(公告)号：US5340429A
公开(公告)日：1994-08-23
申请号：US797329
申请日：1991-11-25
Applicant: Joseph J. Duffy , Birol Kirayoglu , Pui-Yan Lin , Robert A. Marin , Robert J. Santucci
Inventor： Joseph J. Duffy , Birol Kirayoglu , Pui-Yan Lin , Robert A. Marin , Robert J. Santucci
CPC classification number: B31D3/0223 , B31F1/305 , B32B37/10 , Y10T156/1749 , Y10T428/24165
Abstract: The present invention relates to an apparatus and a process for a half-cell structure to make a hexagonal-cell honeycomb core. The structure has a plurality of peaks and valleys and a diagonal surface between each consecutive peak and valley. The apparatus comprises a stack holder for stacking the structure so that as one sheet is placed on top of a stack comprising at least one sheet, the peaks of one sheet contact the peaks of an adjacent sheet. The apparatus also comprises an air blower disposed beneath the top of the stack for reducing the air pressure surrounding the stack to a pressure below the air pressure on the top of the stack, thereby pressing the layers together to form the core.
Abstract translation: 本发明涉及一种用于制造六边形蜂窝状蜂窝芯的半单元结构的装置和方法。 该结构具有多个峰和谷以及每个连续的峰谷之间的对角线表面。 该装置包括用于堆叠结构的堆叠保持器，使得当一个片材被放置在包括至少一个片材的堆叠的顶部时，一个片材的峰部接触相邻片材的峰部。 该设备还包括设置在堆叠顶部下方的鼓风机，用于将堆叠周围的空气压力降低到低于堆叠顶部的空气压力的压力，从而将层压在一起形成芯体。
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公开(公告)号：US5137768A
公开(公告)日：1992-08-11
申请号：US552553
申请日：1990-07-16
Applicant: Pui-Yan Lin
Inventor： Pui-Yan Lin
CPC classification number: D21H17/52 , D21H13/26 , D21H17/48 , Y10S428/902 , Y10S493/966 , Y10T428/24149 , Y10T428/24165
Abstract: A light weight honeycomb structure is disclosed made from aramid fibers and exhibiting extremely high shear modulus.
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Patent Agency Ranking
公开(公告)号：US08484839B2
公开(公告)日：2013-07-16
申请号：US13427184
申请日：2012-03-22
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
CPC classification number: H01L23/49894 , H01L2924/0002 , H01L2924/3011 , H05K1/0271 , H05K3/108 , H05K3/4661 , H05K2201/0209 , H05K2201/0269 , H05K2201/068 , Y10T29/49126 , Y10T29/49156 , Y10T29/49165 , Y10T428/24917 , Y10T428/25 , Y10T428/2998 , Y10T428/31515 , Y10T428/31518 , Y10T428/31529 , H01L2924/00
Abstract: Provided are processes for making multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film.
Abstract translation: 提供了制造包含不对称交联聚合物电介质膜的多层芯片载体的方法。
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17.发明申请FILM PREPARED FROM A CASTING COMPOSITION COMPRISING A POLYMER AND SURFACE MODIFIED HEXAGONAL BORON NITRIDE PARTICLES 失效由包含聚合物和表面改性的六角形硼酸盐颗粒的铸造组合物制备的膜公开(公告)号：US20100291365A1
公开(公告)日：2010-11-18
申请号：US12465090
申请日：2009-05-13
Applicant: Pui-Yan Lin , Govindasamy Paramasivan Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivan Rajendran , George Elias Zahr
CPC classification number: C08K9/04 , B32B5/147 , B32B7/12 , B32B15/08 , B32B15/092 , B32B15/18 , B32B15/20 , B32B27/08 , B32B27/18 , B32B27/26 , B32B27/281 , B32B27/304 , B32B27/32 , B32B27/36 , B32B27/365 , B32B27/38 , B32B2264/10 , B32B2307/206 , B32B2307/302 , B32B2307/538 , B32B2379/00 , B32B2457/08 , C08J5/18 , C08J2363/00 , C08J2379/08 , H05K1/0373 , H05K1/0393 , H05K2201/0245
Abstract: Provided is a film having a thickness of less than 500 μm comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. The polymers can be polyimide or epoxy. A process for preparing the film by casting is provided.
Abstract translation: 提供具有小于500μm的厚度的膜，其包含聚合物和分散在其中的多个表面改性的六方氮化硼颗粒。 聚合物可以是聚酰亚胺或环氧树脂。 提供了一种通过铸造制备薄膜的方法。
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公开(公告)号：US20100065314A1
公开(公告)日：2010-03-18
申请号：US12256665
申请日：2008-10-23
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
CPC classification number: H01L23/49894 , H01L2924/0002 , H01L2924/3011 , H05K1/0271 , H05K3/108 , H05K3/4661 , H05K2201/0209 , H05K2201/0269 , H05K2201/068 , Y10T29/49126 , Y10T29/49156 , Y10T29/49165 , Y10T428/24917 , Y10T428/25 , Y10T428/2998 , Y10T428/31515 , Y10T428/31518 , Y10T428/31529 , H01L2924/00
Abstract: Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers.
Abstract translation: 提供了包括不对称交联聚合物电介质膜的多层芯片载体，以及用于制造芯片载体的工艺。
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公开(公告)号：US20090110909A1
公开(公告)日：2009-04-30
申请号：US12256662
申请日：2008-10-23
Applicant: Jeffrey Glenn Innocenzo , Pui-Yan Lin , Richard C. Oliver , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Jeffrey Glenn Innocenzo , Pui-Yan Lin , Richard C. Oliver , Govindasamy Paramasivam Rajendran , George Elias Zahr
CPC classification number: H05K3/4673 , H05K3/4652 , H05K3/4655 , H05K3/4661 , H05K2201/0209 , H05K2201/0269 , H05K2201/0358 , H05K2201/068 , Y10T428/25 , Y10T428/31511
Abstract: Cross-linked polymeric films suitable for use as a dielectric build-up layer in multi-layer chip carriers are provided. The films are suitable for use in any application using films that are dimensionally stable to temperature changes.
Abstract translation: 提供了适合用作多层芯片载体中的电介质堆积层的交联聚合物膜。 这些薄膜适用于使用尺寸稳定于温度变化的薄膜的任何应用。
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公开(公告)号：US20070231581A1
公开(公告)日：2007-10-04
申请号：US11732319
申请日：2007-04-03
Applicant: Pui-Yan Lin , Govindasamy Rajendran , George Zahr
Inventor： Pui-Yan Lin , Govindasamy Rajendran , George Zahr
IPC: B32B27/38 , B32B15/092 , C08L63/00 , B32B27/18
CPC classification number: C08G59/4223 , C08G59/3218 , H05K3/4661 , H05K3/4676 , Y10T428/31511 , Y10T428/31529
Abstract: Epoxy compositions that exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. The compositions are well-suited for use as dielectrics in electronics applications such as in multi-layer printed circuit boards, integrated circuit (IC) chip substrates, also known as IC chip carriers, and IC chip package interposers.
Abstract translation: 提供在固化状态下显示低粘度和固化状态下的低热膨胀系数的环氧组合物。 该组合物非常适合用作电子应用中的电介质，例如多层印刷电路板，也称为IC芯片载体的集成电路（IC）芯片基板和IC芯片封装内插器。
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